PCN # JAON-30NGKY659 CCB # 2733 Atmel Products Packing Pre and Post Changes

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Erika Hines
5 years ago
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1 PCN # JAON-30NGKY659 CCB # 2733 Atmel Products Packing Pre and Post Changes

2 2 Summary of Changes Items Changing Earliest Implementation Date Slide No/s. Part Aging November 1, Combination Rules November 1, Desiccant November 1, Humidity Indicator Card (HIC) November 1, Shipping Boxes November 1, Inner Label November 1, Outer Label November 1, MSL 1 packing procedure (tube and tape and reel only) November 1, 2016 NA

3 3 Part Aging Atmel may ship parts to customer as following Commercial: 36 months (3 years) old. Automotive: 12 months (1 year) old. Microchip may ship parts up to 48 months (4 years). Parts older than 24 months (2 years) old will be recertified prior to shipment. The requirement will be applied for both automotive and commercial. Reason: Material sets used to manufacture integrated circuits have shown no degradation in solderability, moisture sensitivity or reliability of products after 48 months. For more information related to Microchip s part aging strategy, please visit the following link on our website: Component Age Policy

4 Combination Rules Packing Media (Memory) (MCU) (RFA) POST CHANGE Tube 1 Date code. 1 Lot. 1 Assembly Site. 1 Test Site. Process Flow. MSL1: 1 Date code. 1 Lot. MSL3: 2 Lot. 1 Assembly site. 1 Die Revision. Process Flow. Different D/C combined within 52 weeks. Single Chip. 5 Lots. Multi Chips. No limit to number of production lots combination rule. No restriction on Assembly site. Different D/C combined within 52 weeks. 1 Date code. No limit to number of production lots combination rule. 1 Assembly Site. 1 Test Site. 1 Wire Material. No limit for Die Revision, Die ID, Fab Revision, Different D/C, and test flow. 4

5 Combination Rules Packing Media (Memory) (MCU) (RFA) POST CHANGE Tray 1 Date code. 1 Lot. 1 Assembly Site. 1 Test Site. Process Flow MSL1: 1 Date code. 1 Lot. MSL3: 2 Lot. 1 Assembly site. 1 Die Revision. Process Flow. Different D/C combined within 52 weeks. Single Chip. 5 Lots. Multi Chips. No limit to number of production lots combination rule. No restriction on Assembly site. Different D/C combined within 52 weeks. 3 Date codes. No limit to number of production lots combination rule. 1 Assembly Site 1 Test Site. 1 Wire Material. No limit for Die Revision, Die ID, Fab Revision, Different D/C, and test flow. 5

6 6 Combination Rules Packing Media (Memory) (MCU) (RFA) POST CHANGE Tape and Reel MSL1,2,3: 2 Date code. 2 Lots. 1 Assembly site. No restriction on test 1 Die Revision. Process Flow. Different D/C combined within 52 weeks. MSL1,3: 2 Lots. 1 Assembly site. 1 Die Revision. Process Flow. Different D/C combined within 52 weeks. Single Chip. 5 Lots. Multi Chips. No limit to number of production lots combination rule. No restriction on Assembly site. Different D/C combined within 52 weeks. 3 Date codes. No limit to number of production lots combination rule. 1 Assembly Site. 1 Test Site. 1 Wire Material. No limit for Die Revision, Die ID, Fab Revision, Different D/C, and test flow.