Release of Cu-wire bonding for the DHVQFN packages in ASEN and ATBK (phase 8)

Transcription

1 Final Product Change Notification Issue Date: 01-Sep-2017 Effective Date: 01-Dec-2017 Dear pcn system2, F01 Here's your personalized quality information concerning products Future Electronics purchased from Nexperia. For detailed information we invite you to view this notification online Management Summary - Replace Au (gold) wire with Cu (copper) wire in bonding process - Expansion of second source ASEN assembly Change Category Wafer Fab Process Wafer Fab Materials Wafer Fab Location Assembly Process Assembly Materials Assembly Location Product Marking Test Design Location Mechanical Specification Test Process Errata Packing/Shipping/Labeling Test Equipment Electrical spec./test coverage Release of Cu-wire bonding for the DHVQFN packages in ASEN and ATBK (phase 8) Details of this Change Release of additional types with Cu-wire bonding for the DHVQFN packages in ASEN and ATBK (phase 8) - Release Cu (copper) wire in bonding process - Assembly locations: ASEN (NXP-ASE JV Suzhou, China) and ATBK (NXP Semiconductors Assembly & Test Plant Bangkok, Thailand) - No change in datasheet, form, fit, function, quality or reliability anticipated - No change in ordering code 12NC's and product type number Remark: DHVQFN20 types assembled in ATBK were already released with Cu-wire bonding since 2015 and therefore only ASEN capacity expansion is applicable for this PCN Why do we Implement this Change - Capacity expansion to support increased demand and reduce lead time as announced in DHVQFN allocation letter - Next phase in Cu wire release after maturation in commodity Logic products since Continued alignment with world technology trends on state of the art production tools

2 - Copper wire shows enhanced mechanical properties - Increased environmental friendliness (eco-friendly) Identification of Affected Products - Assembly changes can be identified by backward traceability of the product marking date code - Applied assembly location (ASEN or ATBK) is indicated on the reel and box label Product Availability Sample Information Samples are available upon request Samples for selective types are available upon request from the Logic sample store Nijmegen The Netherlands Production Planned first shipment 01-Dec-2017 Impact no impact to the product's functionality anticipated. Data Sheet Revision No impact to existing datasheet Disposition of Old Products Existing inventory will be shipped until depleted Related Notifications Notification Issue Date Effective DateTitle F0109-Jan Apr-2015 Introduction of Cu-wire bonding for TSSOP5 and DHVQFN20 packages (Phase IV) F0114-Jul Oct-2017 Release of Cu-wire bonding for product type 74AVC8T245BQ in ASEN and ATBK F0114-Jul Oct-2017 Release of Cu-wire bonding for the DHVQFN packages in ASEN and ATBK Additional information Self qualification: view online Timing and Logistics Your acknowledgement of this change, conform JEDEC J-STD-046, is expected till 01-Oct Remarks Assembly location indicator suffix on reel label and product topside marking: "X"= ASEN (NXP-ASE JV Suzhou, China) "n"= ATBK (NXP Semiconductors Assembly & Test Plant Bangkok, Thailand) Contact and Support For all inquiries regarding the epcn tool application or access issues, please contact Nexperia "Global Quality Support Team". For all Quality Notification content inquiries, please contact your local Nexperia Sales Support team. For specific questions on this notice or the products affected please contact our specialist directly: Name Logic Customer Support address logic.helpdesk@nexperia.com

3 At Nexperia B.V. we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards. About Nexperia B.V. We at Nexperia are the efficiency semiconductor company. We deliver over 70 billion products a year and as such service thousands of global customers, both directly and through our extensive network of channel partners. We are at the heart of billions of electronic devices in the Automotive, Mobile, Industrial, Consumer, Computing, and Communication Infrastructure segments. Nexperia B.V. Jonkerbosplein AB Nijmegen, The Netherlands 2017 Nexperia. All rights reserved.

4 PCN F01 Release of Cu-wire bonding for DHVQFN packages in ATBK and ASEN (phase 8) Revision: 31 August 2017 Self Qualification Report Document Information Information Author Supplier Document Number Content Rob de Heus Nexperia PCN F01 Revision History Revision Date Description 31 August 2017 New document Contact Information For more information, please contact:

5 PCN F01 Release of Cu-wire bonding for DHVQFN packages in ATBK and ASEN (phase 8) Table of Contents 1. Subject Assy factory details ATBK ASEN Material and process details Wafer fab location and process Bond wire material / BOM Reliability test program Qualification strategy Qualification results Electrical and thermal performance Electrical performance Thermal performance Comparison of visual appearance Traceability Conclusion Legal Disclaimer... 5 PCN F01 All information provided in this document is subject to legal 2017 Nexperia B.V. / V1.3. Self Qualification Report Revision: 31 August 2017 Page 2 of 5

6 PCN F01 Release of Cu-wire bonding for DHVQFN packages in ATBK and ASEN (phase 8) 1. Subject This Self Qualification Report gives background information about the release of products with copper wire in ATBK, and the release of ASEN for capacity expansion to support increasing demand of DHVQFN packages. It provides details of the qualification results of the products to support PCN F Assy factory details 2.1 ATBK Assy & Test Plant Bangkok of NXP Manufacturing (Thailand) Co., Ltd. started operations in 1974, assembling and testing integrated circuits for export. Both management and a staff of over 3,600 employees have been, and still are, actively working on continuous quality improvement. The dedication to quality has resulted in the production of highest quality integrated circuits for the worldwide electronics market. Since 2012, more than 15 billion SO-TSSOP and DHVQFN products have been produced with copper wire. 2.2 ASEN Advanced Semiconductor Engineering Incorporated, the world s largest semiconductor assembly and test company, and NXP Semiconductors announced (February 2007) the completion of an assembly and test joint venture, the name of the new company is ASEN. Located in the Suzhou Industrial Park, Southern China, ASEN is strategically placed to serve the rapidly growing global semiconductor assembly and test market. Since 2012, high volume production of SO, TSSOP and QFN have been produced with copper wire. 3. Material and process details 3.1 Wafer fab location and process No change in wafer fab location and process technology. No change in die dimensions. (same dies) 3.2 Bond wire material / BOM Bond wire material of the released products will be copper (Cu) wire in combination with dark-green (halogen-free) mold compounds. Rough-treated NiPdAu leadframes are introduced to improve the adhesion between leadframe and molding compound and secure zero delamination requirements. A full comparison table with BOM details is embedded below. BOM_details_DHVQF N_ATBK+ASEN PCN F01 All information provided in this document is subject to legal 2017 Nexperia B.V. / V1.3. Self Qualification Report Revision: 31 August 2017 Page 3 of 5

7 PCN F01 Release of Cu-wire bonding for DHVQFN packages in ATBK and ASEN (phase 8) 4. Reliability test program In line with the Nexperia General Quality Specification, an extensive qualification program was performed to validate the Cu-wire assembly quality and reliability performance. (compliant to AEC-Q100 rev. H) 4.1 Qualification strategy Based on Nexperia General Quality Specification standards Nexperia have evaluated the proposed change and determined the reliability tests needed to demonstrate that form, fit, function, quality and reliability is unchanged. The reliability testing results are summarised in chapter 5. The qualification targets included, extended read points were included to show robustness. 5. Qualification results The qualification as reported in the summary embedded below was carried out to release the product types mentioned in PCN F01. ATBK DHVQFN qualification results ASEN DHVQFN qualification results 6. Electrical and thermal performance 6.1 Electrical performance Full electrical characterization over temperature range has been performed and passed. Electrical parameters remain unchanged and within the same distributions. The ESD performance remains unchanged. 6.2 Thermal performance No change in thermal performance. 7. Comparison of visual appearance There will be no change of visual appearance. 8. Traceability The product type name and the ordering code (12NC) will not change. After approval, the changed products can be identified by backward traceability of the product marking date code. 9. Conclusion Nexperia does not anticipate on any impact on fit, form, function, and reliability. PCN F01 All information provided in this document is subject to legal 2017 Nexperia B.V. / V1.3. Self Qualification Report Revision: 31 August 2017 Page 4 of 5

8 PCN F01 Release of Cu-wire bonding for DHVQFN packages in ATBK and ASEN (phase 8) 10. Legal Disclaimer All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. All information hereunder is per Nexperia s best knowledge. This document does not provide for any representation or warranty express or implied by Nexperia. PCN F01 All information provided in this document is subject to legal 2017 Nexperia B.V. / V1.3. Self Qualification Report Revision: 31 August 2017 Page 5 of 5

9 AFFECTED MPN 74CBTLV3126BQ,115 74CBTLV3125BQ,115 74AHCT125BQ,115 74LVC139BQ,115 74HC595BQ,115 74LVC08ABQ,115 74LVC2244ABQ,115 74AVC4TD245BQ,115 74AVC8T245BQ,118 74AVCH4T245BQ,115 74AVC4T245BQ,115 74AHC74BQ,115 74LVC06ABQ,115 74HC4053BQ,115 74HCT4052BQ,115 74CBTLV3861BQ,118 74CBTLV3245BQ,115 74CBTLV3244BQ,115 74CBTLV3257BQ,115 74HC02BQ,115 74HC4060BQ,115 74LVC4245ABQ,118 74AHC157BQ,115 74ALVC125BQ,115 74AHC86BQ,115 74AHCT244BQ,115 74HC4067BQ,118 74AVCH8T245BQ,118 74LV123BQ,115 74HC240BQ,115 74AHC594BQ,115 74AHCT594BQ,115 74HC4040BQX 74LVC163BQ,115 74HC154BQ,118 74HC273BQ,115 74AHCT14BQ,115 74HCT595BQ,115 74HC573BQ,115 74ALVC74BQ,115 74HC4052BQ,115 74HC4066BQ,115 74HC08BQ,115 74HC00BQ,115 74HC04BQ,115 74HCT04BQ,115

10 74LVC10ABQ,115 74LVC74ABQ,115 74HC14BQ,115 74LVC374ABQ,115 74VHC244BQ,115 74HCT165BQ,115 74HCT4851BQ,115 74LV4051BQ,115 74LVC594ABQ,115 74HC4851BQ,115 74LV164BQ,115 74AHC32BQ,115 74LVT125BQ,115 74LVC257ABQ,115 74LVC4066BQ,115 74AHC126BQ,115 74HC123BQ,115 74HCT4053BQ,115 74LVC373ABQ,115