Product Change Notification - KSRA-20KRVB706 (Printer Friendly)

Transcription

1 Product Change Notification - KSRA-20KRVB Mar CCB 2845: Initial No... Page 1 of 4 3/24/2017 English PRODUCTS APPLICATIONS DESIGN SUPPORT SAMPLE AND BUY ABOUT US CONTACT US more... Product Change Notification - KSRA-20KRVB706 (Printer Friendly) Date: 23 Mar 2017 Product Category: Notification subject: Notification text: Memory; Sigma - Delta A/D Converters; 8-bit PIC Microcontrollers CCB 2845: Initial Notice: Qualification of ASSH as an additional assembly site for selected products of 160K wafer technology available in 8L SOIC package using CuPdAu bond wire PCN Status: Initial notification. Microchip Parts Affected: Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and.xls). Description of Change: Qualification of ASSH as an additional assembly site for selected products of 160K wafer technology available in 8L SOIC package using palladium coated copper with gold flash (CuPdAu) bond wire. Pre Change: Assembled at ANAP and NSEB Assembly site Post Change: Assembled at ANAP, NSEB and ASSH Assembly site Pre and Post Change Summary: Pre Change Post Change

2 Product Change Notification - KSRA-20KRVB Mar CCB 2845: Initial No... Page 2 of 4 3/24/2017 Assembly Site ANAP NSEB ANAP NSEB ASSH Wire material Au Wire Au Wire Au Wire Au Wire CuPdAu Wire Die attach material D D EN4900G Molding compound material G600 G600 G600 G600 CEL- 9240HF10AK Lead frame material C194 C194 C194 C194 C194 Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve productivity by qualifying ASSH assembly site. Change Implementation Status: In Progress Estimated Qualification Completion Date: May 2017 Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts. Time Table Summary: March > May 2017

3 Product Change Notification - KSRA-20KRVB Mar CCB 2845: Initial No... Page 3 of 4 3/24/2017 Workweek Initial PCN Issue Date X Qual Report Availability Final PCN Issue Date X X Method to Identify Change: Traceability code Qualification Plan: Please open the attachments included with this PCN labeled as PCN_#_Qual Plan. Revision History: March 23, 2017: Issued initial notification. The change described in this PCN does not alter Microchip s current regulatory compliance regarding the material content of the applicable products. Attachment(s): PCN_KSRA-20KRVB706_Affected CPN.pdf PCN_KSRA-20KRVB706_Qual Plan.pdf PCN_KSRA-20KRVB706_Affected CPN.xlsx Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at sign into mymicrochip to open the mymicrochip home page, then select a profile option from the left navigation bar. To opt out of future offer or information s (other than product change

4 Product Change Notification - KSRA-20KRVB Mar CCB 2845: Initial No... Page 4 of 4 3/24/2017 notification s), click here to go to microchipdirect and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services." Products Applications Design Support Training Sample And Buy About Us Contact Us Legal Investors Careers Support Copyright Microchip Technology Inc. All rights reserved.

5 KSRA-20KRVB706-CCB 2845: Initial Notice: Qualification of ASSH as an additional assembly site for selected products of 160K wafer technology available in 8L SOIC package using CuPdAu bond wire Affected Catalog Part Number (CPN) PCN_KSRA-20KRVB706 Catalog Part Number 24AA128-I/SN 24AA128T-I/SN 24AA128T-I/SNRVF 24FC128-E/SN 24FC128-I/SN 24FC128T-E/SN 24FC128T-I/SN 24FC256-E/SN 24FC256-I/SN 24FC256T-E/SN 24FC256T-I/SN 25AA320A-I/SN 25AA320A-I/SNB22 25AA320AT-I/SN 25AA320AT-I/SNB22 25AA640A-E/SN 25AA640A-I/SN 25AA640AT-E/SN 25AA640AT-I/SN 25AA640AT-I/SNB23 25LC320A-E/SN 25LC320A-I/SN 25LC320AT-E/SN 25LC320AT-I/SN 25LC640A-E/SN 25LC640A-I/SN 25LC640AT-E/SN 25LC640AT-I/SN MCP E/SN MCP E/SN MCP3550T-50E/SN MCP3550T-60E/SN MCP3551-E/SN MCP3551T-E/SN MCP3553-E/SN MCP3553T-E/SN PIC12F635-E/SN PIC12F635-I/SN PIC12F635-I/SN057 PIC12F635T-I/SN PIC12F635T-I/SN037 PIC12F635T-I/SN041 PIC12F635T-I/SN043 Page 1 of 3

6 KSRA-20KRVB706-CCB 2845: Initial Notice: Qualification of ASSH as an additional assembly site for selected products of 160K wafer technology available in 8L SOIC package using CuPdAu bond wire Affected Catalog Part Number (CPN) PCN_KSRA-20KRVB706 Catalog Part Number PIC12F635T-I/SN046 PIC12F635T-I/SN047 PIC12F635T-I/SN050 PIC12F635T-I/SN058 PIC12F635T-I/SN066 PIC12F683-E/SN PIC12F683-E/SN083 PIC12F683-E/SN084 PIC12F683-I/SN PIC12F683-I/SN075 PIC12F683-I/SNAU PIC12F683T-E/SN PIC12F683T-E/SN029 PIC12F683T-E/SN030 PIC12F683T-E/SN035 PIC12F683T-E/SN040 PIC12F683T-E/SN042 PIC12F683T-E/SN077 PIC12F683T-E/SN079 PIC12F683T-E/SN083 PIC12F683T-E/SN084 PIC12F683T-E/SN092 PIC12F683T-E/SN097 PIC12F683T-E/SN098 PIC12F683T-I/SN PIC12F683T-I/SN061 PIC12F683T-I/SN062 PIC12F683T-I/SN072 PIC12F683T-I/SN091 PIC12F683T-I/SNAU PIC12F683-E/SN083 PIC12F683-E/SN084 PIC12F683-I/SN PIC12F683-I/SN075 PIC12F683-I/SNAU PIC12F683T-E/SN PIC12F683T-E/SN029 PIC12F683T-E/SN030 PIC12F683T-E/SN035 PIC12F683T-E/SN040 PIC12F683T-E/SN042 PIC12F683T-E/SN077 PIC12F683T-E/SN079 Page 2 of 3

7 KSRA-20KRVB706-CCB 2845: Initial Notice: Qualification of ASSH as an additional assembly site for selected products of 160K wafer technology available in 8L SOIC package using CuPdAu bond wire Affected Catalog Part Number (CPN) PCN_KSRA-20KRVB706 Catalog Part Number PIC12F683T-E/SN083 PIC12F683T-E/SN084 PIC12F683T-E/SN092 PIC12F683T-E/SN097 PIC12F683T-E/SN098 PIC12F683T-I/SN PIC12F683T-I/SN061 PIC12F683T-I/SN062 PIC12F683T-I/SN072 PIC12F683T-I/SN091 PIC12F683T-I/SNAU Page 3 of 3

8 QUALIFICATION PLAN SUMMARY PCN #: KSRA-20KRVB706 Date: January 12, 2017 Qualification of ASSH as an additional assembly site for selected products of 160K wafer technology available in 8L SOIC package using palladium coated copper with gold flash (CuPdAu) bond wire Microchip Technology (Thailand) Co., Ltd. 14 Moo 1 T. Wangtakien A. Muangchacherngsao, Chacherngsao, Thailand, Tel. (6638) , ext Fax (6638)

9 Purpose: Qualification of ASSH as an additional assembly site for selected products of 160K wafer technology available in 8L SOIC package using palladium coated copper with gold flash (CuPdAu) bond wire CCB No.: 2845 MP code: DE0244C2XB04 Part No.: PIC12F683-E/SN BD No: BDM Process/CUP 160K TLM Package Type/pin 8lSOIC Package Code C2X Die size: 80x88.7 MSL: 1 Subcon facility Package type/pin Package code Lead frame: Part number Paddle size: Material Leadframe Internal Plating (spot/ring/double ring) Treatment roughened/brown oxide(bot)/micro-etched/none Process (Etched/Stamped) Leadlock Strip dimension Strip size(row x column) Shipped Strip/Singulated Wire: Material Die Attach Epoxy: Part Number Conductive ASESH SOP 8L 150mil C2X LI-WSO x3.302 C194 Double Ring None stamped No 90x270 36x13 Singulated CuPdAu EN 4900G conductive

10 Mold Compound: Part Number Lead finish: Chemistry CEL-9240HF10AK PureTin

11 Test Name Conditions Reliability Stress Read Point -40 C to +125 C datasheet operating range (E Temp) Pre & Post Reliability Stress Test Temperature -40 C to +125 C datasheet operating range (E Temp) Sample Size Min. Qty of Spares per Lot (should be properly marked) Qty of Lots Total Units Fail Accept Qty Est. Dur. Days Test Site Special Instructions Standard Pbfree Solderability JESD22B-102E; Perform 8 hours of steam aging for Matte tin finish and 1 hour steam aging for NiPdAu finish prior to testing. Standard Pb-free: Matte tin/ NiPdAu finish, SAC solder, wetting temp 245 C for both SMD & through hole packages >95% lead coverage 5 Standard Pb-free solderability is the requirement. SnPb solderability (backward solderability- SMD reflow soldering) is required for any plating related changes and highly recommended for other package BOM changes. Backward Solderability Wire Bond Pull - WBP JESD22B-102E; Perform 8 hour steam aging for Matte tin finish and 1 hr steam aging for NiPdAu finish prior to testing. Backward: Matte tin/ NiPdAu finish, SnPb solder, wetting temp 215 C for SMD >95% lead coverage Mil. Std fails after TC 5 5 Wire Bond Pull - WBP Wire Bond Shear - WBS CDF-AEC-Q CDF-AEC-Q Physical Dimensions Measure per JESD22 B100 and B

12 Test Name Conditions Reliability Stress Read Point -40 C to +125 C datasheet operating range (E Temp) Pre & Post Reliability Stress Test Temperature -40 C to +125 C datasheet operating range (E Temp) Sample Size Min. Qty of Spares per Lot (should be properly marked) Qty of Lots Total Units Fail Accept Qty Est. Dur. Days Test Site Special Instructions External Visual Mil. Std /2010 All devices prior to submission for qualification testing 0 3 ALL 0 5 HTSL (High Temp Storage Life) Preconditionin g - Required for surface mount devices 'JESD22A C for 1008 or 175 o C for 504 hours. Read points at 1000 hours. Electrical test pre and post stress at +25 C and hot temp C Bake for 24 hours, moisture loading requirements per MSL level + 3X reflow at peak reflow temperature per Jedec-STD- 020D for package type. Perform SAM analysis using the standard sample size C HAST '+130 C/85% RH for 96hrs + 192hrs. Electrical test pre and post stress at +25 C and hot temp. 500hrs +25 C +125 C +25 C +125 o C 96 hrs/192hrs +25 C, +125 C Spares should be properly identified Spares should be properly identified. 77 parts from each lot to be used for HAST, Autoclave, Temp Cycle test Perform per the requirements in AEC-Q006. Spares should be properly identified. UHAST +130 C/85% RH for 96 /192hrs 130 C/85% RH for 96 /192hrs +25 C Spares should be properly identified. Use the parts which have gone through Pre-conditioning. Temp Cycle cond C -65 C to +150 C for 1000 Cycles... Electrical test pre and post stress at hot temp. Cond C: 500cycle -1X, 1000cycles-2X +25 C +125 C Perform per the requirements in AEC-Q006. Spares should be properly identified. Use the parts which have gone through Pre-conditioning.