Product Change Notification - JAON-14PIGR452 (Printer Friendly)

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1 Product Change Notification - JAON-14PIGR Dec CCB 2802 Initial Noti... Page 1 of 3 12/23/2016 English Search... PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT US CONTACT US mymicrochip Login Product Change Notification - JAON-14PIGR452 (Printer Friendly) Date: 22 Dec 2016 Product Category: Notification subject: Notification text: Ethernet PHYs CCB 2802 Initial Notice: Qualification of 48L LQFP (7x7mm) package with 120x120mils lead frame paddle size for selected Micrel products at TICP assembly site. PCN Status: Initial notification Microchip Parts Affected: Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and.xls). Description of Change: Qualification of 48L LQFP (7x7mm) package with 120x120mils lead frame paddle size for selected Micrel products at TICP assembly site. Pre Change: Using lead frame with 100x100mils lead frame paddle size Post Change: Using lead frame with 120x120mils lead frame paddle size Pre and Post Change Summary: Pre Change Post Change Assembly Site TICP TICP Wire material Ag wire Ag wire Die attach material EN4900 EN4900 Molding compound material CEL9200 CEL9200 Lead frame material C7025 C7025 Lead frame paddle size 100 x 100 mils 120 x 120 mils

2 Product Change Notification - JAON-14PIGR Dec CCB 2802 Initial Noti... Page 2 of 3 12/23/2016 Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve productivity by qualifying lead frame with 120x120mils lead frame paddle size. Change Implementation Status: In Progress Estimated Qualification Completion Date: April 2017 Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Time Table Summary: December > April 2017 Workweek Initial PCN Issue Date Qual Report Availability Final PCN Issue Date X X X Method to Identify Change: Traceability code Qualification Plan: Please open the attachments included with this PCN labeled as PCN_#_Qual Plan. Revision History: December 22, 2016: Issued initial notification. The change described in this PCN does not alter Microchip s current regulatory compliance regarding the material content of the applicable products. Attachment(s): PCN_JAON-14PIGR452_Qual Plan.pdf PCN_JAON-14PIGR452_Affected CPN.pdf PCN_JAON-14PIGR452_Affected CPN.xls

3 Product Change Notification - JAON-14PIGR Dec CCB 2802 Initial Noti... Page 3 of 3 12/23/2016 Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at sign into mymicrochip to open the mymicrochip home page, then select a profile option from the left navigation bar. To opt out of future offer or information s (other than product change notification s), click here to go to microchipdirect and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services." Products Applications Design Support Training Sample and Buy About Us Contact Us Legal Investors Careers Support Copyright Microchip Technology Inc. All rights reserved. Shanghai ICP Recordal No

4 JAON-14PIGR452 - CCB 2802 Initial Notice: Qualification of 48L LQFP (7x7mm) package with 120x120mils lead frame paddle size for selected Micrel products at TICP assembly site. Affected Catalog Part Numbers (CPN) PCN_JAON-14PIGR452 CATALOG_PART_NBR KSZ8081MLXCA KSZ8081MLXCA-TR KSZ8081MLXIA KSZ8081MLXIA-TR KSZ8091MLXCA KSZ8091MLXCA-TR KSZ8091MLXIA SPNY SPNY TR SPNY SPNY TR SPNZ SPNZ TR SPNZ SPNZ TR Page 1 of 1

5 QUALIFICATION PLAN PCN #: JAON-14PIGR452 Date November 30, 2016 Qualification of 48L LQFP (7x7mm) package with 120x120mils lead frame paddle size for selected Micrel products at TICP assembly site. Distribution Surasit P. Greg P A. Navarro Vassilis Wichai K. Fernando C Chaweng W. Gerry O Chalermpon P. Arnel M Mitch R Maitree Y Sunisa K Supakorn L Ponpitug Y Irina K Jeffrey J Marco Ho Rhoderick O Fannie Lin Microchip Technology (Thailand) Co., Ltd. 14 Moo 1 T. Wangtakien A. Muangchacherngsao, Chacherngsao, Thailand, Tel. (6638) , ext Fax (6638)

6 Purpose: MP code: Part No.: Qualification of 48L LQFP (7x7mm) package with 120x120mils lead frame paddle size for selected Micrel products at TICP assembly site. XKAA11CAAA01 KSZ8081MLXCA BD No: D003036a (leadframe pedestal changed 120x120) CCB No.: 2802 Lead frame: Part Number Paddle size: 120x120mil Material C7025 Leadframe internal plating (spot/ring/double ring) Spot plating Process (Etched/stamped) Stamped Leadlock (yes/no) No Strip size 45.7x215.5 mm Shipped Strip/Singulated Singulated Wire: Material Die Attach Epoxy: Part Number Conductive Mold Compound: Part Number Lead finish: Ag EN4900 Conductive glue CEL9200 Matte tin

7 Sample Size Min. Qty of Spares per Lot (should be properly marked) Qty of Lots Total Units Fail Accept Qty Est. Dur. Days Special Instructions Test Name Conditions Standard Pb-free Solderability JESD22B-102E; Perform 8 hour steam aging for Matte tin finish and 1 hour steam aging for NiPdAu finish prior to testing. Standard Pb-free: Matte tin/ NiPdAu finish, SAC solder, wetting temp 245 C for both SMD & through hole packages > 95% lead coverage 5 Standard Pb-free solderability is the requirement. SnPb solderability (backward solderability- SMD reflow soldering) is required for any plating related changes and highly recommended for other package BOM changes. Wire Bond Pull - Mil. Std fails after TC 5 30 bonds from a minimum of 5 devices. WBP Wire Bond Shear CDF-AEC-Q bonds from a minimum of 5 devices. - WBS Physical Measure per JESD22 B100 and B Dimensions External Visual Mil. Std /2010 All devices prior 0 3 ALL 0 5 to submission for qualification testing HTSL (High Temp Storage Life) +175 C for 504 hours or 150 C for 1008 hrs. Electrical test pre and post stress at +25 C Must be in progress at time of package release to production, but completion is not required for release to production Preconditioning - Required for surface mount devices +150 C Bake for 24 hours, moisture loading requirements per MSL level + 3X reflow at peak reflow temperature per Jedec-STD-020D for package type; Electrical test pre and post stress at +25 C. 260 C Spares should be properly identified. 77 parts from each lot to be used for HAST, Autoclave, Temp Cycle test. Unbiased HAST Temp Cycle +130 C/85% RH for 96 hrs. Electrical test pre and post stress at +25 C -65 C to +150 C for 500 cycles. Electrical test pre and post stress at 25 o C; 3 gram force WBP, on 5 devices from 1 lot, test following Temp Cycle stress Spares should be properly identified. Use the parts which have gone through Preconditioning Spares should be properly identified. Use the parts which have gone through Preconditioning.