Product Change Notification - JAON-07LFEV539 (Printer Friendly)

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1 Product Change Notification - JAON-07LFEV Nov CCB 2695 and Page 1 of 3 11/29/2016 English Search... PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT US CONTACT US mymicrochip Login Product Change Notification - JAON-07LFEV539 (Printer Friendly) Date: 28 Nov 2016 Product Category: Notification subject: Notification text: Analog (Linear & Mixed Signal) AND Interface CCB 2695 and Final Notice: Qualification of ANAC as an additional assembly site for selected products available in 56L VQFN and 64L QFN package using CRM-1085A die attach material. PCN Status: Final notification Microchip Parts Affected: Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and.xls). Description of Change: Qualification of ANAC as an additional assembly site for selected products available in 56L VQFN (7x7x0.9mm) and 64L QFN (9x9x0.9mm) package using CRM-1085A die attach material. Pre Change: Assembled at ASE assembly site Post Change: Assembled at ASE assembly site or ANAC assembly site Pre and Post Change Summary: Pre Change Post Change Assembly Site ASE assembly site ASE assembly site ANAC assem site Wire material Au or CuPdAu wire Au or CuPdAu wire CuPdAu w Die attach material EN-4900F EN-4900F CRM-1085 Molding compound material G631 G631 G631 Lead frame material C194 C194 C194

2 Product Change Notification - JAON-07LFEV Nov CCB 2695 and Page 2 of 3 11/29/2016 Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve productivity by qualifying ANAC as an additional assembly site. Change Implementation Status: In Progress Estimated First Ship Date: December 27, 2016 (date code: 1653) NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts Time Table Summary: July > November 2016 December 2016 Workweek Initial PCN Issue Date X Qual Report Availability X Final PCN Issue Date X Estimated Implementation Date X

3 Product Change Notification - JAON-07LFEV Nov CCB 2695 and Page 3 of 3 11/29/2016 Method to Identify Change: Traceability code Qualification Report: Please open the attachments included with this PCN labeled as PCN_#_Qual Report. Revision History: July 25, 2016: Issued initial notification. November 28, 2016: Issued final notification. Attached the qualification report. Provided estimated first ship date that will be on December 27, The change described in this PCN does not alter Microchip s current regulatory compliance regarding the material content of the applicable products. Attachment(s): PCN_JAON-07LFEV539_Qual Report.pdf PCN_JAON-07LFEV539_Affected CPN.pdf PCN_JAON-07LFEV539_Affected CPN.xls Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at sign into mymicrochip to open the mymicrochip home page, then select a profile option from the left navigation bar. To opt out of future offer or information s (other than product change notification s), click here to go to microchipdirect and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services." Products Applications Design Support Training Sample and Buy About Us Contact Us Legal Investors Careers Support Copyright Microchip Technology Inc. All rights reserved. Shanghai ICP Recordal No

4 JAON-07LFEV539 - CCB 2695 and Initial Notice: Qualification of ANAC as an additional assembly site for selected products available in 56L VQFN and 64L QFN package using CRM-1085A die attach material. Affected Catalog Part Numbers (CPN) PCN_JAON-07LFEV539 CATALOG_PART_NBR USB5734/MR USB5734/MRD01 USB5734-I/MR USB5734T/MR USB5734T/MRD01 USB5734T-I/MR USB5742/2G USB5742/2GX01 USB5742-I/2G USB5742-I/2GX01 USB5742T/2G USB5742T/2GC01 USB5742T/2GX01 USB5742T-I/2G USB5742T-I/2GX01 USB5744/2G USB5744/2GD01 USB5744-I/2G USB5744T/2G USB5744T/2GD01 USB5744T-I/2G Page 1 of 1

5 QUALIFICATION REPORT RELIABILITY LABORATORY PCN #: JAON-07LFEV539 Date: August 29, 2016 Qualification of ANAC as an additional assembly site for selected products available in 64L QFN (9x9x0.9mm) package using CRM-1085A die attach material. The 56L VQFN (7x7x0.9mm) package will qualify by similarity. Distribution: CORPORATE QA/RE CORPORATE PACKAGING SUPPLIER ENGINEERING

6 OBJECTIVE Qualification of ANAC as an additional assembly site for selected products available in 64L QFN (9x9x0.9mm) package using CRM-1085A die attach material. The 56L VQFN (7x7x0.9mm) package will qualify by similarity. QUAL ID QAR BD # BDE Rev-01 PART # STB041R4XAA0 (USB5734) CCB # 2695 PRODUCT INFORMATION PACKAGE TYPE QFN (SAWN) PACKAGE LEAD COUNT & SIZE 64, 9X9x0.9mm EXPOSED PAD SIZE 6.0 X 6.0mm TERMINAL PITCH 0.5mm PACKAGE CODE R4X DIE SIZE 2.95 X 3.235mm WAFER DIAMETER 12 Inch DIE THICKNESS 8 mils MANUFACTUR PART # USB5734 WAFER LOT PA3W85.00 WAFER MASK STB04 WAFER PROCESS 65nm Low-K FAB TSMC (TSD - FAB 14) CIRCUIT UNDER PAD YES

7 Material used in the Assembly: LEADFRAME PART NUMBER LEADFRAME MATERIAL C194 (ETCHED) LEADFRAME INTERNAL PLATING DOUBLE RING LEADFRAME SURFACE Cu ROUGHENED LEADLOCK YES DIE ATTACH EPOXY TYPE CRM1085A EPOXY CONDUCTIVE YES WIRE TYPE CuPdAu DOWNBOND YES MOLDING COMPOUND TYPE EMC-G631BQF LEAD FINISH PROCESS Matte Sn MARKING LASER

8 PACKAGE QUALIFICATION REPORT Manufacturing Information Assembly Lot No. Wafer Lot No. MARKING /Date Code ANAC PA3W85.00_ WAFER 25 / TC USB5734 A001 (e3) ATC-CN 1621SGU ANAC PA3W85.00_ WAFER 25 / TC USB5734 A001 (e3) ATC-CN 1621SGV ANAC PA3W85.00_ WAFER 25 / TC USB5734 A001 (e3) ATC-CN 1621SGW Result Pass Fail The 64L Sawn QFN (9x9X0.9mm) package using CuPdAu wire, assembled by ANAC Pass Reliability test per QCI This package was qualified the Moisture/Reflow Sensitivity Classification Level 3 at 260 C reflow temperature per IPC/JEDEC J-STD- 020D standard. Prepared By: Peter Boudouris Date: August 29, 2016 (Corporate Reliability & FA) Approved By: Vassilios Danginis Date: August 29, 2016 (Corporate Reliability & FA)

9 Test Number (Reference) PACKAGE QUALIFICATION REPORT Test Condition Standard/ Method Qty. (Acc.) Def/SS Result Remarks Moisture/Reflow Sensitivity Classification Test (At MSL Level 3) 30 C/ 60%RH Moisture Soak 192 hrs. ( IPC/JEDEC J-STD-020D) IPC/ JEDEC J-STD-020D 0/ 0/ 0/ Pass Pass Pass LOT 1 LOT 2 LOT 3 Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +25 C, +85 C JESD22- A113 (0) Lot 1 Good Devices Bake 125 C, 24hrs Moisture Soak 192 hrs. 3x Convection-Reflow 260 C Electrical Test : +25 C, +85 C Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +25 C, +85 C JESD22- A113 (0) Lot 2 Good Devices Bake 125 C, 24hrs Moisture Soak 192 hrs. 3x Convection-Reflow 260 C Electrical Test : +25 C, +85 C

10 Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +25 C, +85 C JESD22- A113 (0) Lot 3 Good Devices Bake 125 C, 24hrs Moisture Soak 192 hrs. 3x Convection-Reflow 260 C Electrical Test : +25 C, +85 C

11 Test Number (Reference) Temp Cycle Test Condition PACKAGE QUALIFICATION REPORT Stress Condition: C to +150 C, 500x, 1000x Standard/ Method Qty. (Acc.) Def/SS. Result Remarks JESD22-A Parts had been preconditioned at 260 C Electrical Test: +25 C / + 85 C 231 (0) 0/231 Pass 77 units / lot BHAST Stress Condition: +130 C/85%RH, 96hrs Electrical Test: +25 C / + 85 C JESD22-A (0) 231 0/231 Pass Parts had been pre-conditioned at 260 C units / lot uhast Stress Condition: +130 C/85%RH, 96hrs JESD22-A Parts had been pre-conditioned at 260 C Electrical Test: +25 C / + 85 C 231 (0) 0/231 Pass 77 units / lot High Temperature Storage Life Stress Condition: Bake +150 C, 400hrs, 1008hrs JESD22-A Parts had no preconditioned Electrical Test : +25 C / + 85 C 231 (0) 0/231 Pass 77 units / lot