Body. Please reference the attached Product Change Notification (PCN# ) which addresses the following:

Transcription

1 October 18, 2010 Subject: QFP Base Device Package Type Body Size PCI9080-3/G QFP 28X28 208L PCI9052/G QFP 28X28 160L PCI6152-xx33PC/G QFP 28X28 160L PCI6150-xx66PC/G QFP 28X28 208L Body BGA Base Device Package Type Size PEX8532-xx25BI/G HSBGA 35x35 680L PEX8524-xx25VBI/G HSBGA 35x35 680L PEX8516-xx25BI/G HSBGA 27x27 312L PEX8114-xx13BI G PBGA 17x17 256L PCI9656-xx66BI/G PBGA 27x27 272L PCI9056-xx66BI G PBGA 17x17 256L PCI6150-xx66BC G PBGA 17x17 256L PCI6540-xx13BI/G HSBGA 27x27 380L PCI6520-xx13BI/G HSBGA 27x27 380L PCI6466-xx66BI/G HSBGA 27x27 380L PCI6254-xx66BC/G PBGA 31X31 365L PCI6154-xx66BC/G PBGA 31X31 304L x denotes all die revisions Lead Count Ball Count Reference: PCN# Dear Valued Customer, Please reference the attached Product Change Notification (PCN# ) which addresses the following: 1) To notify you the following bill of materials (see below) standardization activities for QFP at ASE Malaysia. QFP Base Device QFP As Is To be All QFP Devices Die Attach ABLEBOND 8361J YIZBOND 8143 Epoxy All QFP Devices Mold Compound SUMITOMO G700LY, G600T HITACHI CEL9240HFA10AKQ All QFP Devices Lead Frame Low Density High Density Matrix PCI9052/G Wire bond Gold (Au) Copper (Cu)

2 2) To notify you the following bill of materials (see below) standardization activities for P/HSBGA at ASE Malaysia. BGA Base Device P/HSBGA As Is To be All BGA Devices Die Attach ABLEBOND 8510AA, 2000B ABLEBOND 2100A Epoxy All BGA Devices Mold Compound COOKSON SMTB-1LV KYOCERA KEG1250 LKDS KYOCERA KEG1250 LKDS SUMITOMO EME7730C All BGA Devices Heat Slug Epoxy DOW CORNING DC7920 ABLEBOND 2025D All BGA Devices Substrate Matrix Low Density High Density All BGA Devices Substrate HL832/(AUS 5 or AUS 303) HL832NX/ AUS 308 without G (Green Devices) material PCI9656-xx66BI/G Wire Gold (Au) Copper (Cu) PEX8532-xx25BI/G, PEX8524-xx25VBI/G Marking Ink Laser 3) To notify you the following package type (see below) standardization activities for PBGA to LBGA at ASE Malaysia. BGA Base Device Package Type As Is To be PCI9656-xx66BI/G 27x27 PBGA 272L PBGA LBGA PEX8114-xx13BI G 17x17 PBGA 256L PBGA LBGA PCI9056-xx66BI G 17x17 PBGA 256L PBGA LBGA PCI6150-xx66BC G 17x17 PBGA 256L PBGA LBGA The specific details, associated qualification data and implementation schedule are included in the PCN. The planned implementation date for this 90 day notification is January 18, 2011or unless an acceptance is granted by the customer for earlier advance release. Should you have any questions, please feel free to contact your local representative directly. Sincerely, Norbe Mendoza Quality Assurance and Reliability PLX Technology W. 870 Maude Avenue Sunnyvale, CA 94085

3 PRODUCT/PROCESS CHANGE NOTIFICATION (PCN) PCN # Date: October 18, 2010 Products Affected: MEANS OF DISTINGUISHING CHANGED DEVICES Top marking on devices will be changed from ink to laser marking (please refer to example of laser marking below) with first shipments available through transition by January 18, x denotes all revisions Note: The F and G marking are in reference to lead free and Green environmental compliance Date Effective: January 18, 2011 or earlier if accepted in advance by the customer Change in physical appearance on item 3 (PBGA vs. LBGA) illustrated below. Contact: Eugene Cabanban/Product Marketing or Norbe Mendoza /Quality and Reliability Phone: ECabanban ( ), NMendoza ( ) ecabanban@plxtech.com, norbe@plxtech.com Samples: Available upon request thru normal sales channels

4 DESCRIPTION AND PURPOSE OF CHANGE: This QFP and P/HSBGA BOM conversion activity, which will also incorporate the LBGA package change will further standardize the processes and improve productivity at our packages assembled supplier (ASEM). These are established and mature materials which will provide enhancement in design robustness, improving manufacturability, and performance. We will also conduct a reliability qualification plan for this change notice at ASE Malaysia. The ASE Group is a top tier, well established, and qualified high volume assembly and test subcontractor in the semiconductor industry. They are ISO9001:2008, TS16949, and ISO14001 certified as well as a Sony Green Partner. RELIABILITY/QUALIFICATION SUMMARY: 1) Below is the reliability qual. plan for ASE Malaysia. The reliability qualification results will be updated upon successful completion of the qualification tests per attached reliability test plan and available upon request. PLX will only proceed with each change upon successful completion of the tests identified. PCN_ _ASEM _BOM_Standardizatio CUSTOMER ACKNOWLEDGEMENT OF RECEIPT (optional): Please the acknowledgement below to qa@plxtech.com or request additional information. Please note: This PCN is intended to serve as a quality notification to our valued customers and is a part of our continuous quality improvement effort. This PCN does solicit our customer s approval. If PLX does not receive acknowledgement within 30 days of this notice, it will be assumed that this change is acceptable.

5 Customer: Name/Date: Address: Title: Phone# /Fax# : / Customer Comments: REC D. BY: DATE: