Promoting Competitiveness of Domestic Equipment

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1 为客户创造价值 Promoting Competitiveness of Domestic Equipment 宗润福 CEO of Kingsemi

2 Content 为客户创造价值 1. Outlook of Kingsemi 2. Ecosystem 3. Strategies and Roadmap - QC\Standard\Supply Chain - Technology Differentiation 4. FEOL Track 1

3 1. Outlook of Kingsemi 为客户创造价值 Products: Coater\developer, Single wafer etch\stripper\clean Location: Shenyang, 沈阳芯源 Installation base: 500 sets Niche market share: > 50%,LED Bump Net profit: > 10M /Year, IP: 276

4 Products & Customers 为客户创造价值 LED - Star type coater/developer Customer Inst. base Prod. type WLCSP > 50 Cot\Dev JCAP > 20 Cot\Dev\Etch\ Stripper SAN-AN > 20 Cot\Dev CETC 13th > 10 Cot\Dev Xintec TW > 10 Spray Cot Advanced Packaging Automatic spray coater Advanced Packaging - Automatic coater/developer FEOL Track Automatic coater/developer

5 2. Ecosystem:TRACK 200mm Track decades origin config price $ M JP 2C2D 300K A JP 2C2D 800K K CN 2C2D > 1M L JP 8C8D > 10M Positive competition? 正面竞争? Price > Used tool Performance << Imported new tool 4

6 Competition with Low Cost? Annual :10 Sets vs Sets? Key parts: Imported from JP USA Capital turnover :18 Months vs. 6 Months Low Profit Competition! Depending on sales, Not on govm + VC It s the commercial game, not just a purely tech or money game. 5

7 Just like 中国足球! 外训等 女足突破 外援 职业联赛 扩大足球人口 从娃娃抓起

8 Roadmap: Step-by-Step International frontiers, World advanced 前道 12 寸 FEOL 12 inch 前道 8 寸 FEOL 8 inch 先进封装 Advanced packaging 传统封装 Packaging 半导体照明 LED 太阳能电池 Solar cell

9 3. Strategies and Roadmap 尊重规律 承认差距 循序渐进 水到渠成 稳定压倒一切, 首先要用得住 : 手表 走必经之路, 没有捷径 + 弯道超车 质量管控 标准化 供应链建设 差异化发展 全面追赶 做细分市场老大 以农村包围城市 8

10 Solution: Standardization, Batch Manu 通过单元的定型设计和批量制造, 单元品质及制造效率大幅提高 ; 组装过程分步骤流水线作业, 线缆及配管提前下料, 大幅度提高效率 ; 分步骤组装, 专人按标准化指导文件施工, 产品一致性大幅度提高 ; 单元检验提前进行, 整机质量得到控制, 缩短检验整改时间 9

11 Solution:QC and Supply Chain 1 Supplier chain management Cost reduction can be realized: - Purchase in batch and directly from aboard; - Modularized design and process improvement; - Biding invitation and other measures. 2 Product sealed sample Product sealed sample sets up a standard to ensure the consistency of different suppliers. After implemented the sample sealing management, the acceptance rate is much improved and has reached record high ~100%. Supplier A product Sealed Sample Supplier B product 10

12 Driving Local Supply Chain

13 Customized Design: Nozzle Nozzle with single column Set of Two-fluid type nozzle Nozzle with hole array ( to reduce coating time ) Fan type nozzle Two-fluid type nozzle(smaller particles driven by nitrogen gas) Fan type nozzle Two-fluid type nozzle Nozzle with single column Nozzle with hole array 12

14 Differentiation ( 差异化发展 ): Software Process < hardware < software Making software perfect,co-optimizing process and software. Multi-unit,multi-robot controlled,complex and mature transport system. Multicomponent parallel control, each component independently run, Coordination work, Failure does not affect other parts work within components. New parts and function expansion can easily be integrated into the system. 13

15 Software Competitiveness: Modular Design, Multicomponent Parallel Control CS1 CS2 CS3 CS4 1 2 CSR 1 CPC8 CPC9 CPC1 CPC2 2 2 ADB1 ADB2 ADB3 SCR3 3 4 CR 1 1 SCR1 SCR2 LTB1 LTB2 LTB3 LTB4 LTB5 LTB6 LTB7 LTB8 LTB9 LTB SDC1 SDC2 SDC3 5 DR 9 SDC4 SDC5 8 CPC7 CPC6 AEB1 AEB2 AEB3 AEB4 AEB5 CPC3 CPC4 IFR 6 7 CPC5 14

16 Software Competitiveness: FA GEM300 E87 E90 E97 HOST Control order Operating parameters Networked control software between Tool and FA The underlying communica tion component Lin kco nx3 00 Data parsing process Lin ke CS Control order Operating parameters Tool GEM GEM E4E5E30 E37 EDA E120 E84 KingSEMI FA Range Configuration file parsing Log Management Recipe Management Alarm Management 15

17 Harvest: LED Track Up time: > 96% WPH: 190, 130% vs. Korea TW PR:30% cost reduction Market share: > 60% Price: 10% down Net profit: 10% up 16

18 Harvest: FEOL Track & High Throughput Advanced Packaging Tool FEOL Track FEOL Track for ø300mm standard silicon wafers ; KrF and OPL coating and developing process; Provided with FA. High Throughput Advanced Packaging Tool Double robots, Process chambers stacked vertically New type KS-C300 double robots,process chambers stacked vertically, Reduced footprint The highest configuration with 4 chambers,4 load ports, 21 plates; Greatly enhancing the throughput 17

19 4. FEOL Track:12000A Film Thickness Data A PR Uniformity 系列 1 系列 2 系列 3 系列 4 系列 5 系列 6 系列 7 系列 8 系列 A Data mean Rang STD mean STD Rang 18

20 E-Beam Litho Data, 40nm Overall progress Structure wafer tape-out E-Beam exposure Hard mask etching Oxide etching 25nm Line/75nm pitch 25nm Line/100nm pitch Polysilicon etching Design graphic E-Beam Process Condition E-Beam Resist:AR-N-7520 Thickness:40nm Dose:18 C/m2 Bias:10nm P75 L:S=1:2 P100 L:S=1:3 P150 L:S=1:5 19

21 Inline with ASML 193 nm Scanner Machine type ASML TWINSCAN AT1100B-URL Wafer Size 12 inch λ 193 nm CD 0.18um Single machine overlay 40nm Throughput [wafers/hour] 80 Projection rate 4:1 Particle Spec 0.2μm particle adder 20 counts

22 New Type Track IOT rising,200mm tool is still in a strong demand. Used 200mm scanner? 300mm WPH > 200 New type track + 300mm scanner; 国家科技重大专项 KrF tool ratio > 1/3 Item Content Design Throughput WPH > 200 Wafer Size Dimensions Configuration(Max) For Process 200mm/300mm L:6200W:2400H:3000 6B/6C/6T/12D KrF/I-line 21

23 生逢其时 死棋 活棋 妙棋 赢棋 传奇 感恩 : 蓬勃发展的市场大环境, 受益者 + 建设者 感恩客户给予的机会, 为客户创造价值 国家科技重大专项 大基金, 为国家争光 感恩产业链 合作伙伴, 共同发展 22