PCN Title: Qualification of Additional Bill of Materials (BOM), Fab Source, AT Site and Top Marking Change on Select Product

Transcription

1 DATE: 19 th Sept, 2018 PCN #: 2366 PCN Title: Qualification of Additional Bill of Materials (BOM), Fab Source, AT Site and Top Marking Change on Select Product Dear Customer: This is an announcement of change(s) to products that are currently being offered by Diodes Incorporated. We request that you acknowledge receipt of this notification within 30 days of the date of this PCN. If you require samples for evaluation purposes, please make a request within 30 days as well. Otherwise, samples may not be built prior to this change. Please refer to the implementation date of this change as it is stated in the attached PCN form. Please contact your local Diodes sales representative to acknowledge receipt of this PCN and for any sample requests. The changes announced in this PCN will not be implemented earlier than 90 days from the notification date stated in the attached PCN form. Previously agreed upon customer specific change process requirements or device specific requirements will be addressed separately. For questions or clarification regarding this PCN, please contact your local Diodes sales representative. Sincerely, Diodes Incorporated PCN Team Page 1 of 5 DIC-034 R3 Diodes Incorporated Rel Date: 2/10/2016

2 PRODUCT CHANGE NOTICE PCN-2366 REV 1 Notification Date: Implementation Date: Product Family: Change Type: PCN #: 19 th Sept, th Dec, 2018 Analog BOM, Fab Source, A/T Site and Top Marking Change TITLE Qualification of Additional Bill of Materials (BOM), Fab Source, A/T Site and Top Marking Change on Select Product 2366 DESCRIPTION OF CHANGE This PCN is being issued to notify customers that in order to ensure continuity of supply Diodes Incorporated has qualified additional bill of material (BOM), and an additional Diodes internal Fab source (SFAB2) located in Shanghai, China, as well as external FAB site (TPSCo) TowerJazz Panasonic Semiconductor Co., Ltd. located in Hokuriku region of Japan, an additional A/T site Tianshui Huatian Technology Co (TSHT) located in Gansu, China, and Top Marking updates to reflect Diodes brand/logo. Full electrical characterization and reliability testing has been completed on representative part numbers to ensure there is no change to product reliability, device functionality or electrical specifications in the device datasheet. See attached qualification / reliability report (embedded in this file). IMPACT No change in datasheet electrical parameters however, some devices will have different top marking as noted in Tables 7 & 8 below. Table 1 - Qualify Additional Fab Source (TPSCO) PRODUCTS AFFECTED Table 2 -Qualify Additional Diodes Internal Fab Source SFAB2 (Shanghai, China) and Top Marking Change on Select Product Table 3 - Top Marking Change Only on Select Product Table 4 - Qualify Additional Top Metal (NiPt60%) Composition (Current is Pt100%) and Top Marking Change Table 5 - Qualify Additional A/T Site (TSHT) Table 6 - Qualify Additional Mold Compound Table 7 - Top Marking by Packages SO-8, SOT26, SOIC-16 Table 8 - Top Marking by Packages TSSOP-8, MSOP-8, SOT25, SOT353 Manufacturer s Notice: WEB LINKS For More Information Contact: Data Sheet: DISCLAIMER Unless a Diodes Incorporated Sales representative is contacted in writing within 30 days of the posting of this notice, all changes described in this announcement are considered approved. Page 2 of 5 DIC-034 R3 Diodes Incorporated Rel Date: 2/10/2016

3 AL3050FDC-7 Table 1 - Qualify Additional Fab Source (TPSCO) Table 2 - Qualify Additional FAB Source (SFAB2) and Top Marking Change AP3041MTR-G1 HL3051MTR-G1 AP1681MTR-G1 Table 3 Top Marking Change Only Table 4 - Qualify Additional Top Metal (NiPt60%) Composition (Current is Pt100%) and Top Marking Change Table 5 - Qualify Additional A/T Site (TSHT) Table 6 - Qualify Additional Mold Compound Page 3 of 5 DIC-034 R3 Diodes Incorporated Rel Date: 2/10/2016

4 Table 7 Page 4 of 5 DIC-034 R3 Diodes Incorporated Rel Date: 2/10/2016

5 Table 8 Page 5 of 5 DIC-034 R3 Diodes Incorporated Rel Date: 2/10/2016

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15 Package Qualification Report Reliability By Design Qualification Description: The information contained herein represents proof of Reliability and Performance of the Package Series listed below in accordance with the Qualification Plan and test methods referenced in Section 7.0, after exposure to a variety of environments and mechanical events that occur during installation and operational lifetime of the product. Upon conclusion of the testing the product continued to operate within specification limits, demonstrating its capability of reliable operation throughout its lifetime. The purpose of this report is to present Qualification Test results of the referenced Package Series. The Pericom product data presented in this report qualifies the products manufactured in this package configuration, using the same bill of materials and assembled by the identified subcontractor location. The report describes the qualification test program, procedures utilized, criteria enforced (at the time of product validation), and specific result data obtained during the testing of three lots of semiconductors. The three lots consist of an equal number of units from different date codes, from the same production line and SubContractor to ensure manufacturing repeatability. Lot Background Information: Qual Vehicle: PI7C9X2G912GPANJE Supplier (Code): OSE (O) Pkg Type - Code: LBGA (NJ196) Outline Drawing: PD-2160 By Extension Pkg: NJA196 Pericom's Qualification Test Results: Stress Test Test Procedure Preconditioning JESD22-A113 MSL1 Test Conditions Qual Test Date: Die Attach Material: Wire Size & Material: Mold Compound: Leadframe Material: Lead Finish: Date Codes: Duration 27-Feb-2018 Ablestik mil PdCu EME-G760SW (ULA) BT Substrate - 4 layer Sn96.5/Ag3.0/Cu0.5 Balls 0.5mm diameter, 1.0mm pitch 731DEAA, 732DEAA, 733DEAA # of Lots Samples per Lot Results Pass/Fail NA / 0 CSAM J-STD-020 No delamination of Die Top, Wire bond, Down bond areas NA / 0 PreCon uhast JESD22-A C, RH 85%, 33.3 psia, 0V PreCon BHAST JESD22-A C, RH 85%, 33.3 psia, x.xv PreCon Temp Cycle JESD22-A C to +150 C 500 Cycles 96 hrs / hrs / cycles / 0-65 C to +150 C 500 Cycles 500 cycles / 0 HTSL (no PreCon) JESD22-A hrs, 0V, 150 C 500 hrs / hrs, 0V, 150 C 1000 hrs / 0 Physical Dimension JESD22-B100 Per Datasheeet NA / 0 External Visual Insp JESD22-B101 NA NA / 0 Solderability J-STD-020 JESD22-B102 Pb-Free Solder Dip 245 C NA / 0 Qualificaton by Extension Information: Where a product of interest is not sampled during this period, it is valid to use the reliability data of the particular process technology or package type family to which the part belongs. All parts within the same family are designed to the same rules, and manufacturing is controlled by SPC. Within a product family, a device can only be fabricated on one process technology/ option, and only assembled on one package type process. If there are any questions about this qualification, please contact Quality Support at: customerquestion@pericom.com Approval: Raul Aman, Director - Quality Assurance, Diodes Incorporated PH: FX: Barber Lane, Milpitas, CA U.S.A. PSC FORM FR (02/24/2017) page 1 of 2 OSE_NJ196_NJA196_MSL3_Cu

16 Date: 27-Feb-2018 PKG Type & Code: LBGA (NJ196) Assembler-Code: OSE (O) Qual Vehicle: PI7C9X2G912GPANJE By extension: Diodes/Pericom active devices using the Fab/Process at the time of the Qualification: NJ196 Part numbers NJA196 Part Numbers PI7C9X2G308GPANJEX PI7C9X2G606PRDNJAEX PI7C9X2G308GPNJEX PI7C9X2G808PRBNJAEX PI7C9X2G606PRANJEX PI7C9X2G808PRCNJAEX PI7C9X2G606PRBNJEX PI7C9X2G606PRCNJEX PI7C9X2G608GPANJEX PI7C9X2G608GPBNJEX PI7C9X2G608GPNJEX PI7C9X2G612GPANJEX PI7C9X2G612GPANJEX PI7C9X2G612GPBNJEX PI7C9X2G612GPBNJEX PI7C9X2G612GPCNJEX PI7C9X2G612GPNJEX PI7C9X2G612GPNJEX PI7C9X2G808PRANJEX PI7C9X2G808PRNJEX PI7C9X2G912GPANJEX PI7C9X2G912GPBNJEX PI7C9X2G912GPNJEX Appendix A page 2 of 2 OSE_NJ196_NJA196_MSL3_Cu