NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS

Transcription

1 Background Statement for SEMI Draft Document 4965A NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document. Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, patented technology is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Background Statement Since the use of 450 mm wafers in R&D and mass production is nearing, IC device manufacturers are moving to standardize their handling and storage. The tape frame and the cassette for tape frames have been used for a long time in the packaging process for cutting the wafer and die separation. So it will be a necessary jig in the 450 mm manufacturing process. The purpose of this standardization is to define the mechanical interface of the load port on the semiconductor manufacturing equipment, where the 450 mm tape frame cassette (450 TFC) can be loaded and unloaded. The Ballot will be adjudicated at the Japan Packaging committee meetings in SEMI Japan Office, Tokyo, Japan on 25 November between 14:00-17:30, If you have questions, please contact to 450 mm Assembly & Test Die Preparation Task Force; Akihito Kawai (DISCO Corporation) Tel Fax akihito@disco.co.jp Or contact SEMI Staff, Hiro fumi Kanno at hkanno@semi.org

2 SEMI Draft Document 4965A NEW STANDARD: MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS 1 Purpose 1.1 This standard is to define the mechanical interface of loading port on the semiconductor manufacturing equipment, where the 450 mm tape frame cassette (450 TFC) can be loaded and unloaded. By this definition, it enables interoperability of loading ports and carriers and it aims to promote the automation using 450 TFC. 2 Scope 2.1 The interface specification of this standard is driven by and intended to mate with a carrier compliant to the 450 mm tape frame cassette (450 TFC) and it applies to 450 TFC. 2.2 This standard is intended to specify only the mechanical interface between 450 TFC and the loading port. 2.3 Loading and unloading of 450 TFC is assumed to be done by semi-automated (PVG) or automated (AGV or OHT) handling. NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use. 3 Limitations 3.1 This standard does not intend to address manual loading or unloading of 450 TFC. 3.2 Since this 450 TFC is not supposed to have doors (like the FOUP), this standard does not intend to define the BOLTS interface. 3.3 Since the increased scaling of the 300 mm methods (KC and KCP interface) have not yet been demonstrated with the actual equipment, the users of this standard need sufficient prototyping and data gathering. 4 Referenced Standards and Documents 4.1 SEMI Standards SEMI G88 SPECIFICATION FOR TAPE FRAME FOR 450 mm WAFER NOTE 1: SEMI Standards Japan Packaging committee is developing a specification for the 450 mm tape frame cassette intended to be used in conjunction with this document. NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. Page 1 Doc. 4965A SEMI

3 5 Terminology 5.1 Abbreviations and Acronyms TFC Tape Frame Cassette for 450 mm wafer BP Bilateral Plane FP Facial Plane HP Horizontal Plane KC Kinematic Coupling KCP Kinematic Coupling Pin PGV Person Guided Vehicle AGV Automated Guided Vehicle OHT Overhead Hoist Transport TFRB Tape Frame Release Bar EB Equipment Boundary LB Load Boundary SME - Semconductor Manunufacturing Equipment 5.2 Definitions TFC used generally as a term only to identify the tape frame cassette used in fabs for 450 mm wafers plane a theoretical surface which has infinite width and length, zero thickness and zero curvature bilateral plane (BP) a vertical plane, defining x=0 of a system with theree orthogonal planes (HP, BP, FP), coincident with the nominal location of the rear primary KCP, and midway between the nominal locations of the front primary KCP facial plane (FP) a vertical plane, defining y=0 of a system with theree orthogonal planes (HP, BP, FP) horizontal plane (HP) - a horizontal plane, defining z=0 of a system with three orthgonal planes (HP, BP, FP), coincident with the nominal location of the uppermost points (tips) of the three kinematic coupling pins tape frame cassette a carrier that holds one or more tape frames tape frame the frame which uses the wafer tape and retains the wafer. It is used in dicing and die-bonding processes, as well as shipping and handling during these processes. (see SEMI G88) wafer tape an adhesive plastic tape which retains the wafer or separated die front (of carrier) the side that is facing to the equipment and allows the tape frame input and extraction rear (of carrier) the furthest side from the equipment TFRB a bar to release the tape frames. It unlocks automatically when the 450 TFC is placed on the load port of the equipment equipment boundary (EB) it is the plane which defines the boundary between the loadport and the SME, and also it is parallel to the FP. (see dimension y1) load boundary (LB) a plane parallel to the boundary between the load port and the fab aisle (see dimension y2) load height the distance from the horizontal plane to the fab floor. Page 2 Doc. 4965A SEMI

4 load port the interface location on a semiconductor manufacturing equipment, where a 450 TFC can be loaded and unloaded spacing individual spacing of load ports on semiconductor manufacturing equipment in the case where it has more than 2 load ports. It defines individual spacing of the bilateral planes. 6 Requirements 6.1 Dimension The dimension requirements for 450 TFC load port are shown in Figure 1 and Figure 2 and listed in Table Load Height The nominal load height of any load port in a fab is defined by dimension z2. A set of load ports must be adjustable at installation. 6.3 Aisle Clearance of Load Port No part of the load port shall protrude beyond the LB. See dimension y Clearance Above Load Port and below 450 TFC No part of the load port except those features intended for interaction with the carrier (e.g., KCP, Sensing Pad, TFRB) shall protrude above dimension z Horizontal Clearance for Overhead Transport To provide clearance for overhead carrier transport, the height of the equipment between the EB and the LB of the SME shall be lower than z1 and every part of OHT shall be higher than z Vertical Clearance for Carrier Delivery There shall be a vertical clearance (or chimney ) between the HP and the top of the SME to allow for carrier delivery. The front and rear of the chimney is defined by dimension y1 and the LB defined by dimension y2, the sides of the chimney are defined by x2. No part of the semiconductor manufacturing equipment can be in this chimney Volume for Fork-Lift Truck there needs to be a space for fork-lift handling between the LB and the EB (a space defined by x3 and z4). This area can be covered with a panel. 6.8 Docking Interface Placement Volume A load port must provide clearance for installation of a docking interface within the limits of a volume defined by y6 and z5. It extends over the full width of the SME. If no docking interface is installed, this placement volume may be covered by a panel. 6.9 Spacing Load ports adjustment to each other on the semiconductor manufacturing equipment must be located at a distance as defined by dimension x KCP A load port must have a set of three primary KCP as defined in the 450 mm carrier document TFRB Seating Area (option) The TFRB seating area is a fixed horizontal surface or area on the load port designed to interact with the TFRB on the carrier. When the carrier is placed on the load port the TFRB is released. This area is defined by x4, y4, y5, r1, z7. The TFRB seating area must not interfere with the lead-in functionality of the KC pins on the load port. 7 Related Document 7.1 SEMI Standards SEMI E154 MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT SEMI E158 MECHANICAL SPECIFICATION FOR FAB WAFER CARRIER USED TO TRANSPORT AND STORE 450 MM WAFERS (450 FOUP) AND KINEMATIC COUPLING. NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. Page 3 Doc. 4965A SEMI

5 Figure 1 Interface between Load Port and 450 TFC Carrier Delivery System Page 4 Doc. 4965A SEMI

6 Figure 2 TFRB Seating Area (Top View) Figure 3 TFRB Seating Area (Front View) Page 5 Doc. 4965A SEMI

7 Table 1 Dimension Requirements of the Load port for 450 TFC Symbol Figure Value Specified Datum Measured From Feature Measured To used x ±1 Bilateral plane of a load Bilateral plane of an adjacent load port port x BP Clearance of on both sides of the load port above the horizontal plane where no part of the semiconductor manufacturing equipment shall protrude x Left hand side edge of exclusion volume for forklift access under Right hand side edge of exclusion volume for forklift access under SME (symmetric about the bilateral plane) SME (symmetric about the bilateral plane) x ±1 BP Center of TFRB seating area (x5) 1 90 BP Clearance on both sides of the load port above the horizontal plane where no part of the semiconductor manufacturing equipment shall protrude y FP 450 equipment boundary y , -10 FP 450 load boundary (y3) 1 ( 30) 450 TFC Front View -EBy FP Rear of TFRB seating area (not including radius) y FP Front of TFRB seating area (not including radius) y Load boundary Front edge of placement volume for docking interface y ±0 FP Nominal location of the rear primary KCP z Floor Vertical boundary for SME between the equipment boundary and the load z mm (Nominal) with ±10 mm adjustability of load port or set of load ports HP boundary Floor z Floor Vertical boundary for OHT between the equipment boundary and the load boundary z HP Upper edge of volume below load port recommended to kept empty for forklift access to semiconductor manufacturing equipment z Floor Upper edge of placement volume for docking interface z6 1, 3 21 HP Encroachment of any non-interacting feature on the upper side of the load port towards the bottom of the 450 TFC z , -0 HP Top surface of TFRB seating area r1 2 R20 Center of TFRB seating area Extent of TFRB seating area Page 6 Doc. 4965A SEMI

8 NOTICE: SEMI makes no warranties or representations as to the suitability of the safety guidelines set forth herein for any particular application. The determination of the suitability of the safety guidelines is solely the responsibility of the user. Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. These safety guidelines are subject to change without notice. By publication of this safety guideline, (SEMI) takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this safety guideline. Users of this guideline are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility. Page 7 Doc. 4965A SEMI