PRODUCT FAMILY DATA SHEET

Transcription

1 CUSTOMER :. DATE : FEB 28, REV : REV PRODUCT FAMILY DATA SHEET W Ceramic PKG (H35C1) MODEL NAME : LEMWA33X70/75/80 Series (G2) RoHS Compliant

2 CONTENTS 1. Features Applications Outline Dimensions Absolute Maximum Ratings Electro-Optical Characteristics ~ 5 6. Flux Characteristics and Order Code ~ 7 7. Chromaticity Bins ~ Typical Characteristic Curves ~ Reliability Test Items and Conditions Packing and Labeling of Products ~ Cautions on Use ~ 29 Appendix / 32

3 1. Features - Lighting Color : White - Ceramic Type LED Package : (L x W x H) [Unit : mm] - Viewing Angle : Chip Material : InGaN - Soldering Method : Reflow Soldering - ESD Withstand Voltage : Up to 2kV According to JESD22-A RoHS Compliant 2. Applications - Interior and Exterior Illumination 3. Outline Dimensions ( Unit : mm ) Anode Mark Recommendable Soldering Pattern (for Reflow Soldering) Internal Circuit Cathode Anode Pad Configuration 1 Anode Pad 2 Thermal Pad 3 Cathode Pad The thermal pad is electrically isolated from the cathode and anode pads. Tolerance unless otherwise mentioned are ±0.13 mm 3 / 32

4 4. Absolute Maximum Ratings ( Ta = 25 ) Item Symbol Rating Unit Forward Current If 1500 ma Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +100 Junction Temperature Tj 150 Soldering Temperature ESD Classification JEDEC-J-STD-020D Class 2 (JESD22-A114) Operating the LED beyond the listed maximum ratings may affect device reliability and cause permanent damage. These or any other conditions beyond those indicated under recommended operating conditions are not implied. The exposure to the absolute maximum rated conditions may affect device reliability. The LEDs are not designed to be driven in reverse bias. 5. Electro - Optical Characteristics ( Ta = 25, If = 350mA ) Item Symbol CCT Min. Typ. Max. Unit Luminous Flux Φv 6500 (F) (154) (G) (154) (H) (153) (J) 139 (130) 154 (144) 164 (156) 3500 (K) (L) (M) Forward Voltage Vf All V Color Cx / Cy All Refer to Chromaticity Bins' - Viewing Angle 2Θ1/2 All deg Color Rendering Index (Ra) - F, G, H J 70 / K, L, M lm - Thermal Resistance, Junction to Solder Point Rth j-s All /W Typical Temperature Coefficient of Forward Voltage *1) ΔVf / ΔTj All mv/ These values are measured by the LG Innotek optical spectrum analyzer within the following tolerances. Luminous Flux (Φv) : ±7%, Forward Voltage (Vf) : ±0.1V, Color Value : ±0.005, CRI Value : ±2, The parentheses of 6500K, 5700K and 5000K are CRI 75 models, 4000K is CRI 80 model. 4 / 32

5 5. Electro - Optical Characteristics CCT CRI If (ma) Vf (V) Power (W) Φv (Im) lm/w 6500K (F) 5700K (G) 5000K (H) 6500K (F) 5700K (G) 5000K (H) 4000K (J) Φv values are for representative references only / 32

6 5. Electro - Optical Characteristics (Continued) CCT CRI If (ma) Vf (V) Power (W) Φv (Im) lm/w 3500K (K) 3000K (L) 2700K (M) Φv values are for representative references only / 32

7 6. Flux Characteristics and Order Code Color CRI CCT Cool 70 Cool 70 Cool 70 Cool 75 Cool 75 Cool (F) 5700 (G) 5000 (H) 6500 (F) 5700 (G) 5000 (H) 350mA [V] 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) Luminous Flux 350mA Order Code Bin Code Min. Max LEMWA33X70FX10x0 X6 (6) LEMWA33X70FX16x0 X7 (7) LEMWA33X70FX17x0 X8 (8) LEMWA33X70FX18x0 X9 (9) LEMWA33X70FX19x LEMWA33X70GX10x0 X6 (6) LEMWA33X70GX16x0 X7 (7) LEMWA33X70GX17x0 X8 (8) LEMWA33X70GX18x0 X9 (9) LEMWA33X70GX19x LEMWA33X70HX10x0 X6 (6) LEMWA33X70HX16x0 X7 (7) LEMWA33X70HX17x0 X8 (8) LEMWA33X70HX18x0 X9 (9) LEMWA33X70HX19x LEMWA33X75FX10x0 X6 (6) LEMWA33X75FX16x0 X7 (7) LEMWA33X75FX17x0 X8 (8) LEMWA33X75FX18x0 X9 (9) LEMWA33X75FX19x LEMWA33X75GX10x0 X6 (6) LEMWA33X75GX16x0 X7 (7) LEMWA33X75GX17x0 X8 (8) LEMWA33X75GX18x0 X9 (9) LEMWA33X75GX19x LEMWA33X75HX10x0 X6 (6) LEMWA33X75HX16x0 X7 (7) LEMWA33X75HX17x0 X8 (8) LEMWA33X75HX18x0 X9 (9) LEMWA33X75HX19x0 7 / 32

8 6. Flux Characteristics and Order Code (Continued) Color CRI CCT Neutral 70 Neutral 80 Warm 80 Warm 80 Warm (J) 4000 (J) 3500 (K) 3000 (L) 2700 (M) 350mA [V] 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) 2.8 ~ 2.9 (9) 2.9 ~ 3.0 (0) 3.0 ~ 3.1 (1) 3.1 ~ 3.2 (2) Luminous Flux 350mA Order Code Bin Code Min. Max LEMWA33X70JX30x0 X6 (6) LEMWA33X70JX36x0 X7 (7) LEMWA33X70JX37x0 X8 (8) LEMWA33X70JX38x LEMWA33X80JX30x0 X5 (5) LEMWA33X80JX35x0 X6 (6) LEMWA33X80JX36x0 X7 (7) LEMWA33X80JX37x LEMWA33X80KX30x0 X4 (4) LEMWA33X80KX34x0 X5 (5) LEMWA33X80KX35x0 X6 (6) LEMWA33X80KX36x LEMWA33X80LX30x0 X3 (3) LEMWA33X80LX33x0 X4 (4) LEMWA33X80LX34x0 X5 (5) LEMWA33X80LX35x LEMWA33X80MX30x0 X3 (3) LEMWA33X80MX33x0 X4 (4) LEMWA33X80MX34x0 X5 (5) LEMWA33X80MX35x0 8 / 32

9 CIE Y 7. Chromaticity Bins LG Innotek complies with the ANSI C78.377A standard for its chromaticity bin structure. For each ANSI quadrangle for the CCT range of 4500K to 6500K, LG Innotek provides 4 micro bins. CIE X Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y FC1 FC2 FC3 FC GC1 HC1 IC GC2 HC2 IC GC3 HC3 IC GC4 HC4 IC / 32

10 CIE Y 7. Chromaticity Bins (Continued) LG Innotek complies with the ANSI C78.377A standard for its chromaticity bin structure. For each ANSI quadrangle for the CCT range of 2700K to 4000K, LG Innotek provides 16 micro bins CIE X Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y J11 J12 J13 J K11 L11 M K12 L12 M K13 L13 M K14 L14 M / 32

11 7. Chromaticity Bins (Continued) Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y Bin CIE X CIE Y J21 J22 J23 J24 J31 J32 J33 J34 J41 J42 J43 J K21 L21 M K22 L22 M K23 L23 M K24 L24 M K31 L31 M K32 L32 M K33 L33 M K34 L34 M K41 L41 M K42 L42 M K43 L43 M K44 L44 M / 32

12 Relative Luminous Flux [%] Forward Current [ma] 8. Typical Characteristic Curves Forward Current vs. Forward Voltage 1500 Ta = Forward Voltage [V] Relative Luminous Flux vs. Forward Current 350 Ta = K 3000K Forward Current [ma] 5700K CCT data also applies to 5000K and 6500K CCTs and 3000K data also applies to 2700K, 3500K and 4000K CCTs. 12 / 32

13 Relative Spectral Power Distribution Relative Spectral Power Distribution 8. Typical Characteristic Curves Spectrum Ta = 25, If = 350mA 6500K (F) Ra 70 & Wavelength [nm] Ta = 25, If = 350mA K (G) Ra 70 & Wavelength [nm] 13 / 32

14 Relative Spectral Power Distribution Relative Spectral Power Distribution 8. Typical Characteristic Curves Spectrum 100 Ta = 25, If = 350mA 5000K (H) Ra 70 & Wavelength [nm] Ta = 25, If = 350mA K (J) Ra Wavelength [nm] 14 / 32

15 Relative Spectral Power Distribution Relative Spectral Power Distribution 8. Typical Characteristic Curves Spectrum Ta = 25, If = 350mA K (J) Ra Wavelength [nm] Ta = 25, If = 350mA K (K) Ra Wavelength [nm] 15 / 32

16 Relative Spectral Power Distribution Relative Spectral Power Distribution 8. Typical Characteristic Curves Spectrum Ta = 25, If = 350mA 3000K (L) Ra Wavelength [nm] Ta = 25, If = 350mA K (M) Ra Wavelength [nm] 16 / 32

17 ΔChromaticity Coordinate ΔChromaticity Coordinate 8. Typical Characteristic Curves Chromaticity Coordinate vs. Forward Current Cx Cy 5700K (G) Ta = Forward Current [ma] Ta = 25 Cx Cy 3000K (L) Forward Current [ma] 5700K CCT data also applies to 5000K and 6500K CCTs and 3000K data also applies to 2700K, 3500K and 4000K CCTs. 17 / 32

18 Relative Luminous Flux [%] 8. Typical Characteristic Curves Radiation Characteristics -30 X-X 0 30 Ta = 25, If = 350mA -30 Y-Y 0 Ta = 25, If = 350mA Cool X-X 0 30 Ta = 25, If = 350mA -30 Y-Y 0 Ta = 25, If = 350mA Warm Luminous Flux vs. Temperature If = 350mA 5700K 3000K Ambient Temperature [ ] 18 / 32

19 ΔChromaticity Coordinate ΔChromaticity Coordinate 8. Typical Characteristic Curves Chromaticity Coordinate vs. Temperature Cx Cy If = 350mA 5700K (G) Ambient Temperature [ ] If = 350mA Cx Cy 3000K (L) Ambient Temperature [ ] 5700K CCT data also applies to 5000K and 6500K CCTs and 3000K data also applies to 2700K, 3500K and 4000K CCTs. 19 / 32

20 Maximum Current [ma] ΔForward Voltage [V] 8. Typical Characteristic Curves Forward Voltage vs. Temperature 0.10 If = 350mA Ambient Temperature [ ] Derating Curve Rthj-a=10 /W Rthj-a=15 /W Rthj-a=20 /W Rthj-a=25 /W Ambient Temperature [ ] The ambient temperature values for each graph are obtained with LG Innotek equipment. 20 / 32

21 9. Reliability Test Items and Conditions 9-1. Failure Criteria Items Symbols Test Conditions Limits Min. Max. Forward Voltage Vf If = 350mA - Initial Value 1.3 Luminous Flux Φ V If = 350mA Initial Value Reliability Tests No Items Test Conditions Test Hours / Cycles 1 Steady-State Operation Ta = 25, If = 1,500 [ma] 1,000 Hours 2 Steady-State Operation under High Temperature / High Humidity Ta = 85, 85% RH, If = 1,000 [ma] 1,000 Hours 3 Steady-State Operation under High Temperature Ta = 85, If = 1,000 [ma] 1,000 Hours 4 Steady-State Operation under Low Temperature Ta = -40, If = 1,000 [ma] 1,000 Hours 5 Storage under High Temperature Ta = 100 1,000 Hours 6 Storage under Low Temperature Ta = -40 1,000 Hours 7 Temperature Cycling 8 Thermal Shock 9 10 Resistance to Soldering Heat (Reflow Soldering) Electrostatic Discharge Test Voltage 2kV (HBM) 11 Vibration -40 (30 min.) ~ 25 (5 min.) ~ 100 (30 min.) ~ 25 (5 min.) 100 (15 min.) ~ 25 (5 min.) ~ -40 (15 min.) Tsld = 260, 10 sec./ 2 times (Pre Treat. 30, 70% RH, 168hr) R1 V C S1 R2 D.U.T R1 : 10MΩ, R2 : 1.5kΩ, C : 100pF 100~2000~100Hz Sweep 4 min. 200m/s², 3 direction, 4 cycles 100 Cycles 100 Cycles 2 Times 3 Times 48 Minutes All samples are tested using LG Innotek Standard Metal PCB (25x25x1.6 mm 3 (L W H)) except MSL test. All samples must pass each test item and all test items must be satisfied. 21 / 32

22 10. Packing and Labeling of Product Taping Outline Dimensions Reel ( Unit : mm ) Packing Materials : - Reel : Conductive PS (Black) - Emboss Tape : Conductive PS (Black) - Cover Tape : Conductive PET Base Tape Polarity Direction in Pocket - Cathode + Anode Taping Arrangement (End) (Start) Unloaded Tape (Min. 200mm) Mounted with LED (1,000 pcs) Unloaded Tape (Min. 40mm) Leading Part (150 ~ 800mm) 22 / 32

23 10. Packing and Labeling of Product Packing Structures Reeled products are packed in a sealed-off and moisture-proof aluminum bag with desiccants (silica gel) and HIC (Humidity Indicator Card). A maximum of four aluminum bags are packed in an inner box and six inner boxes are packed in an outer box. Label A Vacuum Packing Label A HIC Silica gel Label A or B ( MES : A, NEDA : B) c Types Sizes (mm) a b c Inner Box Outer Box Tolerance : ±10 mm b a Label C c a b Box No. of Total Q ty 23 / 32

24 10. Packing and Labeling of Product MES Label Structure. Label A Specifying Lot ID, Model Name, MES ID, RANK, Q ty, Run No, Rack No. 40mm Lot ID : PPWS03R063M C11001-A003 Ver : 1.00 Model : LEMWA33X70GX1000 Q ty : 1000[pcs] MES ID : W470G Run No : G RANK : X8-GC1-1 Rack No : C-107 W470F=X8-GC1-1=1000=G =C-107 X3-FC1-1 P-J21-2 LG Innotek Co., Ltd. 80mm Run No. indication Code Manufacture Site Paju : 1 Huizhou : 9 Manufacture Year 2013 : : : : 1 Manufacture Month 1~9 : 1~9 10 : A 11 : B 12 : C Manufacture Date ( 01~31). Label C Specifying Customer, Date, Model Name, Quantity, Customer Part no, Outbox ID, LGIT Internal Model Name TH # ( 00 ~ 99 ) Serial No ( 00 ~ ZZ ) OutBox Customer mm LEMWA33X70GX1000/24000 HSO X8-GC1-1 = 1000 Box ID. indication 80mm Manufacture Site Paju : P Huizhou : H PKG Site PKG : S, P Box Inner Box : I Outer Box : O Year 2013 : : : : 1 Month 1~9 : 1~9 10 : A 11 : B 12 : C Date Serial No ( 01 ~ 31) ( 001 ~ 999 ) 24 / 32

25 10. Packing and Labeling of Product NEDA Label Structure Label A Specifying Manufacturing Part Number, Quantity, Bin Code, Lot, Date Code and Country of Origin Manuf Part Number (1P): LEMWA33X70GX10A0 Date Code(9D): mm Qty(Q): 1000 Bin Code: X8-GC1-1 Country of Origin (4L) CN Lot#(1T): PPWS03R063M LG Innotek 80mm Date Code(9D) Lot#(1T) LG Innotek Trace Code Year 01~99 Week 01~52 Label B Specifying Manufacturing Part Number, Quantity, Bin Code, Trans ID, Date Code, Country of Origin and Inner Box ID Manuf Part Number (1P): LEMWA33X70GX10A0 Date Code(9D): mm Qty(Q): 4000 Trans ID (K): IAP5X8 Country of Origin (4L) CN Bin Code: X8-GC1-1 INNER BOX ID: HSI LG Innotek 80mm 25 / 32

26 10. Packing and Labeling of Product NEDA Label Structure Label C Specifying Manufacturing Site, Customer Address, Manufacturing Part Number, Bin Code, Box ID, Trans ID and Quantity FROM: LG Innotek(HuiZhou)Co., Ltd TO: District 18,ZhongKai Hi-Tech Industry Development Zone, Huizhou,Guangdong, China Manuf Part Number (1P): LEMWA33X70GX10A0 Trans ID (K): IAP5X8 40mm Bin Code: X8-GC1-1 BOX ID: HSO Qty(Q): mm Box ID Indication Site Code Outbox Year Month Date Serial No Paju: P Huizhou: H S, P Outbox: O Inbox: I 12 : 2 13 : 3 14 : 4 15 : 5 1~9 : 1~9 10 : A 11 : B 12 : C ( 01 ~ 31) ( 001 ~ 999 ) 26 / 32

27 11. Cautions on Use Moisture-Proof Package -. The moisture in the SMD package may vaporize and expand during soldering. -. The moisture can damage the optical characteristics of the LEDs due to the encapsulation During Storage Conditions Temperature Humidity Time Storage Before Opening Aluminum Bag 5 ~ 30 < 50% RH Within 1 Year from the Delivery Date After Opening Aluminum Bag 5 ~ 30 < 60% RH 672 Hours Baking 65 ± 5 < 10%RH 10 ~ 24 Hours During Usage -. The LED should avoid direct contact with hazardous materials such as sulfur, chlorine, phthalate, etc. -. The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to corrosive gases must be avoided during operation and storage. -. Extreme environments such as sudden ambient temperature changes or high humidity that can cause condensation must be avoided Cleaning -. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as they may damage the resin of the LEDs. -. Isopropyl Alcohol (IPA) is the recommended solvent for cleaning the LEDs under the following conditions. Clearing Condition : IPA, 25 max. 60 sec max. -. Ultrasonic cleaning is not recommended. -. Pretests should be conducted with the actual cleaning process to validate that the process will not damage the LEDs. 27 / 32

28 11. Cautions on Use Thermal Management -. The thermal design of the end product must be thoroughly considered, particularly at the beginning of the system design process. -. The generation of heat is greatly impacted by the input power, the thermal resistance of the circuit boards and the density of the LED array combined with other components Static Electricity -. Wristbands and anti-electrostatic gloves are strongly recommended and all devices, equipment and machinery must be properly grounded when handling the LEDs, which are sensitive against static electricity and surge. -. Precautions are to be taken against surge voltage to the equipment that mounts the LEDs. -. Unusual characteristics such as significant increase of current leakage, decrease of turn-on voltage, or non-operation at a low current can occur when the LED is damaged Recommended Circuit -. The current through each LED must not exceed the absolute maximum rating when designing the circuits. -. In general, the LED forward voltages can vary. LEDs in parallel that have different forward voltages in combination with a single resistor can result in different forward currents to each LED, which can also output different luminous flux values. In the worst case, the currents can exceed the absolute maximum ratings which can stress the LEDs. Matrix circuit with a single resistor for each LED is recommended to avoid luminous flux fluctuations. L 1 L 2 L 3 RL 1 RL 2 RL 3 L 1 L 2 L 3 L 1 L 2 L 3 RL Fig.1 Recommended Circuit in Parallel Mode : Separate resistors must be used for each LED. -. The driving circuits must be designed to operate the LEDs by forward bias only. -. Reverse voltages can damage the zener diode, which can cause the LED to fail. -. A constant current LED driver is recommended to power the LEDs. Fig.2. Abnormal Circuit Circuits to Avoid: The current through the LEDs may vary due to the variation in LED forward voltage. 28 / 32

29 11. Cautions on Use Soldering Conditions -. Reflow soldering is the recommended method for assembling LEDs on a circuit board. -. LG Innotek does not guarantee the performance of the LEDs assembled by the dip soldering method. -. Recommended Soldering Profile (according to JEDEC J-STD-020D) Profile Feature Pb-Free Assembly Pb-Based Assembly Preheat/Soak Temperature Min(T smin ) Temperature Max(T smax ) Maximum time(t s ) from T smin to T smax ~120 seconds ~120 seconds Ramp-up rate (T L to T p ) 3 / second max. 3 / second max. Liquidous temperature (T L ) Time (t L ) maintained above T L 60~150 seconds 60~150 seconds Maximum peak package body temperature (T p ) Time(t p ) within 5 of the specified temperature (T c ) 30 seconds 20 seconds Ramp-down rate (T p to T L ) 6 /second max. 6 /second max. Maximum Time 25 to peak temperature 8 minutes max. 6 minutes max. -. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs although the recommended soldering conditions are specified in the above diagrams. -. A rapid cooling process is not recommended for the LEDs from the peak temperature. -. The silicone lens at the top of the LED package is a soft surface, which can easily be damaged by pressure. Precautions should be taken to avoid strong pressure on the silicone lens when leveraging the pick and place machines. -. Reflow soldering should not be done more than two times. 29 / 32

30 11. Cautions on Use Soldering Iron -. The recommended condition is less than 5 seconds at The time must be shorter for higher temperatures. (+10-1sec). -. The power dissipation of the soldering iron should be lower than 15W and the surface temperature of the device should be controlled at or under Eye Safety Guidelines -. Do not directly look at the light when the LEDs are on. -. Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with optical instruments Manual Handling -. Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the surface of the encapsulant. 30 / 32

31 Appendix. Package Nomenclature All LEDs are tested and sorted by color, luminous flux and forward voltage where every LED in a tube has only a single color bin, luminous flux bin and forward voltage bin. However, the forward voltage bin information is not captured in the part number nomenclature. A 16-digit part number is required when orders are placed. LG Innotek leverages the following part number nomenclature. Type LE = Light Emitting Diode Color RR = Red BB = Blue MW = Multi Mixing White MC = Multi Color PKG Type S = SMD Type M = Module Type A = Ceramic Type H = High Power SMD Type PKG Dimension Label Code 0 = MES A = NEDA Revision PKG Flux Bin Code Binning Min. Max. X2 (2) 107 lm 114 lm X3 (3) 114 lm 122 lm X4 (4) 122 lm 130 lm X5 (5) 130 lm 139 lm X6 (6) 139 lm 148 lm X7 (7) 148 lm 156 lm X8 (8) 156 lm 164 lm X9 (9) 164 lm 172 lm lm 172 lm Flux Bin Code CIE Bin Code 1 = 4 Bins 2 = 9 Bins 3 = 16 Bins Special Code CIE Bin Optical Bin (CRI) Optical Bin (Flux) 31 / 32

32 Datasheet MODEL LEMWA33X70,75,80 Series (G2) DOCUMENT No. - REG.DATE REV. No. 1.0 REV.DATE PAGE - Revision History Revision Date Contents Revision Remark Rev New Establishment Rev Changes Electro-Optical Characteristics Rev Adjustment of Electro-optical Characteristics, Flux Characteristics and Typical Characteristic Curve 32 / 32