SOLDER JOINT RELIABILITY TEST SUMMARY
|
|
- Esmond Barker
- 6 years ago
- Views:
Transcription
1 Project Number: SJR Tracking Code: TC0623-SEAF-SJR-1059 Requested by: Jeremy Wooldridge Date: 05/20/2008 Product Rev: D (SEAF), C (SEAM) Part #: SEAF S-10-2-A/ SEAM S-10-2-A SEAF S-10-1-A/ SEAM S-10-1-A SEAF S-10-2-A/ SEAM S-10-2-A Lot #: Tech: Troy Cook Eng: Dave Scopelliti Female/ Single Ended Array Male Qty to test: 96 Test Start: 10/23/2006 Test Completed: 04/23/2007 SOLDER JOINT RELIABILITY TEST SUMMARY Solder Joint Reliability Summary Report PART DESCRIPTION SEAF S-10-2-A mated with SEAM S-10-2-A SEAF S-10-1-A mated with SEAM S-10-1-A SEAF S-10-2-A mated with SEAM S-10-2-A Revision 02 1 of 18 7/21/2008
2 CERTIFICATION All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS l and ANSI/NCSL , as applicable. All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec. SCOPE To perform the following tests: Solder Joint Reliability and life expectancy predictions via Thermal Cycling of Tin- Silver-Copper (SAC) and Tin-Lead (SnPb). SAMPLES TESTED Three groups of SEAF/SEAM connectors were evaluated with stack heights of 7 or 10 mm: Group A: SAC, 7 mm stack (SEAF 5.0 mm + SEAM 2.0 mm) Group C: SAC, 10 mm stack (SEAF 6.5 mm + SEAM 3.5 mm) Group D: SnPb, 10 mm stack (SEAF 6.5 mm + SEAM 3.5 mm) RELIABILITY PROJECTIONS 1. Life expectancy is calculated for field service conditions of 25ºC to 45ºC and 25ºC to 55ºC cycles based on lower bound values of Weibull parameters. 2. Field use cycles are calculated at 6 (Cycles/Day) x (Days/Year) = Cycles/Year. TABLE 1a: Reliability projections under field use condition for Groups C & D (10mm mated pairs). Years to 0.01% Failed Condition: 25ºC to 45ºC, 6 cycles/day Group C SAC Group D SnPb 100+ years 99 years TABLE 1b: Reliability projections under field use condition for Groups C & D (10mm mated pairs). Years to 0.01% Failed Condition: 25ºC to 55ºC, 6 cycles/day Group C SAC Group D SnPb 56 years years Revision 02 2 of 18 7/21/2008
3 TABLE 2a: Reliability projections under field use condition for Group A (7mm mated pairs). Years to 0.01% Failed Condition: 25ºC to 45ºC, 6 cycles/day Group A SAC 100+ years TABLE 2b: Reliability projections under field use condition for Group A (7mm mated pairs). Years to 0.01% Failed Condition: 25ºC to 55ºC, 6 cycles/day Group A SAC 56 years Revision 02 3 of 18 7/21/2008
4 APPLICABLE DOCUMENTS Industry Standard: IPC-9701A Clech, J-P., "Acceleration factors and thermal cycling test efficiency for lead-free Sn-Ag-Cu assemblies", Proceedings, SMTA International Conference, Chicago, IL, Sept , 2005, pp Clech, J-P., "An obstacle-controlled creep model for Sn-Pb and Sn-based lead-free solders", Proceedings, SMTA International Conference, Chicago, IL, September 26-28, Clech, J-P., Review and Analysis of Lead-Free Solder Material Properties, NIST report, on-line version can be viewed under NIST's Metallurgy Division web site: Clech, J-P., Solder Reliability Solutions: a PC-based design-for-reliability tool, Proceedings, Surface Mount International Conference, Sept. 8-12, 1996, San Jose, CA, Vol. I, pp Also in Soldering and Surface Mount Technology, Wela Publications, British Isles, Vol. 9, No. 2, July 1997, pp Revision 02 4 of 18 7/21/2008
5 TEST SAMPLES AND PREPARATION Sample preparation was performed in accordance with paragraph and of IPC-9701A and the following test conditions: 1) All materials were manufactured in accordance with the applicable product specification. 2) All test samples were identified and encoded to maintain traceability throughout the test sequences. 3) All components were preconditioned prior to soldering at 125 C for 24 hours. 4) All test PCB s were preconditioned prior to soldering at 105 C for 24 hours. 5) All samples tested were preconditioned after soldering prior to testing at 100 C for 24 hours. 6) Samtec Test PCBs used: PCB TST-0X (IS410), IS410, inches thick, 6-layer with 70 Cu coverage on layers 2 and 4, 40% Cu coverage on layers 3 and 5. The pads are finished with Electroless Nickel Immersion Gold. TEST BOARD ASSEMBLY FIGURE 1: Soldering profile for SnPb samples. Revision 02 5 of 18 7/21/2008
6 FIGURE 2: Soldering profile for SAC samples. 1) SnPb samples used Kester HM531 Type 3 Solder Paste containing Sn63 Pb37, 90% metal, 325 mesh. 2) SAC samples used Kester R520A Type 3 Solder Paste containing Sn96.5 Ag3.0 Cu0.5, 89.5% metal, 325 mesh. 3) For both SnPb and SAC, stencil thickness was inches with aperture diameter of 0.04 inches. Revision 02 6 of 18 7/21/2008
7 THERMAL CYCLING: Thermal Cycling was performed in accordance with Table 4-1 of IPC-9701A and the following test conditions: 1) Thermal Limits: Low Temperature = 0 C +0/- 3 C; High Temperature = 100 C + 5/- 0 C 2) Dwell Time at Thermal Limits: Ten (10) minutes 3) Ramp Time to Thermal Limits: Ten (10) minutes FIGURE 3: Accelerated thermal cycling profile. Figure 3 above is a picture of a Thermotron 2 hour temperature graph. Thermocouples are placed in the air of the chamber and attached to PCB on 5 random samples. The solid line represents the chamber air temperature and the dotted line represents the temperature on a sample. Revision 02 7 of 18 7/21/2008
8 CONFIGURATION FIGURE 4: Groups A, C, & D consists of 32 mounted mated pair samples each. Group B was mounted but not tested. Signal routing is daisy-chained through all positions on each sample facilitating 100% contact monitoring. EVENT DETECTION: 1) Events are established in accordance with Paragraph of IPC-9701A and Table ) An event is defined as a Signal Interruption exceeding 1000 Ω lasting for greater than 200 nanoseconds. FAILURE CRITERIA: 1) Failures were established in accordance with Paragraph of IPC-9701A and Table 4-4 2) A failure was defined as 10 events within an elapsed time of 10% of the thermal cycles to the initial event. I.e. if the first event happens at cycle 1000, 9 more events need to happen by cycle ) Thermal Cycling was terminated when 62% of the product fails or 6000 cycles are completed. This test was stopped at 5929 cycles because the cooling compressor on the Thermotron chamber failed at that cycle. Revision 02 8 of 18 7/21/2008
9 FLOWCHART Thermal Cycling for SJR (0-100 degrees C) 32 mated assemblies 32 mated assemblies 32 mated assemblies TEST GROUP A (SE Array) GROUP C (SE Array) GROUP D (SE Array) STEP Lead-Free Paste Lead-Free Paste Leaded Paste IPC-9701A, 32 samples IPC-9701A, 32 samples IPC-9701A, 32 samples 10 Min Ramp 10 Min Ramp 10 Min Ramp 10 Min dwell at T-Limits 10 Min dwell at T-Limits 10 Min dwell at T-Limits 01 Etch ID# on each component Etch ID# on each component Etch ID# on each component 02 Component Conditioning Component Conditioning Component Conditioning 03 PCB Conditioning PCB Conditioning PCB Conditioning 04 Solder components to PCB's Solder components to PCB's Solder components to PCB's 05 Assembly Conditioning Assembly Conditioning Assembly Conditioning 06 X-Ray Analysis of Assemblies X-Ray Analysis of Assemblies X-Ray Analysis of Assemblies 07 Mate and # mated assemblies Mate and # mated assemblies Mate and # mated assemblies 08 Measure assembly resistance Measure assembly resistance Measure assembly resistance 09 Solder lead wires to assemblies Solder lead wires to assemblies Solder lead wires to assemblies 10 Orient samples in test chamber Orient samples in test chamber Orient samples in test chamber 11 Measure assembly resistance - through cable/connector Measure assembly resistance - through cable/connector Measure assembly resistance - through cable/connector 12 Begin thermal cycling Begin thermal cycling Begin thermal cycling 13 Start event detection Start event detection Start event detection 14 Cycle chamber 6000x Cycle chamber 6000x Cycle chamber 6000x 15 Measure assembly resistance - through cable/connector Measure assembly resistance - through cable/connector Measure assembly resistance - through cable/connector 16 Cross-Section Analysis of 3 samples from each group Cross-Section Analysis of 3 samples from each group Cross-Section Analysis of 3 samples from each group FIGURE 5: Flowchart for SJR test. Revision 02 9 of 18 7/21/2008
10 RESULTS Group A (SAC, 7 mm stack assemblies): Four failures out of 32 monitored daisy chains at 5929 test cycles Failure Percentage % Failure# Failure# Failure# Failure# The Weibull shape parameter was determined using the same β as for SnPb assembly, i.e. β = Characteristic life was then estimated from Weibull equation: % Fail at 1st failure = 1/32 = 1-exp[ -(6917 / α )^4.736 ] which gives α = 14,331. Group C (SAC, 10 mm stack assemblies): One failure out of 32 monitored daisy chains at 5929 test cycles Failure Percentage % Failure# Two-parameter Weibull analysis of failure cycles gives: Characteristic life: α = Cycles to 63.2% Failures = cycles Shape parameter (slope of Weibull distribution): β = Group D (SnPb, 10 mm stack assemblies): Two failure out of 32 monitored daisy chains at 5929 test cycles Failure Percentage % Failure# Failure# Two-parameter Weibull analysis of failure cycles gives: Characteristic life: α = Cycles to 63.2% Failures = cycles Shape parameter (slope of Weibull distribution): β = Revision of 18 7/21/2008
11 DETERMINING ACCELERATION FACTOR The acceleration factors were determined in Calculations for Solder Joint Reliability Summary Report, which is located in the same Mechanical Test Reports section as this report. MEASURED PATH RESISTANCES OF SAMPLES Group A Path Resistances, Ω Δ Passed Δ Failed Before Test Samples Samples Minimum Maximum Average St. Dev Group D Path Resistances, Ω Δ Passed Δ Failed Before Test Samples Samples Minimum Maximum Average St. Dev Group C Path Resistances, Ω Δ Passed Δ Failed Before Test Samples Samples Minimum Maximum Average St. Dev N/A FIGURE 7: Path resistances of daisy-chained samples through 18 ft. lead wires. Revision of 18 7/21/2008
12 CROSS SECTION ANALYSIS 1. Cross sectional metallographic evaluation was performed on all 3 groups of SJR samples. Revealing the microstructure of the solder joints depicts the cracks that caused failures in samples. 2. Cross sections were taken on: i. Group A: Three failure samples of SAC, 7 mm stack ii. Group C: One failure and two passing samples of SAC, 10 mm stack iii. Group D: Two failures and one passing sample of SnPb, 10 mm stack FIGURE 8: Sectioning pattern used for Metallographic Evaluation Revision of 18 7/21/2008
13 FIGURE 9: Photomicrograph showing failed solder joint of Sample #42, Row 1 (7mm Lead-free, failed) FIGURE 10: Photomicrograph showing failed solder joint of Sample #44, Row 1 (7mm Lead-free, failed) Revision of 18 7/21/2008
14 FIGURE 11: Photomicrograph showing failed solder joint of Sample #48, Row 1 (7mm Lead-free, failed) FIGURE 12: A partial crack showing on a passed solder joint of Sample #81, Row 1 (10mm Lead, passed) Revision of 18 7/21/2008
15 FIGURE 13: Photomicrograph showing on a failed solder joint of Sample #99, Row 1 (10mm Lead, failed) FIGURE 14: Photomicrograph showing on a failed solder joint of Sample #105, Row 1 (10mm Lead, failed) Revision of 18 7/21/2008
16 FIGURE 15: Photomicrograph showing a solder joint of Sample #123, Row 1 (10mm Lead-free, passed) FIGURE 16: Photomicrograph showing a solder joint of Sample #129, Row 1 (10mm Lead-free, failed) Revision of 18 7/21/2008
17 FIGURE 17: Photomicrograph showing a solder joint of Sample #148, Row 1 (10mm Lead-free, passed) Revision of 18 7/21/2008
18 Equipment #: MM-01 Description: Digital Multimeter Manufacturer: Fluke Model: 87 III Serial #: Accuracy: See Manual Last Cal: 06/14/07, Next Cal: 06/14/08 EQUIPMENT AND CALIBRATION SCHEDULES Equipment #: THC-02 Description: Temperature/Humidity Chamber Manufacturer: Thermotron Model: SE Serial #: Accuracy: See Manual Last Cal: 09/21/07, Next Cal: 09/21/08 Equipment #: ED-01 Description: STD Series Event Detector Manufacturer: Analysis Tech Model: 256 Serial #: Accuracy: See manual Last Cal: 06/18/07, Next Cal: 06/18/08 Revision of 18 7/21/2008
Solder Joint Reliability Summary Report PART DESCRIPTION. DPAM H-8-1 mated with DPAF H CERTIFICATION
Project Number: SJR Tracking Code: TC054-SJR-0604 Requested by: Jeremy Wooldridge Date: 1/21/2005 Product Rev: 4 Lot #: 12/24/04 Tech: Troy Cook Eng: Dave Scopelliti Qty to test: 64 Test Start: 03/15/2005
More informationSEAM ELEVATED 12 & 14 mm STACK HEIGHTS MATING/UNMATING TESTING UP TO 100 CYCLES 20 & 50 POSITION / 08 & 10 ROW
Project Number: Tracking Code: TC076 (1254-1257) Requested by: Greg Brown Date: 2/5/2007 Product Rev: F mated with SEAM-XX-07.0-S-XX-2-A Lot #: 1 Tech: Tori Meek Eng: Troy Cook Part description : SEAX
More informationDESIGN QUALIFICATION TEST REPORT. BCS\ TSM BCS-125-L-D-TE\TSM L-DV-A (10u" Gold) BCS-125-S-D-TE\TSM S-DV-A (30u" Gold)
Project Number: Design Qualification Test Report Requested by: Mark Shireman Date: 4/20/2012 Product Rev: N/A Lot #: N/A Tech: Troy Cook Eng: Eric Mings Qty to test: 16 Test Start: 03/15/2012 Test Completed:
More informationERX8 Durability Report
Project Number: Tracking Code: TC0725--1378 Requested by: Brian Vicich Date: 6/20/2007 Product Rev: Current Lot #: 1546388/143924 Tech: Tony Wagoner/Tori Meek Eng: Troy Cook Qty to test: 10 Test Start:
More informationSEAC DISCRETE TWINAX CABLE TYPE QUALIFICATION TEST REPORT SEAC/SEAF SEAC TU-TU-2/SEAF L-06-2-RA-LP-TR
Project Number: Design Qualification Test Report Tracking Code: 346584_Report_Rev_1 Requested by: Liam Parkes Date: 1/29/2015 Tech: Aaron Mckim Test Start: 8/15/2014 Test Completed: 1/19/2015 (Actual part
More informationRepresentative Sample, MMS-105 depicted. CCC Report PART DESCRIPTION MMS L-DV. Mated with TMM S-D-SM
Project Number: na Tracking Code: TC0332--0246 Requested by: Mark Shireman Date: 8/7/2003 Product Rev: N/A Lot #: N/A Tech: Troy Cook Eng: John Tozier Qty to test: 2 Test Start: 08/07/2003 Test Completed:
More informationEXTENDED LIFE PRODUCTS TEST REPORT PART DESCRIPTION CLT S-D-A/TMMH S-DV-A
Project Number: Requested by: Bryon Saylor Date: 3/31/2009 Product Rev: BD Lot #: 1/8/09 Tech: Rodney Riley, Gary Lomax, & Daniel Linton Eng: Troy Cook /TMMH Qty to test: 60 Test Start: 01/27/2009 Test
More informationPCIEC/PCIE PCIEC EC-EC-AP/PCIE F-D-RA
Project Number: Design Qualification Test Report Tracking Code: 346583 _Report_Rev_2 Requested by: Liam Parkes Date: 1/15/2015 Tech: Qty to test: 14 Test Start: 10/31/2014 Test Completed: 12/9/2014 (Actual
More informationQUALIFICATION TEST REPORT of STRAIN RELIEF OPTION FOR TCSD PART DESCRIPTION TCSD-20-SR
Project Number: Tracking Code: TC0819--1719 Requested by: John Reid Date:06/03/2008 Product Rev: 0 Part #: TCSD-120-SR Lot #: 5/5/2008 Tech: Eric Fox Eng: Troy Cook Qty to test: 30 Test Start: 05/05/2008
More informationVPSTP mated with VRDPC M-RA
Project Number: Tracking Code: TC0635--1151 Requested by: John Riley Date: 8/29/2006 Product Rev: 1 Lot #: 99999 Tech: Tony Wagoner Eng: Troy Cook Qty to test: 40 Test Start: 10/05/2006 Test Completed:
More informationSAMTEC POWER CHARACTERIZATION
Project Number: Tracking Code: _Rev4 Requested by: Bryon Saylor Date: 6/12/2013 Product Rev: J Part #: SFSD-30-28-S-3.25-D/TFC-130-01-L-D Lot #: 06/23/2008 Tech: Tony Wagoner Eng: Dave Scopelliti Part
More informationLLCR Durability and Gap Measurements (to 500 cycles) with Environmental Stresses Summary Report
Project Number: NA Tracking Code: TC0312--0104 Requested by: Jan Hrouda Date: 3/20/2003 Product Rev: A Lot #: Sample Tech: Troy Cook Eng: John Tozier Part description: 0.8 mm [0.031 ] Right Angled Edge
More informationMated with VRDPC M-RA
Project Number: Tracking Code: TC069--0956 Requested by: John Reid Date: 2/28/2006 Product Rev: 2 Lot #: 2/28/06 Tech: Troy Cook/Tony Wagoner Eng: Dave Scopelliti Qty to test: 42 Test Start: 08/10/2006
More informationUEC5/CARD UEC H-D-RA-1-A/Edge Card
Project Number: Design Qualification Test Report Tracking Code: 333693_Report_Rev_2 Requested by: Corey Rose Date: 12/24/2014 Tech: Craig Ryan Qty to test: 75 Test Start: 05/20/2014 Test Completed: 06/10/2014
More informationDVT PART DESCRIPTION EQDP TTR-STL-1
Project Number: NA Tracking Code: TC0412--0394 Requested by: John Reid Date: 3/17/2004 Product Rev: 0 Lot #: 03/17/04 Tech: TR & TC Eng: John Tozier Qty to test: 15 Test Start: 04/14/2004 Test Completed:
More informationPART DESCRIPTION MLE H-DV-A. Mated with FTMH H-DV-A
Project Number: Tracking Code: TC0838-ELP-1942 Requested by: Neal Patterson Date: 11/21/2008 Product Rev: na Lot #: na Tech: Gary Lomax & Rodney Riley Eng: Troy Cook Qty to test: 60 Test Start: 09/15/2008
More informationEXTENDED LIFE TEST REPORT PART DESCRIPTION ERX L-D-RA
Project Number: 23261 Tracking Code: TC0845--2076_ReportRev2 Requested by: Jim Hahn Date: 1/5/2009 Product Rev: See print Lot #: 1 Tech: Gary Lomax & Rodney Riley Eng: Troy Cook Qty to test: 8 Test Start:
More informationSAMTEC POWER CHARACTERIZATION
Project Number: Tracking Code: Power Report Rev 3 Requested by: Eric Mings Date: 5/29/2013 Product Rev: AE Part #: MMSD-25-20-L-12.00-D-K-LUS Tech: Tony Wagoner Eng: Eric Mings Part description: 0.100[0.254]
More informationDesign Qualification Test Report SMP-J/SMP-P SMP-J-B-GF-ST-1450\ SMP-P(F/L/S/C)-P-GF-ST-TH2
Project Number: Design Qualification Test Report Tracking Code: 164934_Report_Rev_1 Requested by: John Liao Date: 8/25/2012 Product Rev: 0 Lot #: N/A Tech: Peter Chen Eng: Vico Zhao Qty to test: 32 Test
More informationQTE/QSE QSE F-D-A-L/QTE F-D-A-L QSE F-D-A-L/QTE F-D-A-L
Project Number: Supplemental Test Report Tracking Code: TC1021--3401_Report_Rev_2 Requested by: Ben Cooper Date: 9/10/2010 Product Rev: 0 Lot #: na Tech: Gary Lomax Eng: Eric Mings Qty to test: 30 Test
More informationQUALIFYING STRAIN RELIEF EXTENSION OF TCMD PART DESCRIPTION TCMD-120-SR
Project Number: Tracking Code: TC0819--1718 Requested by: John Reid Date:06/03/2008 Product Rev: 0 Lot #: 5/5/2008 Tech: Eric Fox Eng: Troy Cook Qty to test: 30 Test Start: 05/05/2008 Test Completed: 5/27/2008
More informationMated with IPBT-110-H1-T-S
Project Number: Requested by: Brandon Harpenau Date: 2/17/2006 Product Rev: 1 Lot #: 0 Tech: Troy Cook/ Tony Wagoner Eng: Dave Scopelliti Qty to test: 50 Test Start: 03/17/2006 Test Completed: 4/20/2006
More informationDESIGN VERIFICATION TEST REPORT ERCDA SS-TD-TU. Mated with ERF L-DV-L
Project Number: Tracking Code: TC0810--1621 Requested by: John Riley Date: 05/27/2008 Product Rev: 0 Part #: ERCDA-25-09.00-1SS-TD-TU Lot #: N/A Tech: Eric Fox & Daniel Borgelt Eng: Troy Cook Qty to test:
More informationDVT PART DESCRIPTION HQCD STR-TEU-1
Project Number: NA Tracking Code: TC043--0347 Requested by: John Reid Date: 1/13/2004 Product Rev: 4 Lot #: 1/13/2004 Tech: T. Receveur Eng: J. Tozier Qty to test: 55 Test Start: 3/29/2004 Test Completed:
More informationPhase B DVT testing PART DESCRIPTION EQCD DV-EM
Project Number: NA Tracking Code: TC0345--0309 Requested by: John Reid Date: 11/4/2003 Product Rev: 5 Lot #: 11/4/2003 Tech: TC & TR Eng: John Tozier Qty to test: 50 Test Start: 01/21/2004 Test Completed:
More informationDESIGN QUALIFICATION TEST REPORT ZA1/PCB ZA Z-10/ MATING PCB
Project Number: Design Qualification Test Report Tracking Code: 490100_Report_Rev_2 Requested by: Joe Smallwood Date: 5/6/2015 Part #: ZA1-30-02-1.00-Z-10/ MATING PCB Tech: Aaron McKim Test Start: 02/20/2015
More informationMEC6-XX-02-XX-D-RA1 DVT Test Report
Project Number: Tracking Code: TC069--0954 Requested by: Richie Gimmel Date: 2/27/2006 Product Rev: 2/27/06 Lot #: 2/27/06 Tech: Troy Cook Eng: Dave Scopelliti Qty to test: 50 Test Start: 03/08/2005 Test
More informationDVT Report PART DESCRIPTION SAL S-S-A
Project Number: na Tracking Code: TC427--481 Requested by: John Reid Date: 7/2/24 Product Rev: 3 Lot #: 7/2/24 Tech: Troy Cook Eng: John Tozier Qty to test: 5 Test Start: 9/8/24 Test Completed: 2/1/25
More informationCCC PART DESCRIPTION. CLT Mated with TMM
Project Number: Customer Requested by: Mark Shireman Date: 12/9/2003 Product Rev: Current Lot #: Stock Tech: Troy Cook Eng: John Tozier Part description: CLT-150-02-L-D/TMM-150-01-S-D-SM Qty to test: 3
More informationPhase B DVT testing PART DESCRIPTION. EQCD -DV to DV, phase B DVT testing. Mated with QTE
Project Number: Tracking Code: TC0345--0308 Requested by: John Reid Date: 11/4/2003 Product Rev: 5 Lot #: 11/4/03 Tech: TC & TR Eng: John Tozier Qty to test: 50 Test Start: 01/21/2004 Test Completed: 3/2/2004
More informationDVT PART DESCRIPTION HHSC TD-SE
Project Number: NA Requested by: John Reid Date: 11/4/2003 Product Rev: 3 Lot #: 11/5/03 Tech: TC & TR Eng: John Tozier Qty to test: 50 Test Start: 01/21/2004 Test Completed: 3/2/2004 DVT PART DESCRIPTION
More informationDesign Verification Test Report PART DESCRIPTION SEAC TU-TU
Project Number: Design Verification Test Tracking Code: TC0841 2024_Report Rev 2 Requested by: Kevin Meredith Date: 7/22/2009 Product Rev: 0 Lot #: 0 Tech: Rodney Riley Gary Lomax Troy Cook Qty to test:
More information1000 Cycle Mechanical Durability Summary Report PART DESCRIPTION QSS L-D-RA /QTS L-D-RA
Project Number: NA Tracking Code: TC0328--0236 Requested by: Mark Shireman Date: 7/8/2003 Product Rev: current Lot #: 589082 Tech: Troy Cook Eng: John Tozier Qty to test: 15 Test Start: 07/16/2003 Test
More informationSMA/RF316 SMA-J-P-H-ST-EM3/RF316-01SP1-01SP1-0700
Project Number: Design Qualification Test Report Tracking Code: 116049_Report_Rev_3 Requested by: John Liao Date: 6/23/2011 Product Rev: 0 Part #:SMA-J-P-H-ST-EM3/RF316-01SP1-01SP1-0700 Lot #: N/A Tech:
More informationERF8/ERM8 ERF L-DV-TR/ERM L-DV-TR
Project Number: Design Qualification Test Report Tracking Code: 284642_Report_Rev_1 Requested by: Catie Eichhorn Date: 12/17/2015 Tech: Aaron McKim Qty to test: 105 Test Start: 09/10/2014 Test Completed:
More informationBreakdown Voltage PART DESCRIPTION. SQW L-D Mated with TMM-1xx-01-S-D
Project Number: NA Tracking Code: TC0344--0303 Requested by: Ty Atkins Date: 10/31/2003 Product Rev: N/A Lot #: N/A Tech: Troy Cook Eng: John Tozier Qty to test: 4 Test Start: 10/31/2003 Test Completed:
More informationDESIGN QUALIFICATION TEST REPORT ECUE/UEC5 ECUE C1-FF-01-1/UEC H-D-RA-1-A
Project Number: Design Qualification Test Report Requested by: Liam Parkes Date: 8/25/2016 Tech: Aaron McKim Test Start: 12/10/2015 Test Completed: 12/25/2015 DESIGN QUALIFICATION TEST REPORT ECUE/UEC5
More informationDVT. Summary Report (Old TC ) PART DESCRIPTION FFMD-25-D-2-01-F
DVT. Summary Report (Old TC0240--0759) PART DESCRIPTION FFMD-25-D-2-01-F File: J:\QA LAB\Test Programs\TC0240---0759\TC0240-NA-0017.doc Form 01 Rev 01 Page 1 of 52 CERTIFICATION All instruments and measuring
More informationEQRP TTR-STL-1 & QRF L-D-DP-A-K & QRM L-D-DP-A-K
n Project Number: Design Verification Test Report Tracking Code: TC0948--2932_Report_Rev_1 Requested by: John Riley Date: 7/1/2010 Product Rev: 0 / QRF8-018-05.0-L-D-DP-A-K/ QRM8-018-05.0-L-D-DP-A-K Lot
More informationDesign Qualification Test Report Dust & Water RDH/RPBH&ERI8 RCH /RPBH & ERI8-019-S-D-RA DC-RCH-019/RCH
Project Number: Design Qualification Test Report Requested by: Travis Newton Date: 8/12/2013 Tech: Aaron McKim Test Start: 02/22/2012 Test Completed: 09/14/2012 Design Qualification Test Report Dust &
More informationDESIGN QUALIFICATION TEST REPORT EBTS/EPTM/EBTT/EBTF EPTS-2-P-D-VT-01/EBTM S-VT-1/EPTT-2-P-11.5-D-RA/EBTF S-RA-1
Project Number: Design Qualification Test Report Tracking Code: 794601_Report_Rev_1 Requested by: Chad Humphres Date: 11/7/2016 / Tech: Tony Wagoner Test Start: 3/9/2016 Test Completed: 5/5/2016 (Actual
More informationEFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS. Mulugeta Abtew
EFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS Mulugeta Abtew Typical PCB Assembly Process PCB Loading Solder Paste Application Solder Paste Inspection
More informationDesign Verification Test Report PART DESCRIPTION UPT L-V-LC / UPS L-V-LC
Project Number: Design Verification Test Tracking Code: TC0923 2522_Report_Rev_2 Requested By: John Reid Date: 5/30/2013 Product Rev: 6/02/09 Part #: UPT-08-03.0-01-L-V-LC / UPS-08-04.0-01-L-V-LC Lot #:
More informationThermal Fatigue Result for Low and No-Ag Alloys - Pb-Free Alloy Characterization Speaker: William Chao, Cisco Chair: Elizabeth Benedetto, HP
Thermal Fatigue Result for Low and No-Ag Alloys - Pb-Free Alloy Characterization Speaker: William Chao, Cisco Chair: Elizabeth Benedetto, HP October 26, 2012 inemi Session, IMPACT Project Team Members
More informationSIB/PCB SIB F-S-LC/PCB
Project Number: Design Qualification Test Report Tracking Code: 233517_Report_Rev_3 Requested by: Catie Eichhorn Date: 2/28/2015 Tech: Craig Ryan Qty to test: 65 Test Start: 12/17/2012 Test Completed:
More informationMEC8/Edge card MEC L-VP/Edge Card
Project Number: Design Qualification Test Report Requested by: Hardy Tan Date: 5/14/2013 Product Rev: 0 Lot #: N/A Tech: Peter Chen Eng: Vico Zhao Qty to test: 80 Test Start: 10/1/2012 Test Completed:
More informationSystem Level Effects on Solder Joint Reliability
System Level Effects on Solder Joint Reliability Maxim Serebreni 2004 2010 Outline Thermo-mechanical Fatigue of solder interconnects Shear and tensile effects on Solder Fatigue Effect of Glass Style on
More informationCRIMP HEIGHT CHARACTERIZATION SUMMARY REPORT
Project Number: Crimp Characterization Testing Tracking Code: 190661 Requested by: Bryon Saylor Date: 08/04/2012 Product Rev: 1 Lot #: NA Tech: Linda Wang Eng: Vico Zhao Qty to test: 200 Test Start: 04/12/2012
More informationDesign Qualification Test Report SMS/TMS SMS L-D/TMS L-D
Project Number: Design Qualification Test Report Tracking Code: 147211_Report_Rev_1 Requested by: Joe Smallwood Date: 11/11/2011 Product Rev: 0 Lot #: N/A Tech: Peter Chen Eng: Vico Zhao Qty to test: 45
More informationCES/TSW CES L-D/TSW L-D
Project Number: Design Qualification Test Report Tracking Code: 231879_Report_Rev_1 Requested by: Catie Eichhorn Date: 6/13/2013 Product Rev: Tech: Peter Chen Eng: Vico Zhao Qty to test: 65 Test Start:
More informationSFM/FTSH SFM-125-T2-L-D-A/FTSH L-DV-A
Project Number: Design Qualification Test Report Tracking Code: 242469_Report_Rev_1 Requested by: Catie Eichhorn Date: 07/19/2013 Tech: Peter Chen Qty to test: 65 Test Start: 05/20/2013 Test Completed:
More informationDVT Report for PCIE-XXX-02-F-D-TH. Mated with Mating PCB Card
Project Number: Requested by: Brandon Harpenau Date: 9/26/2005 Product Rev: 3 Lot #: 1 Tech: Troy Cook Eng: Mark Shireman Qty to test: 20 Test Start: 11/12/2005 Test Completed: 12/9/2005 DVT Report for
More informationFreescale Semiconductor Tape Ball Grid Array (TBGA) Overview
Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Revision 0 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the
More informationDesign Qualification Test Report SIR1. SIR1-15-L-S-A\ SIR1-Mating Board
Project Number: Design Qualification Test Report Requested by: Leo Lee Date: 12/01/2010 Product Rev: 0 Lot #:1 Tech: Kason He Eng: Vico Zhao Part description: SIBF Qty to test:40 Test Start: 11/15/2010
More informationMARCH 17, 2009 TEST REPORT # REVISION 1.1 QUALIFICATION TESTING PART NUMBERS SEAF S-06-2-RA-GP SEAM S-06-2-GP SAMTEC, INC.
MARCH 17, 2009 TEST REPORT #209070 REVISION 1.1 QUALIFICATION TESTING PART NUMBERS SEAF-50-01-S-06-2-RA-GP SEAM-50-02.0-S-06-2-GP SAMTEC, INC. APPROVED BY: DOMINIC ARPINO PROGRAM MANAGER CONTECH RESEARCH,
More informationLow-Silver BGA Assembly Phase II Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Low-Silver BGA Assembly Phase II Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results Gregory Henshall 1 Michael Fehrenbach 2 Hewlett-Packard Co. 1 Palo Alto, CA USA 2 Houston, TX USA
More informationMARCH National Physical Laboratory Hampton Road Teddington Middlesex United Kingdom TW11 0LW
NPL REPORT DEPC-MPR 044 Measuring the Impact of Land Size and Solder Joint Volume on Lead-free Solder Joint Reliability M Wickham, L Zou, M Dusek and C P Hunt NOT RESTRICTED MARCH 2006 National Physical
More informationPlatform Flash PROM VOG48 Package Lead Finish Conversion to NiPdAu
Platform Flash PROM VOG48 Package Lead Finish Conversion to NiPdAu Qualification Report Xilinx is disclosing this Qualification Report (the Documentation ) to you solely for use in the development of designs
More informationDVT Summary Report PART DESCRIPTION IPD S-D-XX-24/IPL S-D
Project Number: Tracking Code: TC0249--0057 Requested by: Jeremy Wooldridge Date: 12/2/2002 Product Rev: 1 Lot #: N/A Tech: Troy Cook Eng: John Tozier Qty to test: 25 Test Start: 12/13/2002 Test Completed:
More informationUnique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY
Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY Frank Toth, and Gary F. Shade; Intel Corporation, Hillsboro, OR, USA {francis.toth.jr@intel.com, (503)-696-1546}
More informationComponent Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version
Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Appendices 1. User Commitment Form 2. Supplier Compliance Form Table of contents 1. Background 2.
More informationHOW THE MOLD COMPOUND THERMAL EXPANSION OVERRULES THE SOLDER COMPOSITION CHOICE IN BOARD LEVEL RELIABILITY PERFORMANCE
HOW THE MOLD COMPOUND THERMAL EXPANSION OVERRULES THE SOLDER COMPOSITION CHOICE IN BOARD LEVEL RELIABILITY PERFORMANCE AUTHORS: B. VANDEVELDE, L. DEGRENDELE, M. CAUWE, B. ALLAERT, R. LAUWAERT, G. WILLEMS
More informationAUGUST 18, 2008 TEST REPORT #208315A QUALIFICAITON TESTING PART NUMBERS ERF S-D-RA ERM S-DV-L SAMTEC, INC.
AUGUST 18, 2008 TEST REPORT #208315A QUALIFICAITON TESTING PART NUMBERS ERF8-050-01-S-D-RA ERM8-050-05.0-S-DV-L SAMTEC, INC. APPROVED BY: DOMINIC ARPINO PROGRAM MANAGER CONTECH RESEARCH, INC. Contech Research
More informationCDC Division FCI USA, Inc.
CDC Division FCI USA, Inc. Report EL-2005-07-046 CR Evaluation of Tin Whisker Growth, FCI Lead Free AIRMAX VS Header Connectors 2006 May 16 PURPOSE: Lead free AIRMAX VS header connectors were tested to
More informationAUGUST 14, 2006 TEST REPORT # RANDOM VIBRATION TEST SERIES PROBE SERIES PROBE TEST SOCKET INTERCONNECT DEVICES, INC.
AUGUST 14, 2006 TEST REPORT #206271 RANDOM VIBRATION TEST 101377-000 SERIES PROBE 204130-036 SERIES PROBE TEST SOCKET INTERCONNECT DEVICES, INC. APPROVED BY: MAX PEEL SENIOR FELLOW CONTECH RESEARCH, INC.
More informationDesign Qualification Test Report T1M/SISS T1M-20-T-S-V / S1SS T-06.00
Project Number: Design Qualification Test Report Tracking Code: 144976_Report_Rev_3 Requested by: Steven Xu Date: 1/10/2014 Tech: Peter Chen Qty to test: 45 Test Start: 5/25/2011 Test Completed: 8/30/2011
More informationThe Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish Julie Silk 1, Jianbiao Pan 2, Mike Powers 1 1 Agilent Technologies, 1400 Fountaingrove Parkway, Santa Rosa,
More informationComposition/wt% Bal SA2 (SABI) Bal SA3 (SABI + Cu) Bal
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive Takehiro Wada 1, Seiji Tsuchiya 1, Shantanu Joshi
More informationENHANCING WLCSP RELIABILITY THROUGH BUILD-UP STRUCTURE IMPROVEMENTS AND NEW SOLDER ALLOYS
ENHANCING WLCSP RELIABILITY THROUGH BUILD-UP STRUCTURE IMPROVEMENTS AND NEW SOLDER ALLOYS B. Rogers, M. Melgo, M. Almonte, S. Jayaraman, C. Scanlan, and T. Olson Deca Technologies, Inc 7855 S. River Parkway,
More informationAxiom Electronics LLC
1 of 8 1.0 PURPOSE and SCOPE This document defines Axiom s requirements for printed circuit board (PCB) fabrication, handling, and storage. Industry standards are referenced where appropriate. This document
More informationReliability of Lead-Free Solder Connections for Area-Array Packages
Presented at IPC SMEMA Council APEX SM 2001 For additional information, please email marketing@amkor.com Reliability of Lead-Free Solder Connections for Area-Array Packages Ahmer Syed Amkor Technology,
More informationIMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION
IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Frank Grano, Felix Bruno Huntsville, AL Dana Korf, Eamon O Keeffe San Jose, CA Cheryl Kelley Salem, NH Joint Paper by Sanmina-SCI Corporation EMS, GTS
More informationRELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING
As originally published in the SMTA Proceedings RELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING Cong Zhao, Thomas Sanders, Chaobo Shen, Zhou Hai, John L. Evans,
More informationReliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S.
Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S. Henkel Electronic Materials Agenda 1. Introduction 2. Motivation 3. Interconnect
More informationroom and cold readouts were performed every 250 cycles. Failure data and Weibull plots were generated. Typically, the test vehicles were subjected to
SOLDER JOINT RELIABILITY ASSESMENT OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER Fay Hua 1, Raiyo Aspandiar 2, Cameron Anderson 3, Greg Clemons 3, Chee-key Chung 4, Mustapha Faizul 4 Intel
More informationTHERMAL CYCLING RELIABILITY OF CHIP RESISTOR LEAD FREE SOLDER JOINTS
THERMAL CYCLING RELIAILITY OF CHIP RESISTOR LEAD FREE SOLDER JOINTS Jeffrey C. Suhling, H. S. Gale, R. Wayne Johnson, M. Nokibul Islam, Tushar Shete, Pradeep Lall, Michael J. ozack, John L. Evans Center
More informationAcceptance Testing Of Low-Ag Reflow Solder Alloys
Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel 1, Aileen Allen 2, Elizabeth Elias Benedetto 3, Rahul Joshi 3 Hewlett-Packard Company 1 Boise, ID, USA 2 Palo Alto, CA, USA 3 Houston, TX,
More informationDesign Qualification Report
Prject Number: Design Qualificatin Reprt Requested by: Eric Mings Date: 11/16/2012 Prduct Rev: AM /Daughter Card Lt #: N/A Tech: Aarn McKim Eng: Eric Mings Qty t test: 32 Test Start: 10/09/2012 Test Cmpleted:
More informationJune 14, TEST REPORT # Rev ºC MECHANICAL SHOCK THERMAL SHOCK. CGAT (7 FIN 2.0 Dia/.892 HT)
June 14, 2004 TEST REPORT # 204158 Rev 1.1 VIBRATION @ 125ºC MECHANICAL SHOCK THERMAL SHOCK CGAT29-0008 (7 FIN 2.0 Dia/.892 HT) CGAT29-0019 (5 Fin 2.0 Dia/.678 HT) CALGREG APPROVED BY: George G. Olear
More informationNTC Thermistors. Mounting instructions. Date: January 2018
NTC Thermistors Mounting instructions Date: January 2018 EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without
More informationDESIGN QUALIFICATION TEST REPORT. LSHM L-DV-A-S-K-TR/ LSHM L-DV-A-S-K-TR DV TO DV 5&10 Position Mating Unmating force LSHM/LSHM
Prject Number: Design Qualificatin Test Reprt Requested by: Ry Lu Date: 5/20/2016 Tech: Peter Chen Qty t test: 64 Test Start: 11/25/2015 Test Cmpleted: 12/10/2015 DESIGN QUALIFICATION TEST REPORT LSHM-110-02.5-L-DV-A-S-K-TR/
More informationThermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys Joe Smetana 1, Richard Coyle 1, and Peter Read 1 Thomas Koshmeider 2, Dave Love 3, Mark Kolenik 4, and Jennifer Nguyen 5 1 Alcatel-Lucent,
More informationNOVERMBER 14, 2006 TEST REPORT #206603, REV. 1.3 QUALIFICATION TESTING PART NUMBER ERF S-DV ERM S-DV SAMTEC, INC.
NOVERMBER 14, 2006 TEST REPORT #206603, REV. 1.3 QUALIFICATION TESTING PART NUMBER ERF8-050-05.0-S-DV ERM8-050-05.0-S-DV SAMTEC, INC. APPROVED BY: THOMAS PEEL PRESIDENT AND DIRECTOR OF TEST PROGRAM DEVELOPMENT
More informationComposition/wt% Bal SA2 (SABI) Bal SA3 (SABI + Cu) Bal
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive Takehiro Wada 1, Seiji Tsuchiya 1, Shantanu Joshi
More informationComparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu), Sn- 3.5Ag, and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu), Sn- 3.5Ag, and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste Gregory Henshall, Hewlett-Packard Co. Palo Alto, CA
More informationENHANCING MECHANICAL SHOCK PERFORMANCE USING EDGEBOND TECHNOLOGY
ENHANCING MECHANICAL SHOCK PERFORMANCE USING EDGEBOND TECHNOLOGY Steven Perng, Tae-Kyu Lee, and Cherif Guirguis Cisco Systems, Inc. San Jose, CA, USA sperng@cisco.com Edward S. Ibe Zymet, Inc. East Hanover,
More informationMAY 27, 2008 TEST REPORT # QUALIFICAITON TESTING PART NUMBERS ERF8-050-L-D-EM2 ERM L-DV SAMTEC, INC.
MAY 27, 2008 TEST REPORT #208157 QUALIFICAITON TESTING PART NUMBERS ERF8-050-L-D-EM2 ERM8-050-05.0-L-DV SAMTEC, INC. APPROVED BY: THOMAS PEEL PRESIDENT AND DIRECTOR OF TEST PROGRAM DEVELOPMENT CONTECH
More informationElectrical Specifications
Features: Higher power ratings than standard thick film chips Absolute TCRs to ±100ppm/ C Impervious to Sulfur contamination, no silver present in terminations Absolute Tolerances to 1% Completely lead
More informationFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t he Energy Efficient Solutions logo, mobilegt, PowerQUICC,
TM February 2012 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t he Energy Efficient Solutions logo, mobilegt, PowerQUICC, QorIQ, StarCore and Symphony are trademarks
More informationAmphenol Amphenol Taiwan Corporation Sheet 1 of 9
Amphenol Amphenol Taiwan Corporation Sheet 1 of 9 Title: Part Number: Description: USB3.1 Connector Product Specification GSB4X series A / B type, Receptacle, Thru hole, PCB mount Revisions Control Rev.
More informationMating / Unmating Test Report
Prject Number: / Test Reprt Tracking Cde: TC1007 3189_Reprt_Rev_1 Requested by: Erin Wright Date: 6/4/2010 Prduct Rev: 3 Part #: MMSD-XX-20-S-06.00-S MMTD-XX-20-S-06.00-S Lt #: 0 Tech: Rger Mrris Tny Wagner
More informationProduct Specification JUL 14 Rev. A1
Industrial SCSI Connector 1. Scope 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of SCSI Connector. 2. Applicable Documents
More informationCOMPONENT LEVEL RELIABILITY FOR HIGH TEMPERATURE POWER COMPUTING WITH SAC305 AND ALTERNATIVE HIGH RELIABILITY SOLDERS
As originally published in the SMTA Proceedings. COMPONENT LEVEL RELIABILITY FOR HIGH TEMPERATURE POWER COMPUTING WITH SAC305 AND ALTERNATIVE HIGH RELIABILITY SOLDERS Thomas Sanders, Sivasubramanian Thirugnanasambandam
More informationThe hand soldering process can therefore be defined by the following steps ;
Hand Soldering with Lead Free Alloys Introduction As companies start to implement lead free soldering processes, hand soldering and associated techniques have been identified as key functions in the manufacturing
More informationAmphenol Amphenol Taiwan Corporation Sheet 1 of 8
Amphenol Amphenol Taiwan Corporation Sheet 1 of 8 Title: Part Number: Description: Micro Power Plus Product Specification G88MP Series 3.0 mm Pitch, PCB Mount / Cable Crimping Type Revisions Control Rev.
More informationPRODUCT SPECIFICATION
1 of 23 B 1.0 GENERAL Scope This specification covers the insulation piercing Quickie Backplane Connector System designed for Backplane-to-flat cable (round conductor) interconnection in low power applications.
More informationThermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications
Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications M. Gonzalez 1, B. Vandevelde 1, Jan Vanfleteren 2 and D. Manessis 3 1 IMEC, Kapeldreef 75, 3001, Leuven,
More informationPRODUCT SPECIFICATION. ExaMAX RAR BACKPLANE RIGHT ANGLE RECEPTACLE (RAR) COPLANAR RIGHT ANGLE RECEPTACLE (RAR)
1 of 15 J ExaMAX VH ExaMAX RAH ExaMAX RAR ExaMAX RAR BACKPLANE RIGHT ANGLE RECEPTACLE (RAR) COPLANAR RIGHT ANGLE RECEPTACLE (RAR) AND VERTICAL HEADER (VH) AND RIGHT ANGLE HEADER (RAH) (4-Pair, 10-Column
More informationPRODUCT SPECIFICATION. This specification defines the performance, test, quality and reliability requirements of the BarKlip I/O Cable system.
1 of 10 7 1.0 Objective This specification defines the performance, test, quality and reliability requirements of the BarKlip I/O Cable system. 2.0 Scope This specification is applicable to the termination
More informationCOMPARISON REPORT OF SFSD/TFM WITH AND WITHOUT LATCHES PART DESCRIPTION TFM F-D-WT, TFM F-D-WT. Mated with
Prject Number: SFSD/TFM with latch Tracking Cde: TC0716-SFSD/TFM with latch-1332 Requested by: Kevin Meredith Date: 9/10/2008 Prduct Rev: CR and D Part #: TFM-105-01-F-D-WT, TFM-120-01-F-D-WT, SFSD-05-28-F-03.25-DR-NDS,
More information