Handbook Of Electronics Packaging Design and Engineering

Transcription

1 Handbook Of Electronics Packaging Design and Engineering

2 Handbook Of Electronics Packaging Design and Engineering Second Edition BERNARD s. MATISOFF, P.E., CMfgE ~ VAN NOSTRAND REINHOLD ~ NewYork

3 Copyright 1990 by Van Nostrand Reinhold Softcover reprint of the hardcover 1st edition 1990 Library of Congress Catalog Card Number ISBN-13: All rights reserved. Certain portions of this work 1982 by Van Nostrand Reinhold. No part of this work covered by the copyright hereon may be reproduced or used in any form or by any means-graphic, electronic, or mechanical, including photocopying, recording, taping, or information storage and retrieval systems-without written permission of the publisher. Van Nostrand Reinhold 115 Fifth Avenue New York, New York Van Nostrand Reinhold International Company Limited 11 New Fetter Lane London EC4P 4EE, England Van Nostrand Reinhold 480 La Trobe Street Melbourne, Victoria 3000, Australia Nelson Canada 1120 Birchmount Road Scarborough, Ontario MIK 5G4, Canada Library of Congress Cataloging-in-Publication Data Matisoff, Bernard S. Handbook of electronics packaging design and engineering/by Bernard S. Matisoff.-2nd ed. p. cm. Includes index. ISBN-13: e-isbn-13: DOl: / Electronic packaging-handbooks, manuals, etc. I. Title. TK7870.M '54-dc CIP

4 PREFACE TO THE SECOND EDITION The degree of sophistication throughout the electronics industry is increasing dramatically each year. More functions and higher speeds are being packaged into smaller and smaller packages. The need for miniaturization, higher reliability, and competitive pricing has pushed product design far beyond the limitations of the conventional technology, and has necessitated the development of new packaging methods. The electronics packaging engineer has assumed a new role in modem electronics manufacturing. The packaging engineer no longer exists merely to design a "can" over the circuitry, but rather to insure that the final product meets the severe operational environments, cost restrictions, and reliability standards of the industry. The new packaging engineer will be the key to the success of the product and the future of the company. The close tolerances required for automatic-placement equipment are more difficult for manufactures to achieve, and soldering and cleaning can become problems since they can cause thermal, material and process problems. Since both the manufacturing processes and the applications environments must be considered in selecting the manufacturing methods, materials, and parts, the designers must pay close attention to the product specifications and the methods employed in production. In the second edition of this book I have added a number of new chapters that will provide the data needed by the busy designer and packaging engineer in their daily design tasks. It is intended that as mach of the standard information required in the design function be made available in this single source as a means of reducing the engineers' and designers' lost time searching for data. BERNARD S. MATISOFF, P.E., CMFGE v

5 PREFACE TO THE FIRST EDITION The Handbook of Electronics Packaging Design and Engineering has been written as a reference source for use in the packaging design of electronics equipment. It is designed to provide a single convenient source for the solution of recurring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer. During my years as an engineer involved in all the phases of electronics packaging-both design and manufacturing-i have attempted to review carefully all books and articles published on this subject. One characteristic seems common to most of them: an overemphasis of the theoretical. Obviously, comprehensive coverage of theory is needed. Moreover, there is also a need for a book that separates practical and applicable information from the vast field of theory and presents it in a readily accessible format. The theoretical presentations herein are considered sufficient (1) for the routine solutions of the daily problems encountered and (2) for establishing the size and complexity of those problems so that the engineer or designer will know when the assistance of a specialized consultant is required. vii

6 viii PREFACE TO FIRST EDITION Today there are numerous techniques for packaging electronics systems, and due to the increasingly stringent customer requirements, their number continues to grow. Engineers can no longer simply document the components-they must select the most efficient packaging techniques as well. The physical attributes of electronics equipment are fast becoming recognized as significant in the performance and the reliability of contemporary systems. Practical applications of materials, processes, and components in the evaluation of electronics packaging can be made to yield a new order of performance and reliability at reasonable costs. Modern electronics equipment must be designed to function reliably in the specific environments defined by the intended applications. Extreme environments, characterized by mechanical shock and vibration, high temperatures, or radio-frequency interference, for example, will present many problems. To achieve the most efficient design, the engineer must review all of the requirements and generate a design plan that will provide the foundation for the product design. A systematic approach to any electronics packaging task must be taken. The engineer must consider all of the design parameters as well as their effect on each other. The basic design parameters to be considered in the early planning stages are: PhYSical Environmental Repairability and maintainability Manufacturability Appearance Economics Reliable performance depends on the ability of a structure to secure all parts and assemblies together in a good working relationship. The optimal system is obtained through judicious integration of the circuit design, structural techniques, component applications, heat transfer, and the vibrational dynamics within realistic operational requirements. The designer must be thoroughly familiar with the many processes and techniques available in order to fabricate parts at the lowest cost, as well as with the advantages and limitations of each of the processes. The parts and materials selected by the designer-and the method of assembly-must be capable of withstanding and functioning in the specified environments. All things are designed and constructed to extend human capability in some way. Therefore, the engineer must remember that humanity is the central reason for all designs. The design object is to provide people with the accessories they need to achieve a specified goal. BERNARD S. MATISOFF, P.E., CMFGE

7 CONTENTS Preface to Second Edition Preface to First Edition v vii 1 Electronics Packaging Design and Engineering 2 Project Planning 6 3 Human Factors Engineering 23 4 Fabrication Processes 64 5 Mechanical Fasteners Heat Transfer and Thermal Control Shock and Vibration Design Subassemblies and Assemblies Design Considerations for Space Electronics Material Plating and Finishes Radio Frequency and Electromagnetic Shielding Design and Development of Miniature Electronics Systems Wire and Cabling Materials and Processes Safety 328 ix

8 x CONTENTS 16 Printed Circuits Electrical Interconnection Systems Forced Air Cooling Systems Preferred Materials for Electronic Packaging Selection of Plastics for Various Environments Mechanics of Simple Stresses Formulas and Conversions Design Reviews-An Instrument for Decision Making Slide Mount Considerations for Electronic Assemblies Reference Designations for Electrical and Electronic Parts and Equipment Metal Alloy and Temper Designation Systems 511 Appendix A 535 Appendix B 578 Index 647