DEK HORIZON ix DL RTC Platform Technical Specification

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1 DEK HORIZON ix DL RTC Platform Technical Part No Issue 05 August 2014

2 DEK ix DL RTC Machine Standard Configuration Standard Configuration Machine Alignment Capability >2 +/- 12.5µm, 6 Sigma # Process Alignment Capability >2 +/- 20µm, 6 Sigma # Core Cycle Time Printer Construction ISCAN TM Machine Control Operating System Operator Interface Camera HawkEye 1700 Functionality Camera Positioning Squeegee Pressure Mechanism Stencil Positioning Stencil Alignment Squeegee Machine Interface Connectivity Tri Colour Beacon Temperature & Humidity Sensor Documentation 4 secs One piece optimised welded frame Motion control using CAN BUS network Windows XP Colour TFT touch screen display, keyboard and trackball with DEK Instinctiv TM software. HawkEye 1700 digital camera, using IEEE 1394 interface. Multi channel. LED lighting. FOV 11.3mm x 8.7mm. Inspection window 75mm 2 Enabled Rotary motors and encoders with 4 micron resolution Software controlled, motorised with closed loop feedback Automatic loading incorporating squeegee drip tray Motorised via actuators X, Y, and Theta Clamped double trailing edge squeegee (1 set included) Upline and downline FMI included RJ-45LAN (networking) and USB2 interface available Programmable with audible alarm Monitoring of the process environment Hard copy manuals comprising: Operator, Installation, Electrical Drawings. On board technical manuals and tutorials supporting operator functions. CD containing manuals and tutorials. # DEK s machine accuracy and repeatability qualification is certified by 3rd party and undertaken using production environment process variables. Print Speeds, Print Pressures, Rising Table and Camera Movements are included in the process capability figure. 2

3 Machine Standard Configuration Transport System Minimum Distance between Rails 2 and 3 (A) Available Distance between Rails 1 and 3 (B) Substrate Handling Size (minimum) Substrate Handling Size (maximum) Conveyor Height Transport Direction (print lane) Printing Lane under Clearance Board Thickness Board Aspect Ratio Warpage 72.5mm* 251mm=SMEMA** 251.7mm=Siemens Single Lane: 50mm (X) x 40.5mm (Y) Dual Lane: 50mm (X) x 40.5mm (Y) Single lane: 375mm # (X) x 254mm (Y) Dual Lane: 375mm # (X) x B-A (Y) 825mm to 980mm (SMEMA) Left to Right (factory configured) Right to Left (factory configured) 25mm 0.4mm to 6mm Landscape Board + Warpage = 6mm *see figure below **see figure below # A board longer than 295mm requires a dedicated tooling tower for support, for board width up to 250mm in Dual Lane mode please contact regional product manager 3

4 Machine Standard Configuration 4

5 Machine Standard Configuration Process Parameters Print Pressure Print Speed Print Gap Substrate Separation Print Modes Paste Knead 0kg to 20kg 2mm/sec to 300mm/sec 0mm to 6mm Speed: 0.1mm/sec to 20mm/sec Distance: 0mm to 20mm ProFlow Print / Print Print / Flood Flood / Print Adhesive Programmable: number; period; on demand Vision Vision System Cognex Fiducial Recognition Automatic fiducial teach and find incorporating 0.1mm fiducial capture Fiducials 2 or 3 Fiducial Types Synthetic fiducial library or unique pattern recognition Fiducial Size 0.1mm to 3mm Fiducial Locations Anywhere on substrate Fiducial Error Recovery Auto lighting adjustment Auto fiducial search Camera Lighting Software controlled programmable LED lighting Data Capture Product Data Capture Verification & Traceability ProDEK Closed Loop Chase Screen Frame Size (maximum) 736mm x 736mm (29 x 29 ) Screen Frame Thickness 38mm (1.5 ) Image Position Front Centre Custom 5

6 Machine Standard Configuration Operating Environment Temperature 10 to 35 C (50 to 95 F) Humidity 30% to 70% relative humidity (non-condensing) Services Voltage 100 Volts to 240 Volts +/- 10%. Single phase 50/60Hz Maximum Current at 115V 20 Amps with vacuum pump 6 Amps without vacuum pump Maximum Current at 230V 10 Amps with vacuum pump 3 Amps without vacuum pump Over Current Protection An external circuit breaker 25 Amps is required to be fitted in line with the machine supply Air Supply To ISO Standard Quality Class Pressure 5 bar to 8 bar General usage 5 litres/minute at 5 bar to 8 bar Maximum usage 226 litres/minute at 6 bar Shipping Information Approximate Weight 830kg boxed (dependent upon configured options selected with machine) 680kg unboxed (dependent upon configured options selected with machine) Approximate Dimensions 2060mm x 1500mm x 1570mm (81.1 x 59 x 61.8 ) Certification CE Acoustic Noise Level 98/37/EC 89/336/EEC 73/23/EEC Subsequent amendments Less than 70dB 2003/1/EC 6

7 Machine Productivity Options Process Print Method Print Environment Control Stencil Frame Adjustable Stencil Mount (ASM) Under Stencil Cleaning Vacuum Assist for Under Stencil cleaner Paste Dispenser Paste roll height monitor ProFlow ATx ProFlow Tx ProFlow * Temperature Temperature Control Module (TCM) VectorGuard Universal frame adaptor Frame variants Fully adjustable to accommodate frame sizes in the range of 305mm** to 736mm (12 to 29 ) by 38mm height. Image position: Centre / Front / Custom Blue Under Stencil Cleaner, fully programmable with wet/dry/vacuum wipe with external solvent tank Cyclone High Speed Cleaner, fully programmable with wet/dry/vacuum wipe with external solvent tank On board vacuum unit 35litres/second airflow On board vacuum unit 25 litres/second airflow * For head size over 300mm contact the Product Manager ** Minimum screen width limited to 381mm (15 ) with 300mm USC and 250mm board clamps Software & Communications Substrate Handling Software & Communications Statistical Process Control Time To Go (TTG) Capability Tooling Deviation Monitor Flexible boards Selective print pass through Off Line Editor (OLE) GEM on TCP/IP On board, reported via operator interface (QC-CALC) Consumable warnings via level gauges for fabric, solvent, paste Verification of tooling setup via squeegee pressure feedback Transport Substrate Support Substrate Fixture Vision 2Di Inspection Vacuum Tooling Capability Vacuum Tooling Sensor Vacuum Cups Snuggers (edge clamping) Foil-Less clamps Basic stencil and board Advanced stencil and board 7

8 Machine Productivity Options 8

9 Machine Productivity Options 9

10 Switzerland GmbH Disclaimer In line with Switzerland GmbH Policy of continual improvement, this specification is periodically up-issued to reflect the latest DEK platform enhancements and it is provided with an issue state, which is displayed at the bottom of each hard copy page. Please note the following: This information is provided in good faith; it is believed to be accurate and sufficient for the intended purpose This information remains the property of Switzerland GmbH Switzerland GmbH are not liable for the consequences of applying this information Switzerland GmbH are free to alter this information without notice The legal form of this notice can be read at 10

11 EUROPE Switzerland GmbH Hardturmstrasse 105 P.O. Box 190 CH-8037 Zürich Switzerland Germany GmbH Theodor-Heuss-Str. 57 D Bad Vilbel Germany AMERICAS USA Inc 1785 Winnetka Circle Rolling Meadows, IL USA ASIA Manufacturing (Shenzhen) Co. Ltd. The West, 1F First Building Ting Wei Industrial Park 6 Liufang Road Bao Cheng 67 th Area Bao An District Shenzhen Guangdong People s Republic of China Hungary LLC 9027 Gyor, Platánfa u. 2 Hungary Netherlands BV Moorland 3F Oirschot 5688 GA The Netherlands Weymouth Ltd 11 Albany Road Granby Industrial Estate Weymouth DT4 9TH United Kingdom 11

DEK Gemini Platform Technical Specification

DEK Gemini Platform Technical Specification Platform Technical Part No. 573083 Issue 03 August 2014 Machine Standard Configuration Standard Configuration Machine Alignment Capability >2 Cpk @ +/- 12.5µm, 6 Sigma # Process Alignment Capability >2