PRODUCT/PROCESS CHANGE NOTIFICATION

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1 PRODUCT/PROCESS CHANGE NOTIFICATION PCN DCG-UPD/13/8217 Dated 21 Nov 2013 Standardization of assembly materials for ST PBGA (27x27 and 35x35) manufactured in ST Malta and StatsChippac Korea 1/5

2 PCN DCG-UPD/13/ Dated 21 Nov 2013 Table 1. Change Implementation Schedule Forecasted implementation date for change Forecasted availability date of samples for customer Forecasted date for STMicroelectronics change Qualification Plan results availability Estimated date of changed product first shipment 01-Feb Nov Dec Feb-2014 Table 2. Change Identification Product Identification (Product Family/Commercial Product) Type of change Reason for change Description of the change PBGA 27x27 and 35x35 Package assembly material change Standardization of assembly materials AFOP substrate pad finishing and solder ball metallurgy are replacing respectively NiAu substrate pad finishing and SnAg solder ball metallurgy. There is no consequence on the customer mounting process and no impact on the performance of the device as concerned the quality and the reliability. If needed, Z samples can be provided for any customer qualification. Initial samples will be available only on test vehicles. AFOP = Au on Finger and OSP (organic coating) on ball Pads. = SnAgCuNi with 96.5% Sn, 3% Ag, 0.6% Cu and 200ppm Ni. Change Product Identification Internal traceability Manufacturing Location(s) 2/5

3 PCN DCG-UPD/13/ Dated 21 Nov 2013 Table 3. List of Attachments Customer Part numbers list Qualification Plan results Customer Acknowledgement of Receipt PCN DCG-UPD/13/8217 Please sign and return to STMicroelectronics Sales Office Dated 21 Nov 2013 Qualification Plan Denied Qualification Plan Approved Name: Title: Company: Change Denied Change Approved Date: Signature: Remark 3/5

4 PCN DCG-UPD/13/ Dated 21 Nov 2013 DOCUMENT APPROVAL Name Benoit, Eric Chavade, Jacques Jan, Didier Function Marketing Manager Product Manager Q.A. Manager 4/5

5 AFOP pad finishing and solder ball introduction on ST Malta and on StatsChippac Korea BGA 27x27 and 35x35 assembly lines for 55nm products Qualification Plan Name Org. Date Comment Y. Lavignasse/ D. Jan DCG QA Oct 17th, 2013 Release 1

6 PBGA AFOP implementation for BGA 27x27 and 35x35 / Change description AFOP : Au on Finger and OSP (organic coating) on ball Pads 2 Plan for Standardization of ST Back End lines (substrate finishing/ Ball alloys) in ST Malta and StatsChippac Korea, manufacturing alignment with Matrix BGA Package size Today Q x27 and 35x35 NiAu/ SnAg AFOP/ Au Ni Cu OSP The substrate pad will change from NiAu to AFOP and the solder ball metallurgy will move from SnAg to SACN. Activity Board Level Reliability Substrate variability Product & package reliabity Workability Contruction Analysis Packa ge 27x27 35x35 Q3 13 Q4 13 Q1 14 W52 W52 Mass Prod TOP BOTTOM AFOP IMPLEMENTATION 2

7 Qualification Strategy 3 Aim of this activity is to qualify new substrate finishing (AFOP) and new solder ball metallurgy (). The change is the same in Malta and Stats ChipPAC Korea. This change is material related, with a very limited impact from machine and process. Strategy for qualification: Main part of this assessment is performed on Malta assembly parts through 4 Test Vehicles, looking to the standard reliability tests and durations. Then, a more focused reliability exercise is maintained in Stats ChipPAC Korea to confirm the robustness to any process or machine variations, introducing mainly an environmental sequence (mechanical stress, followed by humidity storage to check the robustness of the interface). This is done on 3 different Test Vehicles instead of 3 lots on a single Test Vehicle, to increase the variability.

8 MALTA AFOP - Reliability Plan / Test Vehicles 4 4 Test Vehicles per package size / details: BGA27 BGA CRONUS H225 Molding compound SMH2 SMH2 SMH2 SMH2 Parts in reliability 3x77 3x77 3x77 3x77 Solder balls D= 0.60 D=0.50 D=0.60 D=0.60

9 MALTA AFOP - Qualification Plan 5 Reliability Trials: 80pcs / trials / Test Vehicles MSL3 + HTS 150 C; 1000hrs (readouts: 0hrs, MSL3, 500hrs, 1000hrs) MSL3 + uhast 130 C / 85%RH / 230kPa; 96hrs (readouts: 0hrs, MSL3, 96hrs) MSL3 + TC -40 C/+125 C ;1000cy (readouts: 0hrs, MSL3, 500cy, 1000cy) SAM at T0, after MSL3 and then end of reliability.

10 SCK AFOP - Reliability Plan / Test Vehicles 6 3 Test Vehicles per package size / details: BGA H239 Molding compound CV8710CE CV8710CE CV8710CE Parts in reliability 3x50 3x50 3x50 Solder balls D=0.50 D=0.50 D=0.50

11 Thermoire analysis on each TV. SCK AFOP - Qual Plan 7 Reliability (target 0 reject): 50pcs / trials / TV Thermal cycle: MSL3 + TC -40 C/+125 C ;500cy (readouts: 0hrs, MSL3, 500cy) Environmental Sequence: MSL3 + TC -40 C/+125 C 100cy followed by 96hrs uhast 130 C / 85%RH / 230kPa (readouts: 0hrs, MSL3, 100cy, 96hrs) SAM at T0, after MSL3 and then end of reliability (on a sampling of 10p / trial / TV)

12 PCN DCG-UPD/13/ Dated 21 Nov 2013 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND / OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE ( AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION ), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. RESTRICTIONS OF USE AND CONFIDENTIALITY OBLIGATIONS: THIS DOCUMENT AND ITS ANNEXES CONTAIN ST PROPRIETARY AND CONFIDENTIAL INFORMATION. THE DISCLOSURE, DISTRIBUTION, PUBLICATION OF WHATSOEVER NATURE OR USE FOR ANY OTHER PURPOSE THAN PROVIDED IN THIS DOCUMENT OF ANY INFORMATION CONTAINED IN THIS DOCUMENT AND ITS ANNEXES IS SUBMITTED TO ST PRIOR EXPRESS AUTHORIZATION. ANY UNAUTHORIZED REVIEW, USE, DISCLOSURE OR DISTRIBUTION OF SUCH INFORMATION IS EXPRESSLY PROHIBITED. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners c 2013 STMicroelectronics - All rights reserved. STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 5/5

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