MTS Semiconductor Solution

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1 MTS 0 unplanned down time Solution Lowest operating Cost Solution Energy saving Solution Equipment Fine Pitch and UPH Upgrade solution Quality & Yield Improvement Solution Reliability Enhancement Solution Advanced Equipment Management Solution MTBF Extension Solution Equipment Remote Monitoring Solution Equipment Improvement Service Solution

2 MTS Global Industry Technology Solutions Customized Technologies Wafer Back grinding (Lapping) to Polish Upgrade Increasing Productivity without new Capital Investment (Capex Avoidance) MTS have been actively providing technology break through Solutions. Without acquiring new capital equipment. Old machine upgrade to meet new machine capability. Capex Avoidance = USD 1 M per machine UPH Increased by >15% Old lapping to New Polish capability UPH increased more than 15% Reduced production cycle time Dicing Saw Feed Speed Improvement for IC, LED, WLCSP Packages Improve Cycle Time by increasing Throughput per hour For Industry competitiveness, One of the Key factors is Delivery Time or Time to market. MTS Experts have helped customers reach their goals specially when it comes to Precision and Speed. 20% 300% Feed Speed improvement. Capex Avoidance = up to USD 600K per machine Improved wafer yield from 80% to 100% Yield Reduced Top, Back, Side Chipping size Reduced XYZ Burr, Zero Delam Zero Blade breakage Improved Cycle time Reduce Cost Real Time SPC by Wireless technology Die Attach UPH Improvement Old Machine UPH was known be slower by 10% to 20% compared to new equipment models MTS help to eliminate the customer s TOP 10 most pains in terms of Productivity or Quality through our detailed diagnosis, exact root cause analysis and equipment upgrades Capex Avoidance = USD 4.8 M UPH improved by 15% 30% from IE Calculation Reduced O&M Cost by up to 60% Improve UPH from 30% up to 60% Die Placement accuracy from previous ± 5mils improve to < ± 2mils Worst machine become the better machine

3 Die Attach Precision & UPH Improvement No equipment manufacturer support to improve Old Model Machines MTS aims to support every industry to Reduce new capital investment by increase production from higher operating speed. Solutions have exhibit big reduction in cycle time by increasing machine speed (UPH improvements) Capex Avoidance = USD 1.0 M UPH improved by >50% from IE Calculation Improve UPH by up to 60% Die Placement accuracy ± 3 Sigma Worst machine become the best machine Pick n Place UPH Improvement Facing a lot of chipping issues and other quality concerns are affecting machine speed performance Due to so many Quality issues, Semiconductor Assembly plants just resort to reduce the machine speed as their Corrective Action. Corner chipping improvement 25% UPH improvement Capex Avoidance = up to USD 15 M 15% 50% Additional Capacity depends on upgrade Mc qty Oven Cure Cycle Time Improvement Mean time to market is a very important aspect in Production Manufacturing Industry Oven might be not much in terms of capital investment but and process delays have bigger impact in Cycle time. From our customer requirements, MTS developed the oven solution. UPH Increased up to Units per hour Improved Productivity Improve Cycle time Improve O&M Cost Capex Avoidance USD 150K Improve Cycle time >50%

4 Wirebond UPH Improvement for MLP Punch Cu Using Copper wire interconnect has reduced UPH up to 30% Most Semiconductor Plant have been facing capacity loss after Gold wire to Copper wire conversion of their Wirebond Machines, after finished Upgrading of their old ASM Wirebonders at its plant 1 and 2 production line for UPH Improvement Programs, their Wirebond UPH performances have significantly increased with improve quality and efficiency performance, without acquiring new capital equipment to save cost Capex Avoidance = USD 1.94 M per 50 machien Reduce WB Defects by 96%, 20% 50% Additional Capacity UPH increased from 21% to as high as 106% on other product lines with out affecting Quality and Yield. Reduced production cycle time Improved Yield from NSOP/ NSOL defects Resolved Pad Cratering Wirebond Fine Pitch Improvement for IC Packages Dedicated Machines are limiting Production performance, less loading flexibility More than 1000 Machine have been upgrade for Fine Pitch Enhancement Solution to help our customer create more loading flexibility in running Fine Pitch Devices, specially >43um BPO. All Equipment Passed the accuracy test having a ball placement repeatability of < ± 2.5 µm. Capex Avoidance = up to USD 15 M 15% 50% Additional Capacity depends on upgrade Mc qty Upgraded machines even can reach bond placement accuracy up to ± 1.5 µm. Increase Loading capacity Create loading flexibility Wirebond Gold (Au) to Copper (Cu) Wire Conversion Due to increasing cost of Gold wires, Maintain market competitiveness From the Latest machine model to Oldest machine like KNS 1488 Plus, MTS have been upgrade for Copper Wirebond Conversion Program to help our customer improve their market competitiveness. All Equipment Passed the accuracy test having a ball placement repeatability of < ± 2.5 µm. 10% 25% Additional Capacity Upgrade available for Fine wire diameters to Heavy wire diameter. Machine capability to run CUP devices with 1.2 Pad Thickness without Pad Cratering Increase Loading capacity, create loading flexibility

5 Molding clamping force upgrade from 60T to 120T Drive higher Yield and Improve Quality focus One of the key improvement for Molding machine is from clamping force, MTS provide solution to improve OLD machine with 60 Tons clamping force to 120 Tons clamping force. Capex Avoidance O&M Cost Down Capex Avoidance USD 600K per machine Improve quality Test Handler Index Time Improvement Around 50% of the total process time due to IC Transport Module System Due to so many Quality issues, Semiconductor Assembly plants just resort to reduce the machine speed as their Corrective Action. IC Index speed improved by 100% from 5K units per hour to 10K units per hour Jam Rate up to 55K without any jam Capex Avoidance = up to USD 1.5M 15% 50% Additional Capacity UPH Increased up to 10.2K Units per hour Improved Productivity and Cycle time IC Tester Channel Board MTBF Improvement High Maintenance cost from spare parts and board repairs MTS support every industry to Reduce Operation & Maintenance Cost by improving mean time between failure (MTBF) for Channel boards, Driver boards, I/O Boards and others. MTBF improved up to 90% Reduced parts inventory cost Cost Down Reduced Operating & maintenance cost Reduce parts inventory cost

6 Real Time SPC (Statistical Process Control) Drive higher Yield and Improve Quality focus by Predictive Approach A Valuable key to a High Quality Manufacturing can be recognized from their Quality Control System. Each equipment Key Input Process variables can be monitored to prevent defects and other quality issues. Improved Cycle time Reduce Parts inventory cost Available : Back grind Dicing Saw Die Attach Wirebond Zero Unplanned Downtime Prevent defects by setting alarm levels and fault levels. Predictive maintenance activity Reduced planned maintenance activity with job order accuracy. Improve spare parts management Machine to Machine Portability Program Equipment variations can go up to 50% or more depending on the number of key components Available : Back grind Dicing Saw Die Attach Wirebond Before making any proposed approach for a robust process, one must understand how robust is a robust" process. In general, in a single process alone have many variables, basically MAN, MACHINE, METHOD, MATERIAL, EVIRONMENT. Machine Portability is to cancel out 1 of the process variables which is obviously the MACHINE. A basic process equipment can be breakdown to sub factors which this program will be focusing with; 20% Machine to Machine UPH Variation Reduce setup time by 50% Reduced quality variation Reduce alarm variations Reduce UPH Variations Reduce Capability Variations Improve productivity and loading flexibility Reduce Setup time from machine optimization

7 Plant Facility Energy Saving Solutions Drive higher Yield and Improve Quality focus by Predictive Approach A Valuable key to Manufacturing competitiveness can be recognized from COST Management Programs. Within 3 months will help Semiconductor Plant to save up to 27% Electricity Energy saving O&M Cost Downtime reduction Improved Energy efficiency Improve facility equipment reliability Up to 40% Energy Saving after 6 month of implementation Failure Defense Program Maintenance Management Program custom design per customer requirements An optimum balanced maintenance methods is established consistent with the equipment operating context and business environment. Equipment criticality is established for prioritizing remedial actions. Preventive maintenance activities are refined to ensure that equipment is not over maintained. Improved Cycle time Reduce Parts inventory cost Zero Unplanned Downtime Prevent defects by setting alarm levels and fault levels. Predictive maintenance activity Reduced planned maintenance activity with job order accuracy. Improve spare parts management