Basic Opamp Design and Compensation. Transistor Model Summary

Size: px
Start display at page:

Download "Basic Opamp Design and Compensation. Transistor Model Summary"

Transcription

1 Basic Opamp Design and Compensation David Johns and Ken Martin slide of 37 General Constants Transistor charge Boltzman constant Transistor Model Summary Intrinsic silicon carrier concentration ( K) Relative permittivity of oxide Relative permittivity of silicon MOS Transistor Parameters Electron mobility (typical) Hole mobility (typical) Oxide thickness (typical) q C k JK n i. 0 6 carriers/m 3 K ox 3.9 K s.8 µ n 0.05 m V s µ p 0.0 m V s t ox 0.0 µm slide of 37

2 Transistor Model Summary Gate capacitance per unit area C ox Device parameters (typ), Threshold voltages (typical) V tn 0.8 V, Threshold voltage adjustment Body effect parameter (typical) Fermi potential difference (typical) φ F Effective Gate-Source Voltage, V eff Effective gate-source voltage K ox ε o pf/ ( µm) t ox µ n C ox 90 µa/v µ p C ox 30 µa/v V tp 0.9 V V tn V tn-0 + γ( V SB + φ F φ F ) γ 0.5 V 0.35 V V eff V GS V tn slide 3 of 37 I D Triode and Active Regions W V µ n C ox ---- ( V L GS V tn )V DS DS I D I D V GS constant µ n C ox W ---- ( L V GS V tn ) I D W µ n C ox ---- ( V L GS V tn )V DS Triode Region Active Region Cutoff Region: V GS V GS Cutoff Region V tn V DS,sat V DS,sat Triode Region: > V tn, V DS V eff Active Region: V GS > V tn, V DS V eff < V DS V eff slide 4 of 37

3 MOS Triode Equations Region of operation V GS > V tn, V DS V eff Drain current I D µ n C W ox ---- ( V L GS V tn )V DS.7 V DS typical term is due to body effect along channel Small-Signal Model in Triode Region ( for V DS << V eff ) Vg Vs Cgs Csb rds Cgd Cdb Vd r ds W µ n C ox ---- Veff L slide 5 of 37 MOS Active (or Pinch-Off) Equations Region of operation V GS > V tn, V DS V eff Drain current I µ n C ox D W ---- ( VGS V L tn ) [ + λ( V DS V eff )] Output impedance constant λ L V DG + V tn term is due to built-in junction potential Effective gate-source voltage (ignoring output impedance) V eff V GS V tn I D µ n C ox ( W L) slide 6 of 37

4 MOS Active Equations Small-Signal Model (Active Region) C gd v g v d C gs v gs g m v gs g s v s r ds C db C sb v s slide 7 of 37 Transconductance Transconductance MOS Active Equations g m g m W µ n C ox ---- Veff L µ n C ox ( W L)I D Transconductance g m I D V eff Body effect transconductance g s Body effect transconductance (typical) g s Output impedance Output impedance r ds λi D α L γg m V SB + φ F 0.g m r ds ---- V where I DG + V tn α D V m slide 8 of 37

5 Two-Stage CMOS Opamp Useful for describing many opamp design concepts Still used for low voltage applications C cmp V in A A V out Differential input stage Second gain stage Output buffer slide 9 of 37 Two-Stage CMOS Opamp 5 Q0 Q 5 Q5 I bias V DD Q6 500 Q4 Q 5 5 Q8 Q Q V in V in+ V out 00 5 Q6 Q5 Q3 R b Q3 Q4 V SS Q7 Q9 Bias circuitry Differential-input Common-source Output first stage second stage buffer all transistor lengths.6 um slide 0 of 37

6 Opamp Gain 3rd stage NOT included if driving capacitive loads Typical gains of for each of stage and First Stage Differential to single-ended g m Second Stage Common-source gain A v g m ( r ds r ds4 ) W µ p C ox ---- I L D A v g m7 ( r ds6 r ds7 ) µ p C W ox ---- L I bias () () (3) slide of 37 Opamp Gain Third Stage Source follower Typical gain slightly less than (say 0.9) Note g ds r ds and G L R L A v G L + g m8 + g s8 + g ds8 + g ds9 g s is body-effect conductance and equals zero if source tied to substrate is the load conductance at output G L g m8 (4) slide of 37

7 V bias Q5 Frequency Response v in+ v in Q Q v v A 3 50 Q3 50 Q4 i g m v in A A3 v out C eq ( + A ) slide 3 of 37 Frequency Response dominates at all freq except unity-gain freq Ignore Q6 for now (used for lead compensation) Miller effect results in ( C eq ( + A )) A At midband freq A g m Z out g m ( s A ) Overall gain (assuming A 3 ) A v () s A A g m ( s ) resulting in a unity-gain frequency of a g m (5) (6) (7) (8) slide 4 of 37

8 First-order model 0log( A A ) Gain (db) Freq Response -0 db/decade a g m 0 Freq a (log) ω p Phase (degrees) 0 ω Freq ta (log) ω p slide 5 of 37 Slew Rate Max rate output changes when input signal large All Q5 bias current goes into Q or Q I D SR dv out dt max I CC max I D5 I D is nominal bias current of input transistors (9) Using W g m a and g m µ p C ox ---- L I D slide 6 of 37

9 SR Slew Rate I D a V eff a µ p C ox ( W L) I D (0) where V eff I D µ p C ox ( W L) Normally, little control over a for a given power diss Increase slew-rate by increasing Veff This is one of main reasons for using p-channel input stage higher slew-rate slide 7 of 37 Systematic Offset Voltage To ensure inherent offset voltage does not exist, design should satisfy ( W L) 7 ( W L) ( W L) ( W L) 5 Ensures nominal current through Q7 equals Q6 Found by noting I D5 I D3 I D4 () () and V GS7 V DS3 V GS4 (3) then setting I D7 I D6 slide 8 of 37

10 N-Channel or P-Channel Input Stage Can also build complement opamp with an n-channel input diff pair and second-stage p-channel stage P-channel Advantages V eff Higher slew-rate For fixed bias current, is larger (assuming similar widths used for max gain) Higher unity-gain freq higher transconductance of second stage which is proportional to unity-gain freq Lower /f noise holes less likely to be trapped p-channel transistors have lower /f noise N-channel Advantage Lower thermal noise thermal noise is lowered by high transconductance of first stage slide 9 of 37 Opamp Compensation β V in ( s) As ( ) V out ( s) Feedback circuit β assumed to be freq independent R β R R + R β C C C + C R As ( ) V out C As () V out slide 0 of 37

11 Model ω p General Opamp Compensation As ( ) by As ( ) first dominant-pole frequency pole frequency modelling higher-freq poles. found from simulation frequency with 35 phase shift ( 90 due to ω p and another 45 due to higher-frequency poles and zeros) Closed loop gain given by A ( + s ω p )( + s ) A CL ( s) As ( ) βa( s) (4) (5) slide of 37 General Opamp Compensation A CL ( s) A CL s( ω p + ) s βa 0 ( + βa 0 )( ω p ) (6) wherea CL0 A 0 ( + βa 0 ) β Compare to a general second-order equation H ( s) Kω s ω s + ω0 Q % overshoot 00e K s s ω 0 Q π Q ω 0 (7) (8) slide of 37

12 General Opamp Compensation Equating equations above results in ω 0 ( + βa 0 )( ω p ) βa 0 ω p (9) ( + βa 0 ) ω p βa 0 ω p Q ω p + To find relationship between Q and phase-margin we look at the loop gain, LG() s βa 0 LG( s) βas ( ) ( + s ω p )( + s ) To find a relationship for the loop-gain unity-gain freq LG( j ) (0) () () slide 3 of 37 General Opamp Compensation And rearrange and use approx that» ω p βa 0 ω p (3) so that Q (4) Would also like to relate phase-margin with and Q factor slide 4 of 37

13 Phase-Margin Loop Gain (db) 0log( LG( jω) ) 0 Phase Loop Gain (degrees) 90-0 db/decade a a Freq 0 (log) 80 ω p ω p PM (phase margin) Freq (log) GM (gain margin) slide 5 of 37 PM General Opamp Compensation LGjω ( t ) ( 80 ) 90 tan ( ) (5) where ω p adds 90 phase shift If non-dominant poles remains unchanged, independent of β for optimally compensated circuit! PM (Phase margin) tan( 90 PM) Percentage overshoot for a step input Q factor % % % % % (6) slide 6 of 37

14 Compensating the -Stage Opamp V bias Q5 V DD Q6 Vin- Q Q V in+ V out V bias Q6 Cc Q3 Q4 Q7 slide 7 of 37 Compensating the -Stage Opamp v R C v out g m v R g v in C m7 R C Q 6 has V DS6 0 and is hard in the triode region. R C r ds W µ n C ox ---- L V eff6 6 R C Small signal analysis without present, right-half plane zero occurs and worsens phase-margin (7) slide 8 of 37

15 Including Compensating the -Stage Opamp R C (through Q6) places zero at ω z ( g m7 R C ) Zero moved to left-half plane to aid compensation Good practical choice is ω z. (8) (9) satisfied by letting R C g m (30) since g m and ω z ( R C ) if R C» g m7 slide 9 of 37 Design Procedure ) Find with R c 0 for a 55 o phase margin Arbitrarily choose C C 5 pf and set R C 0 Using SPICE, find frequency where a 5 phase shift exists, define gain as A Choose new so becomes unity-gain frequency of the loop gain results in a 55 phase margin. Achieved by setting C C A Might need to iterate on a couple of times using SPICE slide 30 of 37

16 Design Procedure ) Choose R C according to R C (3) Increases by about 0 percent, leaving zero near final Check that gain continues to decrease at frequencies above the new 3) If phase margin not adequate, increase while leaving R C constant slide 3 of 37 Design Procedure 4) Replace R C by a transistor R C r ds W µ n C ox ---- L V eff6 6 SPICE can be used again to fine-tune the device dimensions to optimize phase margin (3) slide 3 of 37

17 Process and Temperature Independence Can show non-dominant pole roughly given by ω p Recall zero given by g m C + C ω z ( g m7 R C ) If R C tracks inverse of g m7 then zero will track ω p R C r ds µ n C ox ( W L) 6 V eff6 g m7 µ n C ox ( W L) 7 V eff7 (33) (34) (35) (36) slide 33 of 37 Process and Temperature Independence Need to ensure V eff6 and temperature variations V bias V eff7 independent of process Q Q6 5 Q 5 First set V eff3 V a 5 Q6 Q3 Q7 V b V eff7 which makes V a V b slide 34 of 37

18 Process and Temperature Independence Since V a I D µ n C ox ( W L) 7 V b I D I D3 ( W L) ( W L) 3 I D µ n C ox ( W L) 3 and gates of Q and Q6 same V eff V eff6 (37) (38) (39) V eff V eff V eff3 µ n C ox ( W L) V eff I D3 I D µ n C ox ( W L) ( W L) ( W L) 3 (40) slide 35 of 37 5 Q0 Stable Transconductance Biasing Q 5 Can bias on-chip g m to a resistor V GS3 V GS5 + I D5 R B (4) I D µ n C ox ( W L) 3 I D5 µ n C ox ( W L) I R D5 B 5 (4) Q4 Q 5 5 But I D3 I D5 and rearrange W L R µ n C ox ( W L) 3 I W L B 5 D3 (43) 00 R B Q5 Q3 5 Recall g m3 µ n C ox ( W L) 3 I D3 ( W L) g m R ( W L) B 5 (44) slide 36 of 37

19 Stable Transconductance Biasing Transconductance of Q 3 determined by geometric ratios only Independent of power-supply voltages, process parameters, temperature, etc. For special case ( W L) 5 4( W L) 3 g m Note that high-temp will decrease mobility and hence increase effective gate-source voltages Roughly 5% increase for 00 degree increase Requires a start-up circuit (might have all 0 currents) R B (45) slide 37 of 37

EE-612: Lecture 28: Overview of SOI Technology

EE-612: Lecture 28: Overview of SOI Technology EE-612: Lecture 28: Overview of SOI Technology Mark Lundstrom Electrical and Computer Engineering Purdue University West Lafayette, IN USA Fall 2006 NCN www.nanohub.org Lundstrom EE-612 F06 1 outline 1)

More information

HOMEWORK 4 and 5. March 15, Homework is due on Monday March 30, 2009 in Class. Answer the following questions from the Course Textbook:

HOMEWORK 4 and 5. March 15, Homework is due on Monday March 30, 2009 in Class. Answer the following questions from the Course Textbook: HOMEWORK 4 and 5 March 15, 2009 Homework is due on Monday March 30, 2009 in Class. Chapter 7 Answer the following questions from the Course Textbook: 7.2, 7.3, 7.4, 7.5, 7.6*, 7.7, 7.9*, 7.10*, 7.16, 7.17*,

More information

Lecture 030 Integrated Circuit Technology - I (5/8/03) Page 030-1

Lecture 030 Integrated Circuit Technology - I (5/8/03) Page 030-1 Lecture 030 Integrated Circuit Technology - I (5/8/03) Page 030-1 LECTURE 030 INTEGRATED CIRCUIT TECHNOLOGY - I (References [7,8]) Objective The objective of this presentation is: 1.) Illustrate integrated

More information

Project III. 4: THIN FILM DEVICES FOR LARGE AREA ELECTRONICS

Project III. 4: THIN FILM DEVICES FOR LARGE AREA ELECTRONICS Project III. 4: THIN FILM DEVICES FOR LARGE AREA ELECTRONICS Project leader: Dr D.N. Kouvatsos Collaborating researchers from other projects: Dr D. Davazoglou Ph.D. candidates: M. Exarchos, L. Michalas

More information

RT9808. Micro-Power Voltage Detectors. Preliminary. Features. General Description. Applications. Ordering Information. Pin Configurations

RT9808. Micro-Power Voltage Detectors. Preliminary. Features. General Description. Applications. Ordering Information. Pin Configurations RT988 Micro-Power oltage Detectors General Description The RT988 is a micro-power voltage detector supervising the power supply voltage level for microprocessors (µp) or digital systems. It provides internally

More information

Challenges of Silicon Carbide MOS Devices

Challenges of Silicon Carbide MOS Devices Indo German Winter Academy 2012 Challenges of Silicon Carbide MOS Devices Arjun Bhagoji IIT Madras Tutor: Prof. H. Ryssel 12/17/2012 1 Outline What is Silicon Carbide (SiC)? Why Silicon Carbide? Applications

More information

CMOS Manufacturing Process

CMOS Manufacturing Process CMOS Manufacturing Process CMOS Process A Modern CMOS Process gate-oxide TiSi 2 AlCu Tungsten SiO 2 n+ p-well p-epi poly n-well p+ SiO 2 p+ Dual-Well Trench-Isolated CMOS Process Circuit Under Design V

More information

Horseshoes, Hand Grenades, and Timing Signoff: When Getting Close is Good Enough

Horseshoes, Hand Grenades, and Timing Signoff: When Getting Close is Good Enough Horseshoes, Hand Grenades, and Timing Signoff: When Getting Close is Good Enough Arvind NV, Krishna Panda, Anthony Hill Inc. March 2014 Outline Motivation Uncertainty in SOC Design Leveraging Uncertainty

More information

Memory Devices. Ki-Nam Kim, President, Institut of Technology Samsung Electronics, 2010 IEDM, San Francisco.

Memory Devices. Ki-Nam Kim, President, Institut of Technology Samsung Electronics, 2010 IEDM, San Francisco. Memory Devices In Korea now, Samsung : 2010, 30nm 2Gb DDRS DRAM/DDR3 SRAM 2011, Invest US $12 bil. for 20nm & SysLSI. Hynix : 2010, 26nm MLC- NAND Flash 2011, 30nm 4Gb DRAM At 2020, the demands of computing

More information

Advanced CMOS Process Technology Part 3 Dr. Lynn Fuller

Advanced CMOS Process Technology Part 3 Dr. Lynn Fuller MICROELECTRONIC ENGINEERING ROCHESTER INSTITUTE OF TECHNOLOGY Part 3 Dr. Lynn Fuller Webpage: http://people.rit.edu/lffeee Electrical and Microelectronic Engineering Rochester Institute of Technology 82

More information

Lezioni di Tecnologie e Materiali per l Elettronica

Lezioni di Tecnologie e Materiali per l Elettronica Lezioni di Tecnologie e Materiali er l Elettronica Danilo Manstretta danilo.manstretta@univ.it microlab.univ.it Outline Passive comonents Resistors Caacitors Inductors Printed circuits technologies Materials

More information

Fabrication and Layout

Fabrication and Layout Fabrication and Layout Kenneth Yun UC San Diego Adapted from EE271 notes, Stanford University Overview Semiconductor properties How chips are made Design rules for layout Reading Fabrication: W&E 3.1,

More information

Tri-Gate Transistor Architecture with High-k Gate Dielectrics, Metal Gates and Strain Engineering

Tri-Gate Transistor Architecture with High-k Gate Dielectrics, Metal Gates and Strain Engineering Tri-Gate Transistor Architecture with High-k Gate Dielectrics, Metal Gates and Strain Engineering Jack Kavalieros, Brian Doyle, Suman Datta, Gilbert Dewey, Mark Doczy, Ben Jin, Dan Lionberger, Matthew

More information

Temperature stable design of Microwave Circulators using HFSS and Maxwell. Dr. Thomas Lingel

Temperature stable design of Microwave Circulators using HFSS and Maxwell. Dr. Thomas Lingel Lingel, 2003 Temperature stable design of Microwave Circulators using HFSS and Maxwell Dr. Thomas Lingel Outline Motivation Principle of Operation of Circulators Modeling of the RF behavior using HFSS

More information

ECSE 404: CONTROL SYSTEMS ANALYSIS AND ACTIVE CONTROL OF HIGH-SPEED RAIL PANTOGRAPH SYSTEM MATTHEW BOWEN

ECSE 404: CONTROL SYSTEMS ANALYSIS AND ACTIVE CONTROL OF HIGH-SPEED RAIL PANTOGRAPH SYSTEM MATTHEW BOWEN ECSE 44: CONTROL SYSTEMS ANALYSIS AND ACTIVE CONTROL OF HIGH-SPEED RAIL PANTOGRAPH SYSTEM MATTHEW BOWEN 26327934 MATTHEW.BOWEN@MAIL.MCGILL.CA 1 Introduction Some high-speed rail systems are powered by

More information

Long-term reliability of SiC devices. Power and Hybrid

Long-term reliability of SiC devices. Power and Hybrid Long-term reliability of SiC devices Power and Hybrid Rob Coleman Business Development and Applications Manager TT electronics, Power and Hybrid Roger Tall Product Specialist Charcroft Electronics Ltd

More information

Isolation Technology. Dr. Lynn Fuller

Isolation Technology. Dr. Lynn Fuller ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Isolation Technology Dr. Lynn Fuller Motorola Professor 82 Lomb Memorial Drive Rochester, NY 14623-5604 Tel (585) 475-2035 Fax (585) 475-5041

More information

LD2985. Very low drop and low noise voltage regulator with inhibit function. Features. Description

LD2985. Very low drop and low noise voltage regulator with inhibit function. Features. Description ery low drop and low noise voltage regulator with inhibit function Datasheet - production data to 30 µrms. Typical application are in cellular phone, palmtop laptop computer, personal digital assistant

More information

CMOS FABRICATION. n WELL PROCESS

CMOS FABRICATION. n WELL PROCESS CMOS FABRICATION n WELL PROCESS Step 1: Si Substrate Start with p- type substrate p substrate Step 2: Oxidation Exposing to high-purity oxygen and hydrogen at approx. 1000 o C in oxidation furnace SiO

More information

Nanosilicon single-electron transistors and memory

Nanosilicon single-electron transistors and memory Nanosilicon single-electron transistors and memory Z. A. K. Durrani (1, 2) and H. Ahmed (3) (1) Electronic Devices and Materials Group, Engineering Department, University of Cambridge, Trumpington Street,

More information

Cal-Chip Electronics, Incorporated Thick Film Chip Resistors - RM Series

Cal-Chip Electronics, Incorporated Thick Film Chip Resistors - RM Series Thick Film Chip Resistors - RM Series Fixed Chip Resistors manufactured for more compact electronic components and automatic mounting system. These Chip Resistors have electrical stability and mechanical

More information

Lecture 2. Fabrication and Layout

Lecture 2. Fabrication and Layout Lecture 2 Fabrication and Layout Mark Horowitz Modified by Azita Emami Computer Systems Laboratory Stanford University azita@stanford.edu 1 Overview Reading W&E 3.1(scan), 3.2.1, 3.3.1 - Fabrication W&E

More information

Status Report: Optimization and Layout Design of AGIPD Sensor

Status Report: Optimization and Layout Design of AGIPD Sensor Status Report: Optimization and Layout Design of AGIPD Sensor Joern Schwandt, Jiaguo Zhang and Robert Klanner Institute for Experimental Physics, Hamburg University Jiaguo Zhang, Hamburg University 10th

More information

Silicon Wafer Processing PAKAGING AND TEST

Silicon Wafer Processing PAKAGING AND TEST Silicon Wafer Processing PAKAGING AND TEST Parametrical test using test structures regularly distributed in the wafer Wafer die test marking defective dies dies separation die fixing (not marked as defective)

More information

Lecture Retaining Wall Week 12

Lecture Retaining Wall Week 12 Lecture Retaining Wall Week 12 Retaining walls which provide lateral support to earth fill embankment or any other form of material which they retain them in vertical position. These walls are also usually

More information

NOVEL MATERIALS FOR IMPROVED QUALITY OF RF-PA IN BASE-STATION APPLICATIONS

NOVEL MATERIALS FOR IMPROVED QUALITY OF RF-PA IN BASE-STATION APPLICATIONS Novel Material for Improved Quality of RF-PA in Base-Station Applications Co-Authored by Nokia Research Center and Freescale Semiconductor Presented at 10 th International Workshop on THERMal INvestigations

More information

Study of a Thermal Annealing Approach for Very High Total Dose Environments

Study of a Thermal Annealing Approach for Very High Total Dose Environments Study of a Thermal Annealing Approach for Very High Total Dose Environments S. Dhombres 1-2, J. Boch 1, A. Michez 1, S. Beauvivre 2, D. Kraehenbuehl 2, F. Saigné 1 RADFAC 2015 26/03/2015 1 Université Montpellier,

More information

R Sensor resistance (Ω) ρ Specific resistivity of bulk Silicon (Ω cm) d Diameter of measuring point (cm)

R Sensor resistance (Ω) ρ Specific resistivity of bulk Silicon (Ω cm) d Diameter of measuring point (cm) 4 Silicon Temperature Sensors 4.1 Introduction The KTY temperature sensor developed by Infineon Technologies is based on the principle of the Spreading Resistance. The expression Spreading Resistance derives

More information

DESIGN OF POST-TENSIONED MEMBERS IN BENDING USING ACI SIMPLIFIED PROCEDURE

DESIGN OF POST-TENSIONED MEMBERS IN BENDING USING ACI SIMPLIFIED PROCEDURE Structural Concrete Software System TN 179 Aci_simplified_M_design3 011005 DESIGN OF POST-TENSIONED MEMBERS IN BENDING USING ACI 318 2002 SIMPLIFIED PROCEDURE 1. BACKGROUND 1.1 GENERAL The following describes

More information

Development of a Deep-Submicron CMOS Process for Fabrication of High Performance 0.25 mm Transistors

Development of a Deep-Submicron CMOS Process for Fabrication of High Performance 0.25 mm Transistors Development of a Deep-Submicron CMOS Process for Fabrication of High Performance 0.25 mm Transistors Michael Aquilino M.S. Thesis Defense Department May 19, 2006 Motivation o Enable the department to continue

More information

RADIATION HARDNESS OF MEMRISTIVE SYSTEMS

RADIATION HARDNESS OF MEMRISTIVE SYSTEMS RADIATION HARDNESS OF MEMRISTIVE SYSTEMS A. FANTINI ON BEHALF OF IMEC RRAM TEAM AND VU ISDE TEAM Workshop on Memristive systems for Space applications ESTEC - 30/04/2015 OUTLINE Introduction RRAM for space

More information

Cost of Integrated Circuits

Cost of Integrated Circuits Cost of IC Design 1 Cost of Integrated Circuits NRE (Non-Recurrent Engineering) costs fixed design time and effort, mask generation independent of sales volume / number of products one-time cost factor

More information

Stack-up and routing optimization by understanding micro-scale PCB effects

Stack-up and routing optimization by understanding micro-scale PCB effects Stack-up and routing optimization by understanding micro-scale PCB effects Authors: G. Romo, CST of America Chudy Nwachukwu, Isola Group Reydezel Torres-Torres, INAOE Seung-Won Baek, CST of America Martin

More information

Self-oscillating Half-bridge Driver

Self-oscillating Half-bridge Driver Self-oscillating Half-bridge Driver Features Floating channel designed for bootstrap operation to +600V Noise immunity of transient voltage Under-voltage lockout Programmable oscillator frequency Matched

More information

NANOPERM - Design Considerations for advanced EMI filter chokes

NANOPERM - Design Considerations for advanced EMI filter chokes NANOPERM - Design Considerations for advanced EMI filter chokes May 26th 2004 PCIM, Nuremberg Fritz Rauscher MAGNETEC GmbH, Booth 525 in Hall 12 MAGNETEC GmbH www.magnetec.de 05/2004/ra 1/15 Content of

More information

C H A P T E R 7 Applying the BJT in Amplifier Design

C H A P T E R 7 Applying the BJT in Amplifier Design H A P T E R 7 Applying the BJT in Amplifier Design Microelectronic ircuits, Seventh Edition Sedra/Smith opyright 2010 by Oxford University Press, Inc. Obtaining a Voltage Amplifier v = V i R Microelectronic

More information

RT A, Ultra-Low Dropout, Ultra-Fast CMOS LDO Regulator. General Description. Features. Applications. Ordering Information. Marking Information

RT A, Ultra-Low Dropout, Ultra-Fast CMOS LDO Regulator. General Description. Features. Applications. Ordering Information. Marking Information RT987 A, Ultra-Low Dropout, Ultra-Fast CMOS LDO Regulator General Description The RT987 is a high-performance, A LDO regulator, offering extremely high PSRR and ultra-low dropout. Ideal for portable RF

More information

Lecture 26 - The "Long" Metal-Oxide-Semiconductor Field-Effect Transistor (cont.)

Lecture 26 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) 6.7205/3.435 - Integrated Microelectronic Devices - Spring 2007 Lecture 26-1 Lecture 26 - The "Long" Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) Contents: April 11, 2007 I. Current-voltage

More information

Robustness and Reliability - Facing new Quality Levels for Automotive ICs with Design for Yield

Robustness and Reliability - Facing new Quality Levels for Automotive ICs with Design for Yield International Cooperation Forum Automotive IC-Design Challenges Strategies Trends Munich, Germany, October 25, 2005 Robustness and Reliability - Facing new Quality Levels for Automotive ICs with Design

More information

CDR v1 Telescope Mechanical Design

CDR v1 Telescope Mechanical Design CDR v1 Telescope Mechanical Design Albert Lin The Aerospace Corporation Mechanical Engineer (310) 336-1023 albert.y.lin@aero.org 5/1/06 Overview Design Overview Instrument Requirements Mechanical Requirements

More information

CMOS VLSI Design M.Tech. First semester VTU Anil V. Nandi, ECE department, BVBCET, Hubli

CMOS VLSI Design M.Tech. First semester VTU Anil V. Nandi, ECE department, BVBCET, Hubli CMOS VLSI Design M.Tech. First semester VTU Anil V. Nandi, ECE department, BVBCET, Hubli-580031. Contents: Semiconductor Technology overview Silicon Growth/Processing,Oxidation, Diffusion, Epitaxy, deposition,

More information

State of the art quality of a GeOx interfacial passivation layer formed on Ge(001)

State of the art quality of a GeOx interfacial passivation layer formed on Ge(001) APPLICATION NOTE State of the art quality of a Ox interfacial passivation layer formed on (001) Summary A number of research efforts have been made to realize Metal-Oxide-Semiconductor Field Effect Transistors

More information

CHAPTER 2 - CMOS TECHNOLOGY

CHAPTER 2 - CMOS TECHNOLOGY CMOS Analog Circuit Design Page 2.0-1 CHAPTER 2 - CMOS TECHNOLOGY Chapter Outline 2.1 Basic MOS Semiconductor Fabrication Processes 2.2 CMOS Technology 2.3 PN Junction 2.4 MOS Transistor 2.5 Passive Components

More information

Layout-related stress effects on TID-induced leakage current

Layout-related stress effects on TID-induced leakage current Layout-related stress effects on TID-induced leakage current Nadia Rezzak, R. D. Schrimpf, M. L. Alles, En Xia Zhang, Daniel M. Fleetwood, Yanfeng Albert Li Radiation Effects Group Vanderbilt University,

More information

Tantalum Wet Electrolytic Capacitor

Tantalum Wet Electrolytic Capacitor INTRODUCTION The structure of a Tantalum Wet Electrolytic Capacitor consists of four main elements: a primary electrode (anode), dielectric, a secondary electrode system (cathode) and a wet (liquid) electrolyte.

More information

Simulation of Inverse Piezoelectric effect in degradation AlGaN/GaN devices. David Horton, Dr M E Law

Simulation of Inverse Piezoelectric effect in degradation AlGaN/GaN devices. David Horton, Dr M E Law Simulation of Inverse Piezoelectric effect in degradation AlGaN/GaN devices David Horton, Dr M E Law Simulation Approach FLOORS Gate t > 0 AlGaN GaN Defect at gate edge t=0, As Built 1] Park S.Y, Kim,

More information

FRSM Series (Z1 Foil Technology)

FRSM Series (Z1 Foil Technology) (Z1 Foil Technology) UltraHigh-PrecisionFRSMWrap-AroundChipResistors,Z1FoilTechnologyConfiguration Resistors, Z1 Foil Technology Configuration with TCR of ±0.05 ppm/ C and Improved Load-Life Stability

More information

Increased Efficiency and Improved Reliability in ORing functions using Trench Schottky Technology

Increased Efficiency and Improved Reliability in ORing functions using Trench Schottky Technology Increased Efficiency and Improved Reliability in ORing functions using Trench Schottky Technology Davide Chiola, Stephen Oliver, Marco Soldano International Rectifier, El Segundo, USA. As presented at

More information

Silicon Oxides: SiO 2

Silicon Oxides: SiO 2 Silicon Oxides: SiO 2 Uses: diffusion masks surface passivation gate insulator (MOSFET) isolation, insulation Formation: grown / native thermal: highest quality anodization deposited: C V D, evaporate,

More information

Permeability characterization of ferrites in the radio frequency range

Permeability characterization of ferrites in the radio frequency range Permeability characterization of ferrites in the radio frequency range Author: Mireia Alenyà Sistané Advisor: Arturo Lousa Rodríguez Facultat de Física, Universitat de Barcelona, Diagonal 645, 08028 Barcelona,

More information

IMPROVED PRODUCT. S Series. High Precision Foil Resistor with TCR of ± 2.0ppm/ C, Tolerance of ± 0.005% and Load Life Stability of ± 0.

IMPROVED PRODUCT. S Series. High Precision Foil Resistor with TCR of ± 2.0ppm/ C, Tolerance of ± 0.005% and Load Life Stability of ± 0. THROUGH HOLE S Series High Precision Foil Resistor with TCR of ± 2.0ppm/ C, Any value at any tolerance available within resistance range INTRODUCTION Bulk Metal Foil (BMF) Technology outperforms all other

More information

Description. Applications

Description. Applications 3.5x2.8mm SURFACE MOUNT LED LAMP Features Package Dimensions ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Industry standard PLCC-4 package. High reliability LED

More information

Mobile Device Passive Integration from Wafer Process

Mobile Device Passive Integration from Wafer Process Mobile Device Passive Integration from Wafer Process Kai Liu, YongTaek Lee, HyunTai Kim, and MaPhooPwint Hlaing STATS ChipPAC, Inc. 1711 West Greentree, Suite 117, Tempe, Arizona 85284, USA Tel: 48-222-17

More information

Supplementary Materials: A Critical Evaluation of the Influence of the Dark Exchange Current on the Performance of Dye Sensitized Solar Cells

Supplementary Materials: A Critical Evaluation of the Influence of the Dark Exchange Current on the Performance of Dye Sensitized Solar Cells Supplementary Materials: A Critical Evaluation of the Influence of the Dark Exchange Current on the Performance of Dye Sensitized Solar Cells Rodrigo García Rodríguez, Julio Villanueva Cab, Juan A. Anta

More information

EE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009

EE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009 Suggested Reading EE40 Lec 22 IC Fabrication Technology Prof. Nathan Cheung 11/19/2009 300mm Fab Tour http://www-03.ibm.com/technology/manufacturing/technology_tour_300mm_foundry.html Overview of IC Technology

More information

Induction Heating. Jean Callebaut, Laborelec. 1 Introduction Physical principles Induction Installations... 5

Induction Heating. Jean Callebaut, Laborelec. 1 Introduction Physical principles Induction Installations... 5 Induction Heating Jean Callebaut, Laborelec 1 Introduction... 2 2 Physical principles... 2 2.1 Electromagnetic induction... 2 2.2 The Joule-effect... 3 2.3 Penetration depth... 3 3 Induction Installations...

More information

Annual Meeting. North Carolina State University Dr. Veena Misra. January 17 19, 2017 December

Annual Meeting. North Carolina State University Dr. Veena Misra. January 17 19, 2017 December Annual Meeting North Carolina State University Dr. Veena Misra January 17 19, 2017 December 8 2015 1 Misra Group at NCSU Over 9 years experience in wide band gap research on SiC, GaN and Ga2O3. World leaders

More information

Schottky-Barrier-Height Modulation of Ni Silicide/Si Contacts by Insertion of Thin Er or Pt Layers

Schottky-Barrier-Height Modulation of Ni Silicide/Si Contacts by Insertion of Thin Er or Pt Layers Schottky-Barrier-Height Modulation of Ni Silicide/Si Contacts by Insertion of Thin Er or Pt Layers Yoshihisa Ohishi 1, Kohei Noguchi 1, Kuniyuki Kakushima 2, Parhat Ahmet 1, Kazuo Tsutsui 2, Nobuyuki Sugii

More information

Piezoresistance in Silicon. Dr. Lynn Fuller Webpage:

Piezoresistance in Silicon. Dr. Lynn Fuller Webpage: ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Piezoresistance in Silicon Webpage: http://people.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604 Tel (585) 475-2035 Email:

More information

Implant Metrology for Bonded SOI Wafers Using a Surface Photo-Voltage Technique

Implant Metrology for Bonded SOI Wafers Using a Surface Photo-Voltage Technique Implant Metrology for Bonded SOI Wafers Using a Surface Photo-Voltage Technique Adam Bertuch a, Wesley Smith a, Ken Steeples a, Robert Standley b, Anca Stefanescu b, and Ron Johnson c a QC Solutions Inc.,

More information

H REPETITIVE CURRENT CONTROLLER FOR

H REPETITIVE CURRENT CONTROLLER FOR H REPETITIVE CURRENT CONTROLLER FOR GRID-CONNECTED INVERTERS Tomas Hornik and Qing-Chang Zhong Dept. of Electrical Eng. & Electronics The University of Liverpool UK Email: Q.Zhong@liv.ac.uk Acknowledgement

More information

RT8725. Single-Phase BLDC Fan Driver IC. Features. General Description. Applications

RT8725. Single-Phase BLDC Fan Driver IC. Features. General Description. Applications RT8725 Single-Phase BLDC Fan Driver IC General Description The RT8725 is a single-phase driver IC for fan motors. Rotation speed is controlled by input signal. The RT8725 provides several protection features

More information

Tantalum and Niobium Technology Roadmap

Tantalum and Niobium Technology Roadmap Tantalum and Technology Roadmap T. Zednicek, B. Vrana AVX Czech Republic s.r.o., Dvorakova 328, 563 01 Lanskroun, Czech Republic Phone: +420 465 358 126, Fax: +420 465 358 128 W. A. Millman, J. Gill AVX

More information

IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 55, NO. 4, AUGUST

IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 55, NO. 4, AUGUST IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 55, NO. 4, AUGUST 2008 1833 Radiation Effects in MOS Oxides James R. Schwank, Fellow, IEEE, Marty R. Shaneyfelt, Fellow, IEEE, Daniel M. Fleetwood, Fellow, IEEE,

More information

Lecture 4. Oxidation (applies to Si and SiC only) Reading: Chapter 4

Lecture 4. Oxidation (applies to Si and SiC only) Reading: Chapter 4 Lecture 4 Oxidation (applies to Si and SiC only) Reading: Chapter 4 Introduction discussion: Oxidation: Si (and SiC) Only The ability to grow a high quality thermal oxide has propelled Si into the forefront

More information

Z Series (Z-Foil) Vishay Foil Resistors.

Z Series (Z-Foil) Vishay Foil Resistors. Z Series (Z-Foil) Ultra High Precision Z-Foil Resistor with TCR of ± 0.05 ppm/ C, Tolerance of ± 0.005 % (50 ppm), Load Life Stability of ± 0.005 %, ESD Immunity up to 25 kv and Thermal EMF of 0.05 µv/

More information

6 Generator Testing Data Analysis

6 Generator Testing Data Analysis RMS Voltage 6 Generator Testing Data Analysis 1. Using the generator equations below. 2. Insert your measured component values. 3. Create a spread sheet and plot the data. 4. How close is the calculated

More information

Surface Mount Sense Resistors

Surface Mount Sense Resistors Resistors Surface Mount Flexible leads for thermal expansion Open-air design reduces PCB heating Values down to 1milliohm Element TCR ±2ppm/ C Zero-ohm 65A jumper version RoHS compliant All parts are Pb-free

More information

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation.

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation. Figure 2.1 (p. 58) Basic fabrication steps in the silicon planar process: (a) oxide formation, (b) selective oxide removal, (c) deposition of dopant atoms on wafer, (d) diffusion of dopant atoms into exposed

More information

4.4 Single Load Path Structure

4.4 Single Load Path Structure 4.4 Single Load Path Structure For a single load path structure, the only means to protect the safety is to prevent the damage growth from degrading the strength of the structure to less than the design

More information

High Resolution Neuro-Electronic Interface System for Electrophysiological Experiments

High Resolution Neuro-Electronic Interface System for Electrophysiological Experiments High Resolution Neuro-Electronic Interface System for Electrophysiological Experiments Research presentation by Neil Joye (LSM, EPFL) on the 20 th June 2007 Content Introduction State of the Art 3D tip

More information

Materials Characterization

Materials Characterization Materials Characterization C. R. Abernathy, B. Gila, K. Jones Cathodoluminescence (CL) system FEI Nova NanoSEM (FEG source) with: EDAX Apollo silicon drift detector (TE cooled) Gatan MonoCL3+ FEI SEM arrived

More information

Laser Spike Annealing for sub-20nm Logic Devices

Laser Spike Annealing for sub-20nm Logic Devices Laser Spike Annealing for sub-20nm Logic Devices Jeff Hebb, Ph.D. July 10, 2014 1 NCCAVS Junction Technology Group Semicon West Meeting July 10, 2014 Outline Introduction Pattern Loading Effects LSA Applications

More information

2SD1980 V CEO 100V I C 2A R 1 R kΩ 300Ω. Datasheet. Power Transistor (100V, 2A)

2SD1980 V CEO 100V I C 2A R 1 R kΩ 300Ω. Datasheet. Power Transistor (100V, 2A) 2SD1980 Power Transistor (100V, 2A) Datasheet loutline Parameter Value V CEO 100V TO-252 SC-63 I C 2A R 1 R 2 3.5kΩ 300Ω CPT lfeatures 1)Darlington connection for high DC current again. 2)Built-in resistor

More information

The Trouble with Intercity Travel Demand Models. Presentation Outline

The Trouble with Intercity Travel Demand Models. Presentation Outline The Trouble with Intercity Travel Demand Models Eric J. Miller, Ph.D. Bahen-Tanenbaum Professor, Dept. of Civil Engineering Director, Joint Program in Transportation University of Toronto 2004 Annual Meeting

More information

Interconnects. Outline. Interconnect scaling issues Aluminum technology Copper technology. Properties of Interconnect Materials

Interconnects. Outline. Interconnect scaling issues Aluminum technology Copper technology. Properties of Interconnect Materials Interconnects Outline Interconnect scaling issues Aluminum technology Copper technology 1 Properties of Interconnect Materials Metals Silicides Barriers Material Thin film Melting resistivity point ( C)

More information

Despina C Moschou. National and Kapodistrian University of Athens, Department of Informatics and Telecommunications

Despina C Moschou. National and Kapodistrian University of Athens, Department of Informatics and Telecommunications Fabrication technology development of thin film transistors optimized with respect to the structure of the silicon films that results from the crystallization process Despina C Moschou National and Kapodistrian

More information

DNA Circuits for Analog Computing

DNA Circuits for Analog Computing DNA Circuits for Analog Computing Tianqi Song Department of Computer Science Duke University 1 Outline Motivation What is DNA computing? Why are we interested in DNA computing? What has been done? Why

More information

SnO 2, ZnO and related polycrystalline compound semiconductors: An overview and review on the voltage-dependent resistance (non-ohmic) feature

SnO 2, ZnO and related polycrystalline compound semiconductors: An overview and review on the voltage-dependent resistance (non-ohmic) feature Available online at www.sciencedirect.com Journal of the European Ceramic Society 28 (2008) 505 529 Review SnO 2, ZnO and related polycrystalline compound semiconductors: An overview and review on the

More information

Solid Tantalum Chip Capacitors. Shenzhen Sunlord Electronics Co., Ltd

Solid Tantalum Chip Capacitors. Shenzhen Sunlord Electronics Co., Ltd Solid Tantalum Chip Capacitors Content Tantalum capacitors capabilities Tantalum capacitors applications Features of tantalum capacitor Solid chip tantalum capacitor provides excellent characteristics

More information

Brain Inspired Semiconductor Device Technology

Brain Inspired Semiconductor Device Technology US-KOREA NANO FORUM SEOUL, SEPTEMBER 26, 2016 Brain Inspired Semiconductor Device Technology Byoung Hun Lee Director, Center for Emerging Electronic Materials and Systems (CEEDS) School of Material Science

More information

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor) RN2110, RN2111

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor) RN2110, RN2111 , TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor), Switching, Inverter Circuit, Interface Circuit and Driver Circuit Applications Built-in bias resistors

More information

Oxide Growth. 1. Introduction

Oxide Growth. 1. Introduction Oxide Growth 1. Introduction Development of high-quality silicon dioxide (SiO2) has helped to establish the dominance of silicon in the production of commercial integrated circuits. Among all the various

More information

Reference Only. Spec. No. JENF243E-0002Q-01 P1 / 8

Reference Only. Spec. No. JENF243E-0002Q-01 P1 / 8 Spec. No. JENF243E-0002Q-01 P1 / 8 Chip EMIFIL LC Combined Type for Large Current NFE31PT 1E9 Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Type for Large

More information

Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz glass.

Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz glass. Figure 16.31: Two-dimensional representations of (a) a quartz crystal and (b) a quartz glass. Figure 16.28: The p orbitals (a) perpendicular to the plane of th carbon ring system in graphite can combine

More information

Introduction to gene expression microarray data analysis

Introduction to gene expression microarray data analysis Introduction to gene expression microarray data analysis Outline Brief introduction: Technology and data. Statistical challenges in data analysis. Preprocessing data normalization and transformation. Useful

More information

RK7002BM. V DSS 60V SOT-23 R DS(on) (Max.) 2.4Ω SST3 I D ±250mA P D 350mW. Nch 60V 250mA Small Signal MOSFET Datasheet.

RK7002BM. V DSS 60V SOT-23 R DS(on) (Max.) 2.4Ω SST3 I D ±250mA P D 350mW. Nch 60V 250mA Small Signal MOSFET Datasheet. RK7002BM Nch 60V 250mA Small Signal MOSFET Datasheet loutline V DSS 60V SOT-23 R DS(on) (Max.) 2.4Ω SST3 I D ±250mA P D 350mW lfeatures 1) Very fast switching 2) Ultra low voltage drive (2.5V drive) 3)

More information

Exchange Bias and Bi- stable Magneto- Resistance States in Amorphous TbFeCo and TbSmFeCo Thin Films

Exchange Bias and Bi- stable Magneto- Resistance States in Amorphous TbFeCo and TbSmFeCo Thin Films Exchange Bias and Bi- stable Magneto- Resistance States in Amorphous TbFeCo and TbSmFeCo Thin Films Chung Ting (Marco) Ma University of Virginia 4th Year Seminar 1 Outline Background Why are we interested

More information

RELIABILITY PREDICTION REPORT

RELIABILITY PREDICTION REPORT RELIABILITY PREDICTION REPORT FOR THE AIRBORNE DIRECT SERIAL/ETHERNET 46D1005-01 Prepared by DPAC Technologies September 2004 46D1005-01 9/7/2004 A 2 of 15 Table of Contents Section Title Page 1.0 INTRODUCTION

More information

Semiconductor Device Fabrication Study

Semiconductor Device Fabrication Study Proceedings of The National Conference on Undergraduate Research (NCUR) 2003 University of Utah, Salt Lake City, Utah March 13-15, 2003 Semiconductor Device Fabrication Study Tsung-Ta Ho and Michael R.

More information

VLSI Technology Dr. Nandita Dasgupta Department of Electrical Engineering Indian Institute of Technology, Madras

VLSI Technology Dr. Nandita Dasgupta Department of Electrical Engineering Indian Institute of Technology, Madras VLSI Technology Dr. Nandita Dasgupta Department of Electrical Engineering Indian Institute of Technology, Madras Lecture - 33 Problems in LOCOS + Trench Isolation and Selective Epitaxy So, we are discussing

More information

1024K X 16 BIT LOW POWER CMOS SRAM

1024K X 16 BIT LOW POWER CMOS SRAM FEATURES Process Technology : 0.15μm Full CMOS Organization : 1M x 16 bit Power Supply Voltage : 2.7V ~ 3.6V Low Data Retention Voltage : 1.5V(Min.) Three state output and TTL Compatible Package Type :

More information

CMOS Manufacturing process. Circuit designer. Design rule set. Process engineer. Set of optical masks. Fabrication process.

CMOS Manufacturing process. Circuit designer. Design rule set. Process engineer. Set of optical masks. Fabrication process. CMOS Manufacturing process Circuit design Set of optical masks Fabrication process Circuit designer Design rule set Process engineer All material: Chap. 2 of J. Rabaey, A. Chandrakasan, B. Nikolic, Digital

More information

CMP Process Development for the Via- Middle 3D TSV Applications at 28nm Technology Node

CMP Process Development for the Via- Middle 3D TSV Applications at 28nm Technology Node CMP Process Development for the Via- Middle 3D TSV Applications at 28nm Technology Node UMC/ ATD_AM / CMP Department T. C. Tsai, W. C. Tsao, Welch Lin, C. L. Hsu, C. L. Lin, C. M. Hsu, J. F. Lin, C. C.

More information

NaNOcRysTallINE VITROPERM. EMc PROducTs. advanced MaTERIals THE KEy TO PROGREss

NaNOcRysTallINE VITROPERM. EMc PROducTs. advanced MaTERIals THE KEy TO PROGREss NaNOcRysTallINE VITROPERM EMc PROducTs advanced MaTERIals THE KEy TO PROGREss VITROPERM NaNOcRysTallINE EMc PROducTs VacuuMscHMElZE GmbH & co. KG (Vac) is a leading global manufacturer of modern magnetic

More information

Embossed Tape Reel size (mm) 180 lapplication Type Tape width (mm) 8 Switching Basic ordering unit (pcs) 3000

Embossed Tape Reel size (mm) 180 lapplication Type Tape width (mm) 8 Switching Basic ordering unit (pcs) 3000 RSC002P03 Pch -30V -250mA Small Signal MOSFET Datasheet loutline V DSS -30V SOT-23 R DS(on) (Max.) 1.4Ω I D ±250mA SST3 P D 200mW lfeatures 1) Drive circuits can be simple. 2) Built-in G-S Protection Diode.

More information

AMORPHOUS/ MICROCRYSTALLINE SILICON THIN FILM TRANSISTOR CHARACTERISTICS FOR LARGE SIZE OLED TELEVISION DRIVING

AMORPHOUS/ MICROCRYSTALLINE SILICON THIN FILM TRANSISTOR CHARACTERISTICS FOR LARGE SIZE OLED TELEVISION DRIVING AMORPHOUS/ MCROCRYSTALLNE SLCON THN FLM TRANSSTOR CHARACTERSTCS FOR LARGE SZE OLED TELEVSON DRVNG Takatoshi Tsujimura BM Japan Abstract Amorphous silicon TFT and the TFT with microcrystalline/amorphous

More information

Temperature Controllers: JC Series Digital Indicating Controllers. JC Series. High Performance Controllers...at the lowest prices anywhere!

Temperature Controllers: JC Series Digital Indicating Controllers. JC Series. High Performance Controllers...at the lowest prices anywhere! JC Series High Performance Controllers...at the lowest prices anywhere! Structure Units available in standard DIN sizes (1/16, 1/8, and 1/4 DIN) NEMA 4X protective construction Black enclosure Programmable

More information

1. Scope This document is applied to the magnetic sensor which uses a magnet.

1. Scope This document is applied to the magnetic sensor which uses a magnet. (subject to change without notice) 1/10 1. Scope This document is applied to the magnetic sensor which uses a magnet. 2. Part number 2-1 Part Description Magnetic Sensor 2-2 Murata Part Number MRMS205A

More information

Isolation of elements

Isolation of elements 1 In an IC, devices on the same substrate must be isolated from one another so that there is no current conduction between them. Isolation uses either the junction or dielectric technique or a combination

More information