Roundtable 3DIC & TSV: Ready for HVM? European 3D TSV Summit
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1 Roundtable 3DIC & TSV: Ready for HVM? European 3D TSV Summit Infineon VTI Xilinx Synopsys Micron CEA LETI 2013 Yann Guillou Business Development Manager Lionel Cadix Market & Technology Analyst, Advanced Packaging
2 Panelists Ron Huemoeller Senior VP Advanced Product Development Bradford Factor Director of Packaging Technology Jon Greenwood Director of Packaging R&D Heinz-Peter Wirtz Business Development Executive
3 3DIC & TSV: Ready for HVM? 3 Main questions Technology Readiness Supply Chain, Business Model, Ecosystem Readiness Role of European companies in the global 3DIC World
4 Question 1 Manufacturability readiness Ready for HVM Ready for initial ramp-up Not ready Manufacturability readiness dashboard in 2011 Yole Développement, 2011 TSV Middle Manufacturability TSV Lithography TSV etching TSV isolation Barrier & Seed layer TSV filling CMP Passiv./ UBM & Bumping Process performance (vs technical requirements) Repetability Uniformity & process Window Tool availability & maturity Throughput & cost of Ownership TSV Middle Manufacturability Stacking / Bonding C2C C2W W2W Temporary bonding to carrier Thinning / grinding TSV nailing Carrier debonding Inspection & metrology Testing (probing & final test) Process performance (vs technical requirements) Repetability Uniformity & process Window Tool availability & maturity Throughput & cost of Ownership
5 Question 1 Manufacturability readiness What are the remaining technological challenges for 3DIC and TSV manufacturing? Enabling process brick maturity perspective Cost effectiveness perspective
6 Question 2 Supply Chain, Business Model & Ecosystem * Existing business models represented in red, new business models in orange Substrate material suppliers (FR4, BT resin, Cu clad, etc ) Package substrate laminate suppliers PWB suppliers (motherboard) Design of chip & package Silicon Manufacturing «Front-end» Wafer Level Packaging «Middle -end» Package Assembly & Final test «Back-end» Sub-Module / Sub-systems Design & Assembly System / Product IDMs (Integrated Device Manufacturers) Fab-smart players (foundry services + focused internal investment in manufacturing & critical IP) Fab-less IC players Wafer foundries Integrated wafer / package manufacturing foundries OSATs (Open Source Assembly & Test houses) WLP houses (no need for traditional substrate) ODM / EMS / DMS (electronic design & manufacturing services) SiP design houses OEMs (Original Equipment Makers) Wafer Bumping houses PCB / PWB houses with Embedded die capability Front-end related materials suppliers FE related equipment suppliers BE Packaging materials suppliers BE Packaging equipment suppliers Passive comp. & SMT materials SMT equipment suppliers
7 Question 2 Supply Chain, Business Model & Ecosystem * Existing business models represented in red, new business models in orange Substrate material suppliers (FR4, BT resin, Cu clad, etc ) Package substrate laminate suppliers Design Silicon of chip & package Manufacturing «Front-end» Wafer Level Packaging Package Assembly & Final test «Middle -end» «Back-end» PWB suppliers (motherboard) Sub-Module / Sub-systems Design & Assembly System / Product IDMs (Integrated Device Manufacturers) Fab-light players (outsourcing + focused investment in manufacturing & critical IP) Integrated wafer / package manufacturing foundries Fab-less IC players Wafer foundries WLP houses (no need for traditional substrate) Front-end related materials suppliers FE related equipment suppliers 7 OEMs (electronic design & manufacturing services) (Original Equipment Makers) OSATs (Open Source Assembly & Test houses) Wafer Bumping houses 2013 ODM / EMS / DMS SiP design houses PCB / PWB houses with Embedded die capability BE Packaging materials suppliers BE Packaging equipment suppliers Passive comp. & SMT materials SMT equipment suppliers
8 Question 2 Supply Chain, Business Model & Ecosystem Supply chain Are more clarifications required? Business Models Which one do you work with? Which one do you favor? Ecosystem Is a full and efficient ecosystem in place? Any gaps identified?
9 Question 3 Europe in the Global 3D TSV World
10 Question 3 Europe in the Global 3D TSV World AMKOR, ASE, GLOBALFOUNDRIES, STATSChipPAC are among the leading companies in 3D TSV with customers worldwide From your perspective What is the role of Europe in 3D TSV? What do you and your company expect from European companies?
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