Practical guidelines for PWB Moisture Sensitivity, Packaging and Handling. Mumtaz Y. Bora Peregrine Semiconductor San Diego, CA, USA

Size: px
Start display at page:

Download "Practical guidelines for PWB Moisture Sensitivity, Packaging and Handling. Mumtaz Y. Bora Peregrine Semiconductor San Diego, CA, USA"

Transcription

1 Practical guidelines for PWB Moisture Sensitivity, Packaging and Handling Mumtaz Y. Bora Peregrine Semiconductor San Diego, CA, USA

2 Agenda and Overview Industry Standards for Moisture Sensitivity Packages Package Handling/Baking/Packaging Guidelines PWB Handling/ Baking/Packaging Guidelines Controls at PWB/Assembly Site Summary

3 Moisture Classification Level and Floor Life Level Floor life (out of bag) at factory ambient <30 C/60% RH or as stated 1 Unlimited at <30 C/85% RH 2 1 year 2a 4 weeks hours 4 72 hours 5 48 hours 5a 24 hours 6 Mandatory bake before use. After bake, must be reflowed within the time limit specified on the labe

4 Handling PWB Moisture Sensitivity J-STD 020E -03/2008- IC Package MSL Class J-STD 033C 01/2007 Assembly MSL Floor Life J-STD 075 Non-IC Packages for Assembly IPC HDBK-001 -Baking Guidelines IPC TM Time to Delamination IPC TM Decomposition Temperature IPC SM 840D Solder Mask Qualification IPC 4101B -Laminate and Pre preg Materials J-STD-609 Marking and labeling of Components, PCBs and PCBAs to Identify Lead,Lead Free and other Attributes IPC 1601A Printed Board Handling and Storage guidelines- Contact :Joseph Kane BAE systems- IPC liaison- John Perry /Nancy Jaster

5 PWB Moisture Uptake Resin System Type of PWB construction Environment Temperature Humidity Rinse Operations Storage/Handling Moisture Sensitivity is not driven by Material alone Industry Guidelines for Maximum Moisture Content before packaging PWBs Test Method- TM PWB Maximum Moisture Content Measurement

6 PWBs Used for Lead Free Reflow Mid Tg- 150C 310C Td High Tg -170C 340C Td Halogen Free Laminates -170C 340C Td Proposed Guidelines IPC- 1601Rev A Max Moisture 0.1% for Lead free Reflow (260C Max). Max Moisture % for Lead based Reflow (230C) Test Method IPC TM-650 Method

7 Typical Delamination Defects Delamination Blistering

8 PWB Supplier Quality Controls Storage/Handling Controls Prepreg Storage Laminate Storage Inner Layer Production Etched Cores Sub-Assembly Laminated Panels Evaluate/Audit : Transportation of Product Environment (Temp./Humidity) Warehouse Storage Conditions Baking Operation

9 Handling PWBs PWBs are Moisture Sensitive. Vacuum Sealed Bags should be opened just prior to usage. Open PWBs absorb moisture at room temp.

10 Supply Chain Controls Supplier Staging User Understand Parts Movement and Staging Customs Hold/ Warehouse Storage Request temp./ humidity controls Data Monitor seasonal temp. humidity changes Track Product Performance

11 Assembly Hub Temp./Humidity Temperature and Humidity Record Time Temperature 20+/-5 C Humidity 40-60% 8 20C 50% ab 12 19C 49% ab 16 20C 48% ab 20 19C 47% ab Initials

12 Warehouse Temp./Humidity Controls

13 PWB Baking Guidelines Baking is one option to remove excess moisture Baking can degrade solderability Impact cost and cycle time Oxidation of Surface Finish Cause Intermetallic Growth Process controls for Baking Humidity controls inside Oven Air/N2 Flow and Circulation Stack Height of PWBs Thermocouple Locations Time/Temp. Time Clock to start after oven has reached desired temp.

14 Baking Guidelines (contd.) Understand the Surface Finish Impact Lower temp. and longer bake times are effective Typically C for 4-6 Hours except OSP Bake PWB prior to packaging at PCB house Package in MBB bags with desiccant and Humidity Indicator Card OSP Max 105C for 2 hours or supplier guideline ENIG IPC 4552 ENEPIG IPC 4556 Immersion Silver IPC Immersion Tin IPC OSP No standards yet HASL IPC6012/6016

15 Final Packaging and Labeling MBB Bag Vacuum Seal Labeling HIC Card MBB Bag Label

16 PWB Packaging Specifications Proper MSL Packaging Desiccant Pack Packaging Document Audit Packaging Area Implement Bake Cycle

17 PWB Packaging Bake 120C -4 hours/package within 6 hours -25/pack Add desiccant and HIC card

18 Shelf Life and Baking Guidelines by Surface Finish Finish Type Shelf Life from Shipment date Baking Guidelines IPC Spec HASL 6 months 120C 8 HRS IPC 6012/6016 Immersion Gold- ENIG/ENEPIG OSP 6 months 6 months 120C 8 HRS Return to Supplier Remove OSP, Bake, Reapply OSP 4552/ 4556 N/A Selective Gold 6 months Return to Supplier Remove OSP, Bake, Reapply OSP IPC 6012/6016 Immersion Silver 6 months Return to Supplier Remove ImmAg, Bake, Reapply ImmAg IPC4553 Immersion Tin 6 months Return to Supplier Remove ImmAg, Bake, Reapply ImmTin IPC 4554

19 DPPM Monitoring Supplier A- DPPM Chart Q1-07 Q2-07 Q3-07 Q4-07

20 Lesson Learned Understand Supply Chain Clear Concise Documentation Effective Process Controls Training for MSL Handling OEM/Supplier/CM Partnership Respect the Material Limits

21 The End Thank-you for attending this training session. Contact Info

Axiom Electronics LLC

Axiom Electronics LLC 1 of 8 1.0 PURPOSE and SCOPE This document defines Axiom s requirements for printed circuit board (PCB) fabrication, handling, and storage. Industry standards are referenced where appropriate. This document

More information

LEAD-FREE ASSEMBLY COMPATIBLE PWB FABRICATION AND ASSEMBLY PROCESSING GUIDELINES.

LEAD-FREE ASSEMBLY COMPATIBLE PWB FABRICATION AND ASSEMBLY PROCESSING GUIDELINES. LEAD-FREE ASSEMBLY COMPATIBLE PWB FABRICATION AND ASSEMBLY PROCESSING GUIDELINES. TECHNICAL BULLETIN As the industry has moved to lead-free assembly processing, the performance demands on the lead free

More information

PCB Fabrication Specification

PCB Fabrication Specification Original Author: Steve Babiuch Process Owner: Steve Babiuch Page 2 of 8 1.0 Purpose This specification establishes the NEO Tech fabrication requirements for printed circuit boards. The order of precedence

More information

: GA-HF-14/ GA-HFB-14

: GA-HF-14/ GA-HFB-14 Grace Electron Corp. Processing Guide Halogen Free Material Laminate/ Prepreg : GA-HF-14/ GA-HFB-14 Grace Electron Corp. Tech. & QA Dept. Revision 2009/5/18 Page 1 of 7 @2009Grace Group Grace Declaration:

More information

: GA-170-LE/ GA-170B-LE

: GA-170-LE/ GA-170B-LE Grace Electron Corp. Processing Guide Phenolic Cured Material Laminate/ Prepreg : GA-170-LE/ GA-170B-LE Grace Electron Corp. Tech. & QA Dept. Revision 2010/3/30 Page 1 of 7 @2010Grace Group Grace Declaration:

More information

: GA-170-LL/ GA-170B-LL

: GA-170-LL/ GA-170B-LL Grace Electron Corp. Processing Guide Phenolic Cured Material Laminate/ Prepreg : GA-170-LL/ GA-170B-LL Grace Electron Corp. Tech. & QA Dept. Revision 2010/6/14 Page 1 of 6 @2010Grace Group Grace Declaration:

More information

Low CTE / High Tg FR-4 with High Heat Resistance

Low CTE / High Tg FR-4 with High Heat Resistance Low CTE / High Tg FR-4 with High Heat Resistance Laminate: EM-827 Prepreg: EM-827B 1 Features Tg(DSC) > 170 Z direction CTE < 3.0% (50~260 ) High thermal degradation temperature: Td > 340 Excellent thermal

More information

ATS Document Cover Page

ATS Document Cover Page 221-008 Item Rev Status: RELEASED printed 9/20/2017 2:27:42 PM by Les Deenin ATS: OPERATIN PROCEDURE ATS Document Cover Page Responsible Department: Supply Chain This copy is uncontrolled unless otherwise

More information

Lead Free Assembly: A Practical Tool For Laminate Materials Selection

Lead Free Assembly: A Practical Tool For Laminate Materials Selection Lead Free Assembly: A Practical Tool For Laminate Materials Selection Erik J. Bergum David Humby Isola Abstract: The impending European RoHS legislation, restricting the use of lead containing solders,

More information

Company Overview Markets Products- Capabilities

Company Overview Markets Products- Capabilities Company Overview Markets Products- Capabilities A Simpler way for PCB production. www.purepcb.co.uk What can Pure do for you? From 1 off Circuit upward, No MOQ/MOV High Mix Production Focus. Fast Turn

More information

Question: Are RO4000 materials compatible with lead-free processes? Answer:

Question: Are RO4000 materials compatible with lead-free processes? Answer: Question: Are RO4 materials compatible with lead-free processes? Answer: RO4 cores and prepregs are among the most temperature stable products available. They easily meet or exceed all expectations for

More information

Qualification of Thin Form Factor PWBs for Handset Assembly

Qualification of Thin Form Factor PWBs for Handset Assembly Qualification of Thin Form Factor PWBs for Handset Assembly Mumtaz Y. Bora Kyocera Wireless Corporation San Diego, Ca. 92121 mbora@kyocera-wreless.com Abstract: The handheld wireless product market place

More information

Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices

Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices This is a preview - click here to buy the full publication,(&3$6 Edition 1.0 2000-08 Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices 38%/,&/

More information

No Process Guidelines. Laminate R-5775 Prepreg R High Speed, Low Loss Multi-layer Materials

No Process Guidelines. Laminate R-5775 Prepreg R High Speed, Low Loss Multi-layer Materials No.17062967 Process Guidelines Laminate R-5775 Prepreg R-5670 High Speed, Low Loss Multi-layer Materials No.17062967-1 General Material Storage Laminate should be stored flat in a cool dry environment.

More information

APEX 2003 Technical Conference Recent Developments in MSD Control By François Monette Cogiscan Inc. Introduction

APEX 2003 Technical Conference Recent Developments in MSD Control By François Monette Cogiscan Inc. Introduction APEX 2003 Technical Conference Recent Developments in MSD Control By François Monette Cogiscan Inc. Introduction This paper discusses some of the new challenges associated with MSD Control in PCB assembly

More information

PBA Qualification Guideline

PBA Qualification Guideline EDM-Q-001 Rigid Printed Circuit Board Qualification Version 1.0 July 2017 Contact Geert Willems Phone: +32 16 288962 Mobile: +32 498 91 94 64 Geert.Willems@imec.be IMEC Kapeldreef 75 B3001 Heverlee Verantwoordelijke

More information

An Overview of IPC Plating Specification Completions, Revisions and Future Plans

An Overview of IPC Plating Specification Completions, Revisions and Future Plans An Overview of IPC Plating Specification Completions, Revisions and Future Plans George Milad Uyemura International Corporation IMAPS New England Section 42nd Annual Symposium Technical Sessions May 5,

More information

PBA Design-for-Manufacturing Guideline

PBA Design-for-Manufacturing Guideline PBA Design-for-Manufacturing Guideline EDM-D-001 PCB specification V3.0 July 2017 Contact Verantwoordelijke uitgevers Luc Van den Hove - IMEC Geert Willems Phone: +32 16 288962 Mobile: +32 498 919464 Geert.Willems@imec.be

More information

Multek s lead free compatible and compliant material selection February 01, 2006

Multek s lead free compatible and compliant material selection February 01, 2006 Multek s lead free compatible and compliant material selection Helmut.Kroener@de.multek.com +49 7 463 543 February 0, 2006 Overview I. Introduction II. Project setup III. Tested materials IV. Test vehicle

More information

Failure Modes in Wire bonded and Flip Chip Packages

Failure Modes in Wire bonded and Flip Chip Packages Failure Modes in Wire bonded and Flip Chip Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract The growth of portable and wireless products is driving the miniaturization

More information

PCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD

PCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD NCAB Group Seminars PCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD NCAB GROUP PCB Production Process Introduction to Multilayer PCBs 2 Introduction to multilayer PCB s What is a multilayer

More information

Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware

Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware November 19, 2009 M.Kelly, P.Eng, MBA Senior Engineer, ECAT Interconnect Technology Lead-Free Server Development Core Team

More information

I-Tera MT40 Processing Guide

I-Tera MT40 Processing Guide I-Tera MT40 Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points

More information

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards A Novel Material for High Layer Count and High Reliability Printed Circuit Boards Jie Wan, Junqi Tang, Xianping Zeng Shengyi Technology Co., Ltd. No.5 Western Industry Road, North Industry District SSL

More information

Sales Presentation. GoldenTechCircuits Technology Co.LTD 鑫科电路技术有限公司. Professional QTA & HMLV PCB Manufacturer

Sales Presentation. GoldenTechCircuits Technology Co.LTD 鑫科电路技术有限公司. Professional QTA & HMLV PCB Manufacturer GoldenTechCircuits Technology Co.LTD 鑫科电路技术有限公司 Professional QTA & HMLV PCB Manufacturer General Information Established Date: Nov, 2009 Capital: USD 1.5 Million Brazil Office:Travessa Rolante, 40 - Corcunda

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

Features. Applications

Features. Applications ASMT-YTB7-AA2 Tricolor PLCC6 Black Surface LED Data Sheet Description This family of SMT LEDs packaged in the form of PLCC-6 with separate heat path for each LED dice, enabling it to be driven at higher

More information

u-blox Package Information

u-blox Package Information u-blox Package Information For Chips, Modules, and Antennas Reference Abstract This document provides u-blox customers with general packaging information for positioning, short range and cellular products.

More information

Interconnection Reliability of HDI Printed Wiring Boards

Interconnection Reliability of HDI Printed Wiring Boards Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council APEX and Designers Summit 05 Interconnection Reliability of HDI Printed Wiring Boards Tatsuo Suzuki Nec Toppan Circuit Solutions,

More information

Features. Applications

Features. Applications ASMB-MTC1-A3A2 PLCC-4 Tricolor Black Body LED Data Sheet Description This family of SMT LEDs are in PLCC-4 package. A wide viewing angle together with the built in reflector drives up the intensity of

More information

Manufacturing Notes for RFFM8504

Manufacturing Notes for RFFM8504 Manufacturing Notes for RFFM8504 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ( RFMD ) for its use, nor for

More information

Manufacturing Notes for RFFM6401

Manufacturing Notes for RFFM6401 Manufacturing Notes for RFFM6401 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ( RFMD ) for its use, nor for

More information

Guidelines for Vishay Sfernice Resistive and Inductive Components

Guidelines for Vishay Sfernice Resistive and Inductive Components VISHAY SFERNICE www.vishay.com Resistive and Inductive Products By Pascale Nagy Caution: Information included in product datasheets are ing to the general information given in this 1. STORAGE RECOMMENDATION

More information

STUDY OF IMMERSION GOLD PROCESSES THAT MAY BE USED FOR BOTH ENIG AND ENEPIG

STUDY OF IMMERSION GOLD PROCESSES THAT MAY BE USED FOR BOTH ENIG AND ENEPIG As originally published in the SMTA Proceedings STUDY OF IMMERSION GOLD PROCESSES THAT MAY BE USED FOR BOTH ENIG AND ENEPIG Don Gudeczauskas, Albin Gruenwald and George Milad UIC Technical Center Southington,

More information

INTENSITY CODES TECHNICAL. INTENSITY CODES. Intensity Code for Standard LEDs (Ta=25 C Tolerance +/-15%)

INTENSITY CODES TECHNICAL.  INTENSITY CODES. Intensity Code for Standard LEDs (Ta=25 C Tolerance +/-15%) INTENSITY CODES Intensity Code for Standard LEDs (Ta=25 C Tolerance +/-15%) Intensity Code for Displays (Ta=25 C Tolerance +/-15%) Bin Code Light intensity in mcd (IF

More information

Basic 4-layer manufacturing process

Basic 4-layer manufacturing process Basic 4-layer manufacturing process Erwin Lemmens - AQC BV 7-11 D&E BE / Booth 1 8-11 D&E NL / Booth 18 AQC (Advanced Quality Control) BV Supplying pcb s, flex, flex-rigids, aluminium, etc - standard and

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

WS488 WATER SOLUBLE SOLDER PASTE

WS488 WATER SOLUBLE SOLDER PASTE WS488 WATER SOLUBLE SOLDER PASTE FEATURES Excellent Wetting Extended Cleaning Window Superior Slump Resistance 8 Hour+ Stencil Life Wash With Water Alone Low Foaming DESCRIPTION AIM s WS488 water soluble

More information

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations R. Wayne Johnson Alumni Professor 334-844 844-1880 johnson@eng.auburn. @eng.auburn.eduedu Outline System Design Issues

More information

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations R. Wayne Johnson Alumni Professor 334-844-1880 johnson@eng.auburn. @eng.auburn.eduedu Outline System Design Issues Package

More information

SUPPLIER QUALITY CLAUSES

SUPPLIER QUALITY CLAUSES SECTION A This section defines restrictions and quality system requirements applicable when goods and services are procured to Accu-sembly, Inc. part numbers or Military, Federal or Industry specifications

More information

NP-180R NAN YA PLASTICS CORPORATION ELECTRONIC MATERIALS DIVISION. COPPER CLAD LAMINATE DEPARTMENT NO TUNG HWA N. ROAD, TAIPEI, TAIWAN.

NP-180R NAN YA PLASTICS CORPORATION ELECTRONIC MATERIALS DIVISION. COPPER CLAD LAMINATE DEPARTMENT NO TUNG HWA N. ROAD, TAIPEI, TAIWAN. New: 2014/04/30 flame retardant copper clad laminate NP-180R High Tg 175 (DSC) Excellent dimensional stability through-hole reliability Excellent electrical, chemical and heat resistance properties IPC-4101C

More information

Astra MT77 Processing Guide

Astra MT77 Processing Guide Astra MT77 Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points that

More information

Assembly Guidelines for Land Grid Array (LGA) Package

Assembly Guidelines for Land Grid Array (LGA) Package Freescale Semiconductor, Inc. Application Note Document Number: AN2265 Rev. 1.0, 7/2015 Assembly Guidelines for Land Grid Array (LGA) Package 1 Introduction This application note provides guidelines for

More information

Material as follows:

Material as follows: PRELIMINARY SPEC Part Number: AT5050QR410ZS-RV-W2 Warm White ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features 1.Dimensions : 5.0mm X 5.0mm X 1.0mm. 2.Higher

More information

YANTAT PRINTED CIRCUIT (SHENZHEN) CO. LTD.

YANTAT PRINTED CIRCUIT (SHENZHEN) CO. LTD. WWW.YANTAT.COM YANTAT GROUP HK HEAD OFFICE Logistic/Sales YANTAT PRINTED CIRCUIT SHANGHAI SALES OFFICE SHENZHEN SALES OFFICE HONG KONG HEAD OFFICE YANTAT PRINTED CIRCUIT YANTAT PRINTED CIRCUIT YANTAT S

More information

PCN # JAON-30NGKY659 CCB # 2733 Atmel Products Packing Pre and Post Changes

PCN # JAON-30NGKY659 CCB # 2733 Atmel Products Packing Pre and Post Changes PCN # JAON-30NGKY659 CCB # 2733 Atmel Products Packing Pre and Post Changes 2 Summary of Changes Items Changing Earliest Implementation Date Slide No/s. Part Aging November 1, 2016 3 Combination Rules

More information

TECHNICAL DATA SHEET 1 P a g e Revised January 9, 2014

TECHNICAL DATA SHEET 1 P a g e Revised January 9, 2014 1 P age Revised January 9, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant

More information

TEST REPORT (Self-Tested Data)

TEST REPORT (Self-Tested Data) TEST REPORT (Self-Tested Data) CLIENT: IPC Validation Services 3000 Lakeside Drive Suite 105N Bannockburn, IL 60015 USA Attention: Mr. Randy Cherry +1-847-597-5606 TEST ITEMS: Peel Strength, Volume Resistivity,

More information

Technology HF-Printed Circuits Rev For latest information please visit

Technology HF-Printed Circuits Rev For latest information please visit Options and Characteristics Online calculation On explicit enquiry Quantity 1 piece up to 0,4m² total area from 1 piece to mass production Layer quantity 1 to 2 layers Up to 8 layers Material thickness

More information

Yash Sutariya President

Yash Sutariya President Yash Sutariya President Saturn Electronics Corporation Glory Faith North America Saturn Flex Systems Key Inputs to PCB Reliability Backbone Fabrication Processes Multilayer Press Via Drilling Copper Through

More information

AN-400. Dimensions Format Pins Body Height Lead Pitch Thickness wide wide 0.100

AN-400. Dimensions Format Pins Body Height Lead Pitch Thickness wide wide 0.100 April 2008 AN-400 Surface Mount lastic ackages for High Reliability Applications Applications Note Introduction Holt Integrated Circuits specializes in the design and manufacture of components for military

More information

Topview 5630 Red SMD LED

Topview 5630 Red SMD LED Topview 5630 Red SMD LED 1. Features - Chip High-Luminosity SMD LED - 5.6 x 3.0 x 0.9 mm (L x W x H), 4-Pin, Small Size Surface Mount Type - Wide Viewing Angle - Long Operating Life - MSL 3 2. Applications

More information

PRINTED CIRCUITS HANDBOOK

PRINTED CIRCUITS HANDBOOK PRINTED CIRCUITS HANDBOOK Clyde F. Coombs, Jr. Sixth Edition Me Graw New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto CONTENTS List

More information

PSR-4000 HFX Satin Colors (UL Name: PSR-4000DE / CA-40HF)

PSR-4000 HFX Satin Colors (UL Name: PSR-4000DE / CA-40HF) PSR-4000 HFX Satin Colors (UL Name: PSR-4000DE / CA-40HF) LIQUID PHOTOIMAGEABLE SOLDER MASK Application by Screen Printing Available in Black, Blue, Clear, Red and White Satin Finish All Colors are Halogen-Free

More information

WorkShop Audace. INSA ROUEN 8 juin 2012

WorkShop Audace. INSA ROUEN 8 juin 2012 WorkShop Audace INSA ROUEN 8 juin 2012 Global Standards for the Microelectronics Industry JEDEC standards for product level qualification Christian Gautier Content JEDEC overview Environmental reliability

More information

IBM Laminate Study Group

IBM Laminate Study Group IBM Laminate Study Group Lead-Free Laminate Robustness Brett Krull, Dept FM2 Nov 18, 2009 Agenda Introductions Laminate Robustness Background Qualification Methods Contributing Factors Past Work on Laminate

More information

RENESAS TECHNICAL UPDATE 1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa Japan Renesas Electronics Corporation

RENESAS TECHNICAL UPDATE 1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa Japan Renesas Electronics Corporation RENESAS TECHNICAL UPDATE 1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8668 Japan Renesas Electronics Corporation Date: Feb. 13, 2014 Product Category Package Document No. TN-WRP-A019A/E Rev.

More information

Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview

Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Revision 0 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the

More information

Welcome to Streamline Circuits Lunch & Learn. Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology

Welcome to Streamline Circuits Lunch & Learn. Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology Welcome to Streamline Circuits Lunch & Learn Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology Accurate PCB data is critical to the tooling process. Here are some key items

More information

SUPPLIER PACKAGING CODE REQUIREMENTS EFFECTIVE DATE 2/20/2018

SUPPLIER PACKAGING CODE REQUIREMENTS EFFECTIVE DATE 2/20/2018 Change summary: The revision as of this date Created Packaging Code Q from PWB packaging prohibiting the use of Amine-Free anti stat material known as Pink Poly. CODE A: Best Commercial Practice (EFF DATE:

More information

Verifying The Reliability Of Connections In HDI PWBs

Verifying The Reliability Of Connections In HDI PWBs Verifying The Reliability Of Connections In HDI PWBs The stacking of via holes is used effectively in the development of high density circuits on build-up printed wiring boards (PWBs). However, when micro

More information

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing ELECTRONIC INDUSTRIES ALLIANCE

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing ELECTRONIC INDUSTRIES ALLIANCE EIA/JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113-B MARCH 1999 ELECTRONIC INDUSTRIES ALLIANCE JEDEC Solid State Technology Association NOTICE

More information

Product family data sheet

Product family data sheet Cree XLamp MX-3 LEDs Product family data sheet CLD-DS28 Rev 5 Product Description The Cree XLamp MX-3 LED provides the proven lightingclass performance and reliability of Cree XLamp LEDs in a flat-top

More information

3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE. PRELIMINARY SPEC Part Number: AT3020QB24ZS-RV Blue. Features. Material as follows: Package Dimensions

3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE. PRELIMINARY SPEC Part Number: AT3020QB24ZS-RV Blue. Features. Material as follows: Package Dimensions PRELIMINARY SPEC Part Number: AT3020QB24ZS-RV Blue ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features 1.Dimensions : 3.0mm X 2.0mm X 0.8mm. 2.Higher brightness.

More information

RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines

RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines Fabrication Technical Articles Notes RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines These guidelines were developed to provide fabricators basic information on processing core

More information

Parameter Symbol Value Unit. Operating Temperature Top -40 To +100 C. Storage Temperature Tstg -40 To +120 C. Parameter Symbol Value Unit

Parameter Symbol Value Unit. Operating Temperature Top -40 To +100 C. Storage Temperature Tstg -40 To +120 C. Parameter Symbol Value Unit PRELIMINARY SPEC Part Number: KT-3228ZG10ZS-RV Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Absolute Maximum Ratings at TA = 25 C Parameter Symbol Value Unit

More information

IS410 Processing Guide

IS410 Processing Guide IS410 Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points that will

More information

INTRODUCTION OF A NEW PCB SURFACE FINISH FOR THE ELECTRONICS INDUSTRY

INTRODUCTION OF A NEW PCB SURFACE FINISH FOR THE ELECTRONICS INDUSTRY INTRODUCTION OF A NEW PCB SURFACE FINISH FOR THE ELECTRONICS INDUSTRY Frank Ferdinandi Semblant Technologies Melbourne, United Kingdom ABSTRACT A new PCB surface finish has been developed that offers outstanding

More information

VT-45PP VT-47PP VT-447PP

VT-45PP VT-47PP VT-447PP & Prepreg General Information Ventec provides a series of and Prepregs with different glass style and resin content. These products have good bonding and thermal performance in applications of heat sink

More information

LGIT CSP Application NOTE. (Lighting)

LGIT CSP Application NOTE. (Lighting) LGIT CSP Application NOTE (Lighting) TABLE OF CONTENTS 1. LGIT CSP Detail -------------- P2 2. LGIT CSP PCB Design -------------- P3 2.1. LGIT CSP Footprint and PCB Pattern -------------- P3 2.2. PCB Substrate

More information

RESP_IRR_20 P Package

RESP_IRR_20 P Package 15x15 Respiratory Irritant Sensor 20 ppm P Package 110-901 DESCRIPTION SPEC Sensors RESP_IRR_20 is a Screen Printed ElectroChemical sensor component specifically designed for the broad detection of respiratory

More information

CANDOR Industries Inc. High Quality PCB Manufacturing Solutions

CANDOR Industries Inc. High Quality PCB Manufacturing Solutions CANDOR Industries Inc High Quality PCB Manufacturing Solutions 1 Our Mission Founded in 1999, Candor is an industry leader in High Technology Printed Circuit Board Fabrication Services. Quick turn services

More information

The Failure of a Circuit: The Reliability Effects of Process Residues

The Failure of a Circuit: The Reliability Effects of Process Residues The Failure of a Circuit: The Reliability Effects of Process Residues By Terry Munson, Foresite Inc. This column will address the corrosive and electrical leakage effects of standard process residues,

More information

Pb-free Challenges for High Complexity Products. inemi Jan 16 th 2008

Pb-free Challenges for High Complexity Products. inemi Jan 16 th 2008 Pb-free Challenges for High Complexity Products inemi Jan 16 th 2008 All Rights Reserved Alcatel-Lucent 2007 Agenda RoHS 101 Typical complex of telecom products (different from consumable) Pb-free Concerns

More information

LITE-ON TECHNOLOGY CORPORATION

LITE-ON TECHNOLOGY CORPORATION Features * Meet RoHS, Green Product. * Super thin (0.35 mm) Chip LED. * Ultra bright InGaN White Chip LED. * Package in 8mm tape on 7" diameter reels. * Compatible with automatic placement equipment. *

More information

AOS Semiconductor Reliability Report

AOS Semiconductor Reliability Report AOS Semiconductor Reliability Report HVMOS Family Report, rev A ALPHA & OMEGA Semiconductor, Inc www.aosmd.com AOS Reliability Report 1 This report applies for high voltage (900V/700V/650V/600V/500V) products

More information

SECURE COMMUNICATION SYSTEMS INC. (Secure) QUALITY CLAUSES

SECURE COMMUNICATION SYSTEMS INC. (Secure) QUALITY CLAUSES SECURE COMMUNICATION SYSTEMS INC. (Secure) QUALITY CLAUSES These quality clauses, when referenced on a Secure s Purchase Order, are considered contractual requirements, in addition to any Purchase Order

More information

PRODUCT/PROCESS CHANGE NOTICE (PCN)

PRODUCT/PROCESS CHANGE NOTICE (PCN) 3545 North First Street San Jose, CA 95134 USA PRODUCT/PROCESS CHANGE NOTICE (PCN) PCN Number: 06-07 Date Issued: December 13, 2006 Product(s) Affected: Products using TQFN/TDFN type packages Manufacturing

More information

FR406N Processing Guide

FR406N Processing Guide FR406N Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points that

More information

FR408HR. Processing Guide. Part 1: Prepreg Storage and Handling. Part 2: Innerlayer Preparation. Dimensional Stability. Handling Suggestions

FR408HR. Processing Guide. Part 1: Prepreg Storage and Handling. Part 2: Innerlayer Preparation. Dimensional Stability. Handling Suggestions FR408HR Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points that

More information

- 1 - Contents. Date: Date changed Made by: PCB Technical. Accepted by: Gordon Falconer

- 1 - Contents. Date: Date changed Made by: PCB Technical. Accepted by: Gordon Falconer - - page of 4 Contents Inner and outer layer features... 2. Description... 2.2 Capability... 2 2 Build-up / Multilayer... 3 2. Common capability... 3 Standard build-up... 3 3 Drilling/Routing/V-cut/Bevel...

More information

More than just dry air

More than just dry air More than just dry air Rich Heimsch To avoid the damage of micro-cracks and delamination during the processing of electronic components, appropriate environmental storage is essential. The introduction

More information

Additional Information, DS1, Jan Recommendations for Printed Circuit Board Assembly of Infineon PG-OCCN Package

Additional Information, DS1, Jan Recommendations for Printed Circuit Board Assembly of Infineon PG-OCCN Package Additional Information, DS1, Jan. 2005 Recommendations for Printed Circuit Board Assembly of Infineon PG-OCCN Package Edition 2005-01-11 Published by Infineon Technologies AG 81726 München, Germany Infineon

More information

SMD RFI CLIP Data Sheet

SMD RFI CLIP Data Sheet 1/14 Attn : Data Sheet - CONDITION : 1. 2. 3. 4. We approved the product as above. WRITE REVIEW APPROVAL ICT NAME S.P. HONG J.E. KIM S.K,JUNG SIGNATURE Supplier : Innochips Technology CO., LTD By President

More information

NCAB Group PCB Specification

NCAB Group PCB Specification NCAB Group Seminar no. 9 NCAB Group PCB Specification NCAB GROUP NCAB Group PCB Specification 14 key features for durable and reliable PCB s NCAB GROUP NCAB Group PCB Specification 2 Are all PCB s created

More information

GORE SMT EMI Gaskets and Grounding Pads

GORE SMT EMI Gaskets and Grounding Pads GORE SMT EMI Gaskets and Design Guide SMT EMI Gaskets and GORE Introduction GORE SMT EMI Gaskets and, Supersoft Series solves many grounding and shielding challenges in automotive electronics by delivering

More information

Characterizing the Lead-Free Impact on PCB Pad Craters

Characterizing the Lead-Free Impact on PCB Pad Craters Characterizing the Lead-Free Impact on PCB Pad Craters Brian Roggeman and Wayne Jones Advanced Process Lab Universal Instruments Corp. Binghamton, NY 13902 Abstract Pad cratering in Printed Circuit Boards

More information

Design and Construction Affects on PWB Reliability Paul Reid PWB Interconnect Solutions

Design and Construction Affects on PWB Reliability Paul Reid PWB Interconnect Solutions Design and Construction Affects on PWB Reliability Paul Reid PWB Interconnect Solutions The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper

More information

Additional Information, DS6, March Recommendations for Printed Circuit Board Assembly of Infineon P(G)-VQFN Packages

Additional Information, DS6, March Recommendations for Printed Circuit Board Assembly of Infineon P(G)-VQFN Packages Additional Information, DS6, March 2008 Recommendations for Printed Circuit Board Assembly of Infineon P(G)-VQFN Packages Edition 2008-03 Published by Infineon Technologies AG 81726 München, Germany 2008

More information

MF-SM Series - PTC Resettable Fuses

MF-SM Series - PTC Resettable Fuses *RoHS and AEC-Q200 COMPLIANT 7A 7A eatures n Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications n Surface mount devices n ully compatible with current

More information

Material as follows:

Material as follows: Part Number: AT3228ZG10ZS-RV Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features 1.Dimensions : 3.2mm X 2.8mm X 0.8mm. 2.Higher brightness. 3.Small package

More information

FR408 Processing Guide

FR408 Processing Guide FR408 Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points that will

More information

Cypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997

Cypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997 Cypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997 SST SONET/SDH Serial Transceiver CY7B952 SST is a trademark of Cypress Semiconductor Corporation SST SONET/SDH Serial Transceiver

More information

TAIYO THP-100DX1 USA-SP (UL Name: THP-100DX)

TAIYO THP-100DX1 USA-SP (UL Name: THP-100DX) TAIYO THP-100DX1 USA-SP (UL Name: THP-100DX) THP-100DX1 USA-SP after copper plating. THP-100DX1 USA-SP in 1 and 5 kg container. Available in a 1 and 5 kg container One-component Thermally Cured Hole Fill

More information

Ready For The Future 2016

Ready For The Future 2016 Ready For The Future 2016 Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology

More information

A STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS

A STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS A STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS G.Milad, D.Gudeczauskas, G.Obrien, A.Gruenwald Uyemura International Corporation Southington, CT ABSTRACT: The solder joint formed on an ENEPIG surface

More information

I-Speed Processing Guide

I-Speed Processing Guide I-Speed Processing Guide The processing guidelines contained in this document were developed through in-house testing and field experience. However, they should be considered to be starting points that

More information

S3X58-M ICT Compatible Lead Free Solder Paste. Product Information. Koki no-clean LEAD FREE solder paste. Contents.

S3X58-M ICT Compatible Lead Free Solder Paste. Product Information. Koki no-clean LEAD FREE solder paste.   Contents. Koki no-clean LEAD FREE solder paste www.ko-ki.co.jp #53002 Revised on Mar. 3, 2015 ICT Compatible Lead Free Solder Paste Product Information Conventional Product Picture of ICT Checker Probe The product

More information