The Essential Role of DFx In The Lean Smart New Product Introduction (NPI) Flow

Transcription

1 The Essential Role of DFx In The Lean Smart New Product Introduction (NPI) Flow Presenter: Michael Ford Title: Marketing Development Manager Date: 16 th March 2017

2 Today s Agenda What is Industry 4.0 and a Smart Factory What is Lean, really? The traditional production eco-system A Summary Of NPI Issues The Valor Lean NPI Flow

3 What Is Industry 4.0, Really? Industry 4.0 Origin: Created by the German government Tip the balance toward German manufacturing Aimed at small / medium sized companies A business case for local manufacturing Need to do it right first time (Lean) Re-shoring Manufacturing: A growing political agenda in the USA Potential taxes and tariffs on foreign goods

4 Transition From Industry 3.0 To 4.0 Until Now: Industry 3.0 : Automation, since 1969 Includes all SMT machines & robots From Now: Smart Industry 4.0 : Digital IoT backbone Automation of automated processes Computerization of human decision-making Optimization based on the live environment Digital engineering Not a Lights-Out factory (sorry!) THIRD INDUSTRIAL REVOLUTION Manufacturing automation via electronic and IT systems First programmable logic controller (PLC) today FOURTH INDUSTRIAL REVOLUTION Cyber-Physical Systems

5 What Is Lean, Really? Do it right the first time Do it with the minimum of time and energy Do it perfectly, consistently, without mistakes Don t do anything you don t need to Eliminate all forms of waste Contribute to being Lean, up-stream and down-stream Be aware of change, flexibility

6 The Traditional Product Ecosystem Market intelligence Demand patterns Distribute Market Analysis Product Design Competitive analysis Ship PCB Layout Create opportunity Test PCB Fabrication PCB Assembly Local BOM

7 The Product Ecosystem Evolution / Revolution Current trends: On-Shoring Industry 4.0 Most costs are here: Distribute Market Analysis Product Design Automation Technology expansion Ship PCB Layout Fashion Energy saving Test PCB Fabrication Just 1% of retail product cost here: PCB Assembly Local BOM

8 The Focus Of Product Design & Business Product schedule Product requirements Distribute Market Analysis Product Design Technology Materials Market Ship PCB Layout Does my design meet all requirements? Test PCB Assembly Local BOM PCB Fabrication

9 Downstream Of Design - We Are The Enablers Reliability Design Rules Shapes Distribute Market Analysis Product Design Technology Prototypes Ship PCB Layout Does my PCB work? Test PCB Fabrication PCB Assembly Local BOM

10 The Critical Nature Of PCB Design Fit enclosure Reliability Design Rules Delays Market Issues Missed Opportunity Lost Confidence Distribute Market Analysis Product Design Shapes Technology Quality Concerns Unknowns Ship PCB Layout Prototypes Does my PCB work for manufacturing? Testability issues Test PCB Fabrication Fabrication Issues Panelisation Assembly issues PCB Assembly Local BOM Local, 2 nd, lower cost sourcing

11 NPI Issues: Engineering For Volume Manufacturing Issues that get passed design tool DRC.. Manufacturing violations Yield, cost & reliability opportunities 9 Example: Close spacing over an extended length affects yield and therefore costs

12 NPI Issues: Fabrication Analysis Common fabrication issues that can cause scrap or extra costs Slivers can cause repeat defects due to photo-resist flaking Starved thermals prevent proper heat containment, affecting quality of via solder connection Manufacturing process tolerances can cause a same net short, potentially affecting circuit behavior Circuits close to a pad must be fully covered by mask to avoid solder bridging during the assembly process

13 NPI Issues: Flex and Rigid-flex Analysis Flex and rigid-flex circuits have their own manufacturing requirements Unique checks are required to identify potential issues Exposed Copper Coverlay Plated Hole Silver Mask Stiffener Conductors should be perpendicular across the entire bend area Plated holes too close to a stiffener can lead to cracks in the barrel Rigid area copper close to interface area can cause copper to crack Silver mask must remain clear of exposed copper to avoid EMI issues

14 NPI Issues: Panel Design and Optimization How to create panels optimized for both assembly and fabrication Consider panel size, rail widths, margins, moat width, number of boards and component overhang Actions needed include pattern filling, addition of tooling holes, fiducials, bad board marks, targets, text, barcode, breaktabs, v-score lines and rout Calculate exact material utilization to identify cost impact

15 NPI Issues: Substrate Analysis void Bottom via pad diameter Dependent on location within drill span Mesh hole to void mesh holes too close to a void can become unified in the fabrication process, affecting copper balancing Edge to PTH Pad PTH, vias, lines and planes can each have different proximity to the edge of the package or board without affecting EMI X via Solder Mask to touching via vias should be kept away from solder mask clearances to avoid coverage/exposure effects

16 NPI Issues: Assembly Panel Analysis Need to identify manufacturing issues with the assembly panel configuration Need to look at fabrication and assembly related processes Components too close to conveyed edge can be damaged during assembly Placement of components on adjacent PCBs cannot be done with this assembly panel design Components protruding from edge of PCB can obscure panel fiducials Breakaway tabs too close to SMD pad can result in damage to solder joint

17 NPI Issues: Layout Related Assembly Analysis Footprint issues are a frequent cause of manufacturing failure Simple DRC rules do not reflect true process capabilities and limitations Pin overhanging soldermask can cause solder bridging Silkscreen too close to pads could jeopardize solder adhesion Pins too wide for pads can lead to insufficient side fillets of solder joints Gangmask is required for finepitch devices

18 NPI Issues: Material Related Assembly Analysis Actual material used will usually not match the simplistic rules in the design tool Material dependent spacing issues will occur Component clearance requirements vary by type, orientation and placement machine Toeprint too close to conveyed edge can be damaged by SMT gripper Tall components too close to adjacent components make it difficult to access the short component for repair Misplaced reference designator causes confusion at test, repair and for manually placed components BOM Issues - frequent component reference and quantity mismatches

19 NPI Issues: Solderability Solderability can only be assessed using only the EDA libraries EDA libraries do not contain the pin contact area Heel & Toe Solder Joints Left & Right Solder Joints Heel Pin Contact Area Toe

20 NPI Issues: Solderability Sufficient solder joints for selected and qualified parts? Insufficient heel distance will lead to a weak solder joint Insufficient toe distance and even the ratio of heel/toe affect the quality of a solder joint Side solder fillets are also a factor in the quality of a solder joint Actual component body (red) covers mounting hole that CAD package (purple) didn t detect

21 The Introduction of DFx (Design For Excellence) With DFx, my PCB design supports business objectives Design Through Manufacturing: ODB++ Confidence Testability issues Profitability Ship Test Distribute Market Analysis Product Design PCB Layout DFx New! IoT: OML Lean NPI flow Assembly issues PCB Assembly Real Materials PCB Fabrication Fabrication issues Panelisation optimized Production BOM verification

22 Effects of Lean NPI Solutions With DFx Major Pains Addressed: Too many design re-spins Not meeting delivery schedules High levels of scrap Low yields 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% Aberdeen Research, Printed Circuit Design Integrity Major Production Issue Reduction: 77% 53% 58% 43% 4% 8% 11% 9% Fabrication issues Assembly issues Test issues Manufacturability Product reliability problems Pre-tooling data preparation times too long A larger workforce to manage issues Valor DFx DRC

23 Valor NPI: DFx for Manufacturers Analyzes PCB designs for manufacturability, yield, cost and reliability issues Use by designer (OEM) to improve design Use by manufacturing to expose concerns (EMS) Comprehensive data preparation for direct input into production tooling Serves all industries, companies of all sizes and all design systems

24 Valor NPI: Valor Parts Library Over 35 million manufacturing part numbers 2.5 D component data plus pin contact areas Created using ISO 9001 process U2 Enables virtual prototype build Only way to assure quality solder joints Identify issues that cannot be found using CAD libraries

25 3.00mm 3.00mm 3.30mm Valor NPI: Alternate Material Analysis Electrically equivalent materials in AVL have different dimensions and pin contact areas 6.15mm 6.00mm 6.00mm Component A Component B Component C DFx Composite Body Component CA B Toe violation with component A Side violation with component C No manufacturing issues no matter which qualified parts are used

26 Valor NPI: Panel Design and Optimization PCBs are automatically optimized within an assembly array regardless of shape Substantial impact on material costs savings Common Practice: 18 x 24 Panel 2 PCBs/Array 6 Arrays/Panel 18.7% Material Utilization Valor NPI: 18 x 24 Panel 2 PCBs/Array 10 Arrays/Panel 31.5% Material Utilization

27 Valor NPI: DFx Reporting Collect all DFx issues in a single report, output as html or xml Customizable content and format Pre-set comments for common issues

28 Valor NPI: Comprehensive Manufacturing Analysis Number of Checks Assembly 367 Fabrication 283 Flex / Rigid-Flex 120 Microvia 45 Panel 38 Substrate 87 Total 940 Plus: Netlist Validation BOM Validation Approved Vendor List (AVL) Validation

29 Lean NPI Flow: Building The Digital Product Model System Design ERP DIGITAL PRODUCT MODEL BOM Schematic Design Floor-planning Layout & Routing WHAT? CAD Accurate shapes Product-centric NPI Supply form Panel design Product summary NPI: Fabrication Process Fabrication Execution HOW? Virtual documentation Schematic data NPI: Assembly / Test Process Work instructions Stencil Machine programming Assembly / Test Execution SMT Test

30 Product Ecosystem With Valor NPI Traditional: Market Analysis Reduced time to production Fewer manufacturing problems Distribute Product Design Higher yields and product reliability Reduced product delivery time Industry 4.0: Improved business plans Ship Test PCB Layout DFx Improved competitiveness PCB Assembly PCB Fabrication Flexibility for on-shoring Local BOM

31 DESIGN TOOL PRODUCT NPI Complete Design-through Manufacturing Solution MANUFACTURING INTELLIGENCE M A T E R I A L MANAGEMENT VA L O R PA R T S LIBRARY Q U A L I T Y MANAGEMENT A S S E M B L Y / T E S T PROCESS NPI MATERIAL & PROCESS T R A C E A B I L I T Y A S S E M B LY / T E S T PLANNING SHOP-FLOOR C O N T R O L Valor IoT Manufacturing

32 Thank You 34