LH141A - Chip Scale

Transcription

1 Rev: 000 Product Data Sheet LH141A - Chip Scale Package@25 Introduction Features Package : Flip-Chip LED Package View Angle: 120 Precondition : JEDEC Level 2a Dimension : 1.46 x 1.46 x 0.22 mm ESD withstand Voltage : up to ±2kV [HBM] Applications CONSUMER LIGHTING : Torch light SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do , KOREA 1 / 23

2 Contents 1. Luminous Flux Characteristics Characteristics Typical Characteristics Graph Outline Drawing & Dimension Reliability Test Items and Conditions Solder Conditions Tape & Reel Label Structure Packing Structure Precaution For Use Hazard Substance Analysis Revision History / 23

3 1. Luminous Flux Characteristics (T j = 25 ) Nominal CCT Minimum CRI 1) Sorting condition Calculated lm Minimum lm 2) Product Code BIN Structure Rank Min lm 7600K 68 J SCS6NTB6EFL1 Torch Notes: 1) SAMSUNG ELECTRONICS maintains a tolerance of ±3.0 on CRI measurements. 2) SAMSUNG ELECTRONICS maintains a tolerance of ±7% on flux measurements. 3) Calculated flux values are for reference only. 3 / 23

4 2. Characteristics 1) Electro-optical Characteristics Item Unit Min Typ Max Forward voltage 1) ma, Tj = 25 ) V Forward voltage 1) (@700 ma, Tj = 25 ) V 3.2 Operation forward current (Tj = 25 ) ma Thermal resistance R th,j-s /W - 5 LED junction temperature T j Operating temperature range T opr Storage temperature range T stg Viewing Angle Notes: 1) SAMSUNG ELECTRONICS maintains a tolerance of ±0.1V on forward voltage measurements. 2) Vf Rank (Tj = 25 ) Parameter Symbol Condition Rank Min. Typ. Max. Forward Voltage V F I F = 350mA F / 23

5 3. Typical Characteristics Graph 1) Spectrum Distribution (T j = 25 ) 7600K 5 / 23

6 2) Forward Current Characteristics (T j = 25 ) Relative Flux vs. Forward Current Forward Current vs. Forward Voltage 6 / 23

7 3) Temperature Characteristics Relative Flux vs. Junction Temperature (I F= 350mA) Forward Voltage vs. Junction Temperature (I F= 350mA) 7 / 23

8 4) Color shift Characteristics Color x,y vs. Junction Temperature (I F= 350mA, Cool White) Color x,y vs. Forward Current. (I F= 350mA, Tj=25 Cool White) 8 / 23

9 5) Derating Curve 6) Viewing angle Characteristics Viewing angle(tj = 25 C, IF = 350 ma) 9 / 23

10 4. Outline Drawing & Dimension Tolerance : Chip Thickness = ±10um Phosphor film Thick. = ±10um TiO2 layer width = ±35um ITEM FRAME LED CHIP WIRE RESIN PACKAGE ZENER DIODE MATERIAL N/A GaN on Sapphire, Flip chip N/A Resin + Phosphor (Nitride) Film type PKG N/A 10 / 23

11 5. Reliability Test Items and Conditions 1) Test Items and Results Test Items Test Conditions Test Hours/Cycles n Room Temperature Life Test High Temperature humidity Life Test High Temperature Life Test Low Temperature Life Test 25, DC 1000 ma 1000 Hr 22 85, 85%, DC 1000 ma 1000 Hr 22 85, DC 1000 ma 1000 Hr 22-40, DC 1000 ma 1000 Hr 22 Temperature humidity Cycle On/Off test Thermal Shock -40 / 85, each 20 min, 100 min transfer Power On/off each 5 min, DC 1000 ma -45 /15 min 125 / 15 min. Temp.change within 5min. 100 Cycles Cycles 100 High Temperature Storage Low Temperature Storage Ta= Hr 11 Ta= Hr 11 ESD(HBM) Q1=10MΩ, R2=1.5KΩ, C=100pF, V=±5KV, 5Times 5 Times (±5kV) 5 2) Criteria for Judging the Damage Item Symbol Test Condition [T a = 25 ] Min. Limit Max. Forward Voltage V F 350 ma L.S.L. * 0.9 U.S.L. * 1.1 Luminous flux lm 350 ma L.S.L. * 0.7 U.S.L. * 1.1 * U.S.L. : Upper Standard Level L.S.L. : Lower Standard Level 11 / 23

12 6. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 300, under soldering iron / 23

13 7. Tape And Reel 1) Taping Dimension 2-1) Reel Dimension (max 4,000 pcs) (1) Quantity : The quantity/reel to be 4,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2mm (3) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof Package / 23

14 8. Label Structure 1) Label Structure abcdef 1ABEG SCS6NTB6EFL1 0ABCK 1ABEG IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code N.B) Denoted rank is the only example. ' ' means All kind of Chromaticity Coordinate Rank. Rank Code ab : Chromaticity Coordinate Rank cd : Luminous Flux(Φ v, lm) Rank ef : Forward Voltage(V F) Rank 2) LOT Number The Lot number is composed of the following characters 1ABEG SCSHLTB6EFB1 0ABCK 1ABEG IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 4,000 PCS : Production Site (S:SAMSUNG ELECTRONICS) : L (LED) : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) : Year (Y:2014, Z: ) 5 : Month (1 ~ 9, A, B) 6 : Day (1 ~ 9, A, B ~ V) 789 : SAMSUNG ELECTRONICS LED Product number (1 ~ 999) abc : Reel Number (1 ~ 999) 14 / 23

15 9. Packing Structure 1) Packing Process Reel 1ABEG SCS6NTB6EFL1 0ABCK 1ABEG IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag 1ABEG SCS6NTB6EFL1 0ABCK 1ABEG IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Box (Max. 7 Aluminum Vinyl Bag) Material : Paper(SW3B(A)) TYPE SIZE(mm) L W H 7inch 295±5 290±5 260±5 1 SIDE 1ABEG SCS6NTB6EFL1 0ABCK 1ABEG IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 28,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII H CHIP LED L W 1 [Box Label] 15 / 23

16 2) Aluminum Packing Bag 1ABEG SCS6NTB6EFL1 0ABCK 1ABEG IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag 16 / 23

17 9. Precaution for use ( 취급상주의사항 ) 1. For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함. 2. This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA should be used. 제품은물, 오일, 유기물과같은액체타입에서의사용은제한되며, 세정이필요할시에는 IPA 사용을권장함. 3. When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. LED 의발광시, 동작전류는주변최고온도를고려하여결정되어야함. 4. LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SLED, a sealed container with a nitrogen atmosphere should be used for storage. (Self life in sealed Bag : for 12months, <40, <90%RH) LED의보관은청정한환경에서보존되어져야하며, 만약삼성LED로부터공급받는후 3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함. ( 보존 bag의수명 : 12 개월, 보존온도 <40, 습도 <90%RH) 5. After this bag is open, device that will be subjected to reflow solder or other high temperature processes must be; 보존 Bag이개봉된후에, 납땜이나 reflow등의높은온도에노출되는제품은다음의사항에부합되어야함. a. Mounted within 168hours(Seven days) at factory conditions of equal to or less than 30 /60%RH, a. 제품은 30 /60%RH 보다같거나낮은조건의조립공장에서 168시간 (7일) 이내에조립되어야함. b. Stored at <10% RH. b. 10% 이하의상대습도에서보관되어야함. 6. Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후, 건조한장소에서보관할것을권장함. 7. Devices require bake, before mounting, if: a. Humidity card >60% when read at 23±5. 만약습도표시카드의수치가 23±5 에서 60% 이상이라면, 제품실장전에 baking 하여야함. 8. If baking is required, Devices must be baked for 1hours 60±5. 만약 baking 이필요하다면, 제품은 60±5 에서 1 시간정도 baking 되어야함 / 23

18 10. Hazard Substance Analysis 18 / 23

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23 Revision History Model: SCS6NTB6EFL1 Date Revision History Writer Drawn Approved st Version K.H.Kim 23 / 23