OM-5300 Product Guide

Transcription

1 OM-5300 Product Guide The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon

2 Performance Summary Process Step Performance Feature OM-5300 Performance Capability Fine Feature Print Definition Excellent print definition and consistant volumetric performance to 0.25mm (10 mil) circles and 0.3mm (12 mil) pitch rectangular QFP pads. Tack Life >24 hours Capable of printing in temperatures from 20 C to 30 C (68 F to Temperature Window Print Process Window 86 F) Print Consistancy Repeatable volume deposition and low volume variability (CpK > 2.0) on 0.25mm (10 mil) circles. 25mm/second to 150mm/second (1 inch/second to 6 Print Speed Range inches/second) down to 0.25mm (10 mil) circles and.3mm (12 mil) pitch QFP pads. Reflow Yield Electrical Reliability Pin Testability >98% Yield (<2% False Negatives) Best in Class Resistance to Voids Exceeds requirements of IPC 7095 Class lll using soak reflow profile. Class II with straight ramp profiles. Resistance to Hot and Cold Slump Exceeds the requirements of IPC J-STD-005 and JIS-Z-3284 for hot and cold slump. Flux Residue Cosmetics Clear, colorless residue. SIR Meets/Exceeds JIS, IPC and Bellcore Requirements Electromigration Resistance Meets/Exceeds JIS, Bellcore and HP EL-EN Requirements J-STD-004 Classification ROL0 Halide Content Halide and Halogen Free

3 Printing Performance The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon

4 Fine Feature Print Definition Print Performance 0.3mm (12mil) pitch QFPs* Using Type 3 Powder Delivers High Fine Feature Print Yields Excellent print definition and consistent volumetric performance to 0.30mm (12mil) squares and 0.25mm (10mil) pitch circles Type 3 Powder Capable for Better Economy *10 cm/sec (4in/sec), 0.26kg/cm (1.5 lbs/in) squeegee pressure, 0.125mm (5 mil) stencil

5 Paste Volume, Repeatability- Room Temperature (25 C) Print Performance Volume (cu mil) Print data: OM Average - Boards 1-6 (Initial) Average 50 - Boards 7-12 (wipe) Average - Boards (pause) LSL 0- Average Volume Minimum 1 vol. - Boards Minimum vol. - Boards 7-12 Minimum vol. - Boards Board # LSL - Minimum volume Volume CpK (within boards) Print volume CpK: OM-5300 Initial - Boards 1-6 After wipe - Boards 7-12 After 1 hour pause - Boards Board # Repeatable volumes after stencil wipe and 1 hour response to pause Continuous monitoring of paste volume over time demonstrates ALPHA OM-5300 s consistent printability High Volume Deposits High Level of Volume Repeatability

6 Paste Volume, Repeatability- Low Temperature (20 C) Print Performance Print data: OM-5300 (type 3) Print volume CpK: OM-5300 (type 3) Volume (cu mil) Average - Boards 1-6 (Initial) 50 Average - Boards 7-12 (wipe) Average - Boards (pause) LSL 0- Average Volume Minimum 1 vol. - Boards Minimum vol. - Boards 7-12 Minimum vol. - Boards Board # LSL - Minimum volume Volume CpK (within boards) Initial - Boards 1-6 After wipe - Boards 7-12 After 1 hour pause - Boards Board # Repeatable volumes after stencil wipe and 1 hour response to pause Continuous monitoring of paste volume over time demonstrates ALPHA OM-5300 s consistent printability High Volume Deposits High Level of Volume Repeatability

7 Paste Volume, Repeatability- High Temperature (30 C) Print Performance Print data: OM-5300 (type 3) Print volume CpK: OM-5300 (type 3) Volume (cu mil) Average - Boards 1-6 (Initial) 50 Average - Boards 7-12 (wipe) Average - Boards (pause) LSL 0- Average Volume Minimum 1 vol. - Boards Minimum vol. - Boards 7-12 Minimum vol. - Boards Board # LSL - Minimum volume Volume CpK (within boards) Initial - Boards 1-6 After wipe - Boards 7-12 After 1 hour pause - Boards Board # Repeatable volumes after stencil wipe and 1 hour response to pause Continuous monitoring of paste volume over time demonstrates ALPHA OM-5300 s consistent printability High Volume Deposits High Level of Volume Repeatability

8 Print Consistency Over Range of Print Speeds-.010 (.25mm) Circles Print Performance Print speed = 1 in./sec (25.4mm/sec) Squeegee pressure = 1 lb/linear in. (0.18 Kg/cm) Print speed = 4 in./sec (100mm/sec) Squeegee pressure = 1.25lb/linear in. (0.22 Kg/cm) Wide print speed capability allows for maximum throughput Print speed = 6 in./sec (150mm/sec) Squeegee pressure = 1.5 lb/linear in. (0.26 Kg/cm) Repeatable volume deposition and low variability based on theoretical aperture volumes Faster print speed reduces print cycle time This allows printer to perform secondary functions without affecting SMT line beat rate Under stencil wipe 2D vision inspection

9 Print Consistency Over Range of Print Speeds-.012 Pitch (.30mm) QFP Pads Print Performance Print speed = 1 in./sec (25.4mm/sec) Squeegee pressure = 1 lb/linear in. (0.18 Kg/cm) Print speed = 4 in./sec (100mm/sec) Squeegee pressure = 1.25lb/linear in. (0.22 Kg/cm) Print speed = 6 in./sec (150mm/sec) Squeegee pressure = 1.5 lb/linear in. (0.27 Kg/cm) Wide print speed capability allows for maximum throughput Repeatable volume deposition and low variability based on theoretical aperture volumes Faster print speed reduces print cycle time This allows printer to perform secondary functions without affecting SMT line beat rate Under stencil wipe 2D vision inspection

10 Hot Slump, 25% RH- Pass Hot Slump Test Form Solder Paste: OM-5300 Sn 63 Date: 2/9/2007 Heating Equipment: OVEN Alloy: 63/37 Temp / Hum 25% Profile 150C/10min Lot #: P1 Substrate: Glass slide Slide 1: Initial Slide 2: Initial Stencil IPC-A-21 ( 8 mil thick ) Stencil IPC-A-21 ( 8 mil thick ) Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Gap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical B B B 0.08 Slide 1: After 10 min in 25 %RH. +/-5% Slide 2: After 10 min in 25 %RH. +/-5% Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Gap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical B B B 0.08 Slide 1: After 10 min in 150C Slide 2: After 10 min in 150C Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Gap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical B B B B B B 0.08 If there is any bridging above the double lines, The test is a Fail. Test Result: PASS Name: Isha Form 8442, Rev. 1,11/2000

11 Hot Slump, 75% RH- Pass Hot Slump Test Form Solder Paste: OM-5300 Sn63 Date: 2/9/2007 Heating Equipment: OVEN Alloy: 63/37 Temp / Hum 75% Profile 150C/10min Lot #: P1 Substrate: Glass slide Slide 1: Initial Slide 2: Initial Stencil IPC-A-21 ( 8 mil thick ) Stencil IPC-A-21 ( 8 mil thick ) Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Gap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical B B B B 0.08 Slide 1: After 10 min in 75 %RH. +/-5% Slide 2: After 10 min in 75 %RH. +/-5% Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Gap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical B B B B 0.08 Slide 1: After 10 min in 150C Slide 2: After 10 min in 150C Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Gap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical B B B B B B 0.08 If there is any bridging above the double lines, The test is a Fail. Test Result: PASS Name: Isha Form 8442, Rev. 1,11/2000

12 Wipe Frequency 11 Prints, 16 Mil Features >15 Prints, 20 Mil Features 5 Mil Thick Stencil Number of Bridges Sample # 1 Pitch Prints L25R L20R L16R L12R 1 O O O O 2 O O O O 3 O O O O 4 O O O O 5 O O O O 6 O O O O 7 O O O O 8 O O O O 9 O O O O 10 O O O O 11 O O O O 12 O O O O O O 14 O O 1 O 15 O O Inside Printer Temperature 72.0F Relative Humidity 20% PUT Form 01 Rev 3/26/01

13 Tack Strength / Life Stable tack over time

14 Wetting to Pb- Free Components The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon

15 Profile HS 160 C (60s) 240 C peak Profile HS 160 C (60s) 240 C peak Profile - Ramp 0.7 C/sec 235 C peak Profile - Ramp 0.7 C/sec 235 C peak Lead finish Sn100

16 Class III Resistance to Voiding Void Size Distribution BGA256 % of Joints % 90.00% 80.00% 70.00% 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% OM5300 High Soak 160 C 220 C P OM5300 Ramp 0.7 C Sec 220 C P OM5000 High Soak OM 5000 Ramp ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20% % of Joint area

17 Electrical Reliability Data The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon

18 Bellcore SIR- Pass SIR TEST REPORT - BELLCORE Request: (per GR-78-CORE Issue 1, Sept 97) Test #.0714-b Date: 3/8/07 T/H/B:35/85/-48 Tested by:.k. Tellefsen Reported by:k. Tellefsen P/F limit:1e11 Ohms MATERIAL TESTED/ SIR SIR COMMENTS CONDITION (1 day) (4 days) OM Sn/37 Pb 1.6E E+10 Visually OK Reflowed paste 8.0E E E E+11 uncleaned 2.5E E E E E E E E E E E E E E E E E E Geometric mean: 1.6E E+11 Control boards 2.8E E E E E E E E E E E E E E E E E E E E E E E E Geometric mean: 1.1E E+11

19 IPC SIR-Pass SIR TEST PER J-STD-004 Request: ********************** Test #:0714-1i Date: 3/3/2007 T/H/B 85C/85%RH/-48V Tested by: K. Tellefsen P/F limit: Reported by: K. Tellefsen 1.0E+08 ohms MATERIAL TESTED/ Initial SIR(ohms) SIR SIR Final COMMENTS CONDITION ambient (1 day) (4 days)(7 days) ambient OM /37 9.5E E E E E+11 passed electrical Reflowed paste 1.5E E E E E+11 and visual uncleaned 1.9E E E E E+11 requirements 1.1E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E Arithmetic mean: 3.0E E E E E+11 Control boards >1.0E E E E+09 >1.0E+12 >1.0E E E E+09 >1.0E+12 >1.0E E E E+09 >1.0E+12 >1.0E E E E+09 >1.0E E E E E E E E E E E E E E E E E E E E E E E E E+09 >1.0E+12 >1.0E E E E+09 >1.0E+12 >1.0E E E E+09 >1.0E+12 >1.0E E E E+09 >1.0E Arithmetic mean: 9.0E E E E E+11

20 IPC Compliance Ag chromate - Pass OM-5300 Lot P1 Cu mirror - Pass Paste is halide free, ROL0 per IPC

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