ACS300 Gen2. The coat develop solution from pilot to high volume production

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1 ACS300 Gen2 The coat develop solution from pilot to high volume production

2 ACS300 Gen2 The Powerful Coating Solution for 300 mm features and benefits + + Highly flexible resist processing cluster for high-volume production + + Concurrent 200 and 300 mm wafer processing without mechanical changeover + + Scalable and field-upgradable cluster architecture + + GYRSET closed bowl coating technology + + Best in class edge bead performance through combination of precision edge bead removal and sophisticated chuck and bowl design + + Customized solutions for handling standard and non-standard substrates such as stacked and warped wafers axis robot for handling a wide range of substrates including carrier solutions + + Interface to Field Proximity Mask Aligner MA300 Gen2 The ACS300 Gen2 is a modular coat and develop cluster covering wafer sizes from 200 to 300 mm without the need of mechanical changeover as well as square substrates. The system offers superior performance in coating, baking and developing wafers for applications such as thin and thick resists, or photosensitive polymers like poly imide or Cyclotene (BCB). With its best in class coat and develop uniformity and an exceptional edge bead performance the ACS300 Gen2 is the dedicated costeffective resist processing solution for the Advanced Pack aging market. The ACS300 series from SUSS MicroTec already has a large installed base with foundries, IDMs and R&D institutes worldwide. The ACS300 Gen2 has been designed a modular and scalable system solution with fieldupgradable process modules which allows for flexible production planning from R&D or pilot production to high volume production stages. It can be interfaced with the SUSS MA300 Gen2 1X Full Field Proximity Mask Aligner to form the integrated LithoPack300 cluster. With the ACS300 Gen2 SUSS MicroTec has designed a flexible, cost-effective coating cluster solution that supports a variety of differen manufacturing requirements as well as equipment extendibility for multiple device generations. 2

3 The Dedicated System for the Advanced Packaging Market The ACS300 Gen2 is the dedicated solution for the Advanced Packaging Market serving applications like solder bumping, gold bumping, as well as front side Redistribution Layers (RDL) used in Wafer Level CSP or backside RDL for 3D Packaging. The GYRSET technology allows for coating thicknesses in the range of below 1 µm to over 100 µm: ACS300 Gen2 Coating Results: AZ1505 Positive tone photoresist JSR WPR Photosensitive dielectric AZ10XT Positive tone photoresist HD-4000 Polyimide Test Diameter: 290 mm Mean: 0.90 µm Std. Dev.: 0.30 % Hi/Lo Variation: 0.90 % Test Diameter: 296 mm Mean: 7.94 µm Std. Dev: 0.30 % Hi/Lo Variation: 0.71 % Test Diameter: 288 mm Mean: 12.5 µm Std. Dev.: 0.46 % Hi/Lo Variation: 1.05 % Test Diameter: 284 mm Mean: 17.1 µm Std. Dev.: 0.31 % Hi/Lo Variation: 0.78 % TOK PMER P/CA1000PM Positive tone photoresist, chemically amplified Test Diameter: 294 mm Mean: 20.6 µm Std. Dev.: 1.03 % Hi/Lo Variation: 2.57 % AZ40XT Positive tone photoresist Test Diameter: 290 mm Mean: 43.5 µm Std. Dev.: 1.36 % Hi/Lo Variation: 2.74 % JSR THB 151-N Negative tone photoresist Test Diameter: 295 mm Mean: 72.0 µm Std. Dev.: 1.31 % Hi/Lo Variation: 3.95 % JSR THB 151-N Negative tone photoresist, double coating Test Diameter: 294 mm Mean: 122 µm Std. Dev.: 1.36 % Hi/Lo Variation: 3.51 % 3

4 The Expert AT Thick Resist Processing The challenges of photoresist processing in the field of wafer bumping, wafer level packaging and 3D packaging require a very careful design of coat, bake, develop modules in order to obtain optimum processing results. The ACS300 Gen2 is designed to produce resist coatings within a thickness range from less than one to over 100 microns. Thick resists require coat module geometries that can handle the high viscosities involved and yield highly uniform films. Thick Resist Coating The ACS300 Gen2 is a master when it comes to processing of ultra-thick resists which often involves spinning the material at speeds below the optimum dynamic spin speed range. The ACS300 Gen2 offers contamination control and automated cleaning capabilities which is of particular importance when processing high viscosity material. The combination of precision edge bead removal and an optimized chuck / bowl design guarantees best in class edge bead performance. Thick Resist Baking For superior bake performance with ultra-thick photoresists the ACS300 Gen2 enables fully programmable proximity bakes which allows for optimizing bake time versus temperature. Highly symmetric exhaust and purge geometries guarantee for uniform solvent removal across the wafer during the bake. When utilizing such careful bakes, uniform solvent content in the photoresist prepares the substrate for subsequent exposure and develop steps. Thick Resist Development SUSS MicroTec has incorporated features allowing highly uniform resist development with lowest media consumption and shortest process times. The developer chemistry can be heated in a controlled fashion and is applied to the wafer by a large assortment of optimized dispense nozzles. The dispense pattern is controlled by of user-definable dispense arm sweeps including variable rate arm movement. Recipe-programmable z-height of the dispense arms is applied for optimization of develop media impact and wafer coverage. For the development of thin photoresist and other polymers, the ACS300 Gen2 shows exceptional uniformity and stability due to media flow, spin speed and point-of-use temperature control. ACS300 Gen2 Application Overview SOLDER BUMPING GOLD BUMPING FRONT-/BACKSIDE RDL CU PILLAR Photoresist Coat & Develop Coat & Develop Re-routing Layers Via Formation Dry Film Develop Dielectrics (e.g. Polyimide, PBO, BCB) Polyimide for Repassivation Lithography for 3D Packaging 4

5 Enabling GYRSET Coating Technology The GYRSET rotating closed cover coating process enables a unique turbulence-free and solvent rich atmosphere above the substrate during coating, thereby significantly reducing the influence of ambient temperature and humidity on the processing results. Two major physical effects can be taken advantage of: First, the air flow above the wafer does not get turbulent, since the enclosed atmosphere is forced to spin at the same speed as the substrate. Photoresists designed and qualified for 200 mm do not always work well for 300 mm, since the required spin speeds are above the limit tolerable for laminar air flow. This causes fringes and non-uniformity at the wafer edge for spins above a critical speed limit. For non-round substrates like squares or even pieces, this is even true for slower spin speeds. The GYRSET technology eliminates these turbulences almost completely. Second, the solvent rich atmosphere keeps the resist material closer to its original viscosity for an extended period of time. Thus, the resist is also able to flow for an extended period of time, compared to conventional open bowl coating. This results into a greatly widen process window. Already qualified resist materials can be used for even thinner layers than originally intended. This reduces qualification work and the number of different resist types in warehousing. with GYRSET GYRSET System Conventional Turbulence free coating using GYRSET allows uniform resist thickness even to the corner of substrates without GYRSET 5

6 SYSTEM O Spin-Coating Module The GYRSET principle enables highly uniform coatings of 200/300 mm wafers as well as square substrates with minimum resist consumption. Processes with open and rotating closed cover can be accommodated. The spin coating modules have three independent, optionally temperature controlled dispense lines per arm. The solvent media set-ups allow for precision Edge Bead Removal and Back Side Rinse. The Auto Nozzle Clean option allows for individual cleaning of each resist dispense nozzle. Automatic chamber cleaning enables easy maintenance and guarantees higher uptime. Hot plate Stack The ACS300 Gen2 HCV stack can be individually configured with up to 7 hot or cool plate cassettes or a HMDS vacuum primer that takes 2 positions in the stack. The ACS300 Gen2 can have one HCV stack in a defined module position and can also be equipped with a frame extension which can have another two HCV stacks. The plate cassettes have motorized lift pins with programmable lift height as well as fixed minimum proximity balls which guarantees for optimum bake results. Evaporating solvent is extracted through a balanced environment of individually adjustable exhaust and nitrogen purge. Developer Module An assortment of dispense options is available for developing exposed films. Binary spray, fan spray or stream /puddle dispenses are standard configurations. The dispense arms offer programmable sweep movements and are also programmable in height for best spray geometry. For optimal CD uniformity control individual dispense arm sweep patterns can be programmed in each recipe. The pointof-use temperature control offers excellent uniformity for temperature sensitive processes. 6

7 VERVIEW Input/ Output Module (I/O) The ACS300 Gen2 offers two different I/O options. Up to two load port modules can directly be attached to the machine frame. With a separate EFEM the ACS300 Gen2 can be equipped with up to four load port modules, which offer integrated wafer mapping and can be used with standard FOUPs or FOSBs. Full bridge capability is ensured by cassette adapters that allow handling 200 mm wafers. The ACS300 Gen2 offers the flexibility of simultaneous 200 and 300 mm wafer processing without mechanical changeover. Process Flow Integration In each frame one central 6-axis robot serves up to four spinner modules. For larger configurations further robots can be added. The industry proven 6-axis robot combines highest speed and accuracy with a long range. With a maximum payload of over 3 kg this robot also allows for handling heavy substrates like stacked wafers or carrier solutions like glass, silicon or ceramics. Non-contact wafer centering is accomplished by an optical prealigner system that uses machine vision for determining the wafer position. Any misalignment is corrected by the robot. Media Cabinet The media cabinet is equipped with individual drawers for easy access to resist and chemicals. Tanks can be filled from a central media supply. Automatic tank and bottle switching enables continuous operation. The media supply is configurable for a large variety of media combinations. Depending on the system configuration a larger number of tanks and resist bottles can directly be installed in the chemical compartments of the process modules. This guar antees for short dispense lines to the point of use which is of particular importance for high viscosity material. 7

8 Enabling Controller Technology The production proven software of the ACS300 Gen2 offers the most up-to-date controller technology available in the market. The system is based on Windows 7 operating system combined with Multi Module Controller (MMC) software. It provides a user interface that graphically shows the current status of the entire machine. For service purposes each module can be accessed individually. Machine operation is intuitive and easy to learn. The location and status of each wafer in the machine is displayed in real time. Module controller components and software are based on a common design for convenient serviceability. Intuitive GUI Design + Level indication for all chemicals + Visualization and status of wafers + Icons for each module + Programmable user levels + Instant access to all current analog & digital module parameters Process recipes and flow sequences are generated with point and click ease. The sequence cascading feature enables continuous substrate flow, even in case of sequence change. The operator can run multiple process flows, multiple recipes and multiple substrate sizes simultaneously. He can, e.g. run one cassette of wafers in a coating sequence while running another one in a developing sequence. Online and offline sequence editing and process simulation are possible even during operation. Detailed protocols and E10 states facilitate wafer and tool tracking. A host interface is available which is compliant to SECS-II/GEM (SEMI E4/ E5/E30/E37) and 300 mm communication standards (SEMI E40/E87/E90/E94 and E116 states). + Simple sequence / recipe path editing + Simply drag and drop module icon into path + Each module slot is represented by an icon 8

9 Lithopack300 Integrated Coat, Bake, Expose, Develop Solution The SUSS LithoPack300 is a dedicated lithography tool for wafer-level packaging of 200 and 300 mm wafers with coat, bake, expose and develop modules. It allows quick changeover between 200 and 300 mm wafers and is the integrated lithography solution for both integrated device manufacturers as well as foundries. With the next generations of both the ACS300 coat / develop cluster as well as the MA300 mask aligner SUSS MicroTec now offers an unprecedented integrated and modular lithography solution. MA300 Gen2 Module The MA300 Gen2 exposure unit is a 300 mm 1X Full-Field proximity mask aligner that enables wafers to be exposed in a single step, enabling the printing of special features at the wafer periphery without compromising on high throughput. This is an important advantage of the mask aligner over stepper technology especially when subsequent metallization of bumps or redistribution traces is to be carried out using an electroplating process. The SUSS MA300 features a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging. 9

10 ACS300 Gen2 The ACS300 Gen2 is a modular cluster system that can be individually configured from a construction set of frame components and process modules to perfectly match your processing and productivity requirements. The scalable system architecture with field-upgradable process modules guarantees full flexibility from the R&D stage to high volume production. Construction set: I/O Modules ACS300 GEN2 FRAME COMPONENTS MA300 GEN2 2x I/O module 4x I/O module Basic frame for up to 4 process modules Frame exten sion for up to 2 HCV stacks Mask Aligner Exemplary Configuration: ACS300 Gen2: 4 module configuration with 2x I/O module and frame extension for 2 HCV stacks ACS300 Gen2: 8 module configuration with 4x I/O module LithoPack300: ACS300 Gen2 with 4 process modules, 2x I/O module and MA300 Gen2 Mask Aligner 10

11 technical data General features Substrate Size Substrate Handling Substrate Processing User Interface Max. # Spin Modules Max. # HP/CP Max. # of Sequences Max. # of Recipes 200 mm and 300 mm round Option: square and rectangular Fully automatic FOUP, FOSB, open cassette, SMIF and factory automation options Fully programmable cluster tool Windows 7 operating system with SUSS MMC software 8 (scalable system) 24 (scalable system) with 50 steps (on spin processes) each coat and develop modules Spin Speed Control ±1 rpm with digital spin motor controller # of Dispense Lines Up to 3 temperature controlled resist dispense lines per dispense arm Options Large selection of pumps and dispense systems Edge bead removal and back side rinse Controlled flow meters Programmable exhaust Spin motor flange temperature control Filter fan units or local cleanroom Wafer Edge Exposure Develop Chemistries Developer Dispense Module designs for aqueous and solvent based developing Stream / puddle, binary spray and fan spray oven stack modules hot plate Hot Plate Temperature Up to 250 C Temperature Uniformity 0.8 C up to 100 C 1 % above 100 C Bake Method Programmable proximity with fixed minimum proximity cool plate Cool Plate Temperature 15 to 30 C Temperature Control ± 0.2 C Cool Method Programmable proximity with fixed minimum proximity vapor prime Features Vapor Prime Temperature Up to 250 C Priming Method HMDS vapor prime utilities Vacuum min bar, +/- 5 % Compressed Dry Air 8 bar, +/- 10 % Nitrogen 8 bar, +/- 10 % DI Water 3 bar, +/- 10 % Power Configuration dependent Data, design and specification of custom built machines depend on individual process conditions and can vary according to equipment configurations. Not all specifications may be valid simultaneously. Illustrations in this brochure are not legally binding. SUSS MicroTec reserves the right to change machine specifications without prior notice. 11

12 Japan South Korea USA Germany Switzerland France United Kingdom Singapore China Taiwan Headquarters Production Sales Visit for your nearest SUSS representative or contact us: SÜSS MicroTec AG Phone: ACS300 Gen2 10/2014 BR_ACS300Gen2_2014 V1