Platform Symposium Sept 2004

Transcription

1 Platform Symposium Sept 2004 Commodity Qualification Challenges

2 Platform Procurement Commodities Mechanical Metals and Plastics Fabrication Drawer/Rack/Cage Assembly Power AC/DC, DC/DC, Adapters, Batteries Interconnect Cables, Connectors Cooling Fans, Blowers, Heatsinks, Water, Refrigeration

3 Platform Spend Segmentation by Commodity/Brand Cooling 7% T'centre 23% pseries 17% iseries 4% Power 29% Mechanical 43% xseries 14% T'pad 26% zseries 5% Interconnect 21% SSD 11% Total Spend Outlook $2.01B

4 Commodity Qualification Challenges Customer Requirements Customer Satisfaction Design Challenges

5 Commodity Qualification Challenges What is the Hurdle? Quality & Reliability

6 Power Qualification Challenges Higher Density Assemblies System Simulation and Integration Test Costs Short Development Schedules Limited/Late Sample and System Availability Limitations of Classical Reliability Testing Increased Reliance on Supplier Development and Test Test Equipment to Handle High Current/Low Voltage Impacts of RoHS on Quality/Reliability

7 Power Qualification Requirements Process Improvements HALT Testing Multiple environmental, input and load conditions tested Improved design robustness Redundancy Testing and System Integration Testing Current sharing Loop stability Hot plugging Power system communication Design Simulation / Modeling Tools Sub-tier Supplier Qualification Bill of Material (BOM) Scrubs Identify Single Source Components High Risk Components

8 Power Qualification Requirements Process Improvements - continued De-rating Guidelines Clearly defined expectations Operational verification of actual stress Anti-smoke Protection and Verification Abnormal tests, shorts and opens Block diagrams of protection circuits Test Cards Designed to simulate system configuration and impedance characteristics Used for production and development testing RoHS Compliance Sheet metal and component compliance by 1Q05 Active investigation and investment in Pb-free solder processes prior to 2010 Server Requirement

9 Future Power Technical Challenges and Solutions Higher Reliability - MTBF Higher Power Density Higher Transient Response - di/dt Higher Efficiency Lower Voltage - Higher Current Voltage/Current Distribution Increased Number Of Voltage Domains Ability to Hot Swap Error and Status Reporting Increased Mobile Client Power Needs Lower Cost Shorter Development Cycles Best Industry Reliability Improved Simulation Tools/Analysis More Integration Higher Switching Frequencies Lower Switching and Conduction Losses Topology Influences Better EMI Design Innovative Design Lower Output Impedance Thermal Management Improved Test and Verification Techniques Component Improvements Integrated Circuits Core Materials Power Semiconductors Capacitors Interconnect Battery Technology

10 Thermal Qualification Challenges Thermal Performance Processor Speeds Noise Requirements Space Limitation Reliability Process capability

11 Thermal Qualification Challenges CPU Cooler Existing Qualification Processes Validate Thermal Performance First Article Inspection (FAI), Fit and Function Planned design changes to meet future system cooling requirements Thinner Thermal Grease thickness Tighter base flatness/surface finish RoHS/Environmental Compliance Additional Planned Qualification Processes Sub-Tier Supplier Qualification Validation of RoHS/Environmental Compliance Automated Visual and Dimensional Inspection

12 Thermal Qualification Challenges Air Moving Devices Existing Qualification Processes Performance Validation (CFM, Pressure, Noise, Vibration, PWM, current draw, etc.) First Article Inspection (FAI), Fit and Function System EMC test Planned design changes to meet future system cooling requirements Improved Acoustics (less noise) RoHS/Environmental Compliance Additional Planned Qualification Processes Advanced Acoustical testing Life Test Validation by Independent 3rd party Lab Sub-Tier Supplier Qualification Validation of RoHS/Environmental Compliance

13 Thermal Qualification Challenges Stretch Requirements Performance Extensive Life Test Confirmation Fan Motors, Bearings Lower Energy Consumption Fin Design - Complex Shapes/New Mtls Assembly Solder Replacement Fusion Process High Level Functional Testing 100%

14 Interconnect Qualification Challenges Electrical Performance Intermateability Durability Reliability Process capability

15 Interconnect Qualification Challenges Electrical Performance Cables (High Speed & Flex) Existing Qualification processes Performance Attenuation / Impedance Cross Talk / Skew Eye Opening / Jitter Assembly First Articles 100% Continuity Tests / 4 wire DC resistance / hi pot 5-20% impedance / attenuation / skew / cross talk New Qualification Processes Performance Spice Models EMC Requirements TBD Assembly 100% Expanded Electrical Testing, if needed Solderability of high density / <26AWG (larger diameter) wire Increased automated visual inspection elements terminations / flex signal line integrity Twisted Pair testing to ensure pair integrity

16 Interconnect Qualification Challenges Intermateability Focus on multiple sources / industry standards Need suppliers to own intermateability testing Durability Increased plug counts for manufacturing requirement 250 plugs with 10 year field life Reliability Continued use of Johnson Distribution Failure Rate model Process Capability Implement Process Qualification during initial performance qualification Suppliers to store process capability data on SQMS2 Increased Sub Tier Supplier Quality Management

17 Interconnect Qualification Challenges Stretch Requirements Expand automated testing capability Hi performance parameters i.e. impedance, NEXT, skew No impact to mfg capacity Comprehensive test scope Accuracy improvements SPC controls Supplier Self Qualification for Hi Performance Cables Automated design tools Comprehensive component models allowing assembly superposition techniques Automated Information Flow for Connector Attributes Streamline BOM Reviews Automate RoHS compliance reporting

18 Platform Commodity Qualification Challenges Summary Simulation / Modeling Capability Supplier ownership of process controls In house & Sub tier Reduced Process Variation EMC containment verification Earlier involvement with System View Qualification Processes in line with IBM requirements Supplier Tested / IBM Assured