3D Packaging and Reliability

Transcription

1 3D Packaging and Reliability Klaus Pressel Eurpean 3D TSV Summit and CATRENE prjects Grenble (France), January 22nd, 2014

2 Cntent Mtivatin: System Integratin Everywhere System integratin: Packaging makes the Difference Success factrs Understand reliability requirements f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 2

3 Applicatins & Custmer Requirements SiP integratin everywhere Cmmunicatin and Cmputing Autmtive Electrnics Energy generatin and energy distributin (e.g. smart grid) Industrial Electrnics (e.g. energy efficient driver) And thers: e.g. Slid State Lighting, medical, aernautics, 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 3

4 Technlgies: Mre Mre is getting ut f steam Mre Mre getting ut f steam Mre Mre reaches limits By shrinking f CMOS - better perfrmance/speed - less energy cnsumptin - miniaturizatin - less cst per transistr In additin: - utstanding yield Mre than Mre & High value system Packaging has becme the limiting element in system cst and perfrmance The Assembly and Packaging rle is expanding t include system level integratin functins. As traditinal Mre s law scaling becme mre difficult innvatin in assembly and packaging can take up the slack. 22 nd f January 2014 Cpyright Infinen Tehnlgies AG All rights reserved. Page 4

5 Cntent Mtivatin System integratin: Packaging makes the Difference Success factrs Understand reliability requirements f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 5

6 Innvative packaging makes the difference Example I: Package enables small frm factr Example II: Package enables high I/O crssing the intercnnect gap Example III: Packaging enables high efficiency Example IV: Packaging enables high perfrmance mm-wave Example V: Packaging enables integratin f high functinality Innvative package allws t vercme barriers 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 6

7 Cntent Mtivatin Applicatins: Custmer needs drive system integratin everywhere Technlgies: Grwing imprtance f Mre than Mre System integratin: Packaging makes the Difference Success factrs Understand reliability requiremens f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 7

8 Reliability: Understand applicatins and custmer requirements Different applicatins have different reliability requirements, e.g. drp test vs. TCB Understand applicatin requirements e.g. checking f bard thickness It is nt guaranteed that the same package fits t different applicatins We need t better understand physics t avid ne chip in different packages Different packages have different failure mdus; we need t investigate unknwn failure mdus 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 8

9 Cntent Mtivatin Applicatins: Custmer needs drive system integratin everywhere Technlgies: Grwing imprtance f Mre than Mre System integratin: Packaging makes the Difference Success factrs Understand reliability and requirements f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 9

10 Miniaturisatin and mre Functinality require 3D Integratin 22 mm Package frm factr: Package area chip area QFP ~ 5,5 13 mm BGA ~ 2 CSP < 1,2 FCB/ WLP fan in = 1 9,34 mm Stacks: culd becme <1 and external I/O n may be reduced Package-n-Package (PP) 3D with TSV allws further density increase 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 10

11 Examples f BGA based packaging tree - We fcus n technlgies with lw parasitics >1 die side-by-side stacked die stacked package embedded passive integratin face-t-face MCM Side by side SiP WB/ WB FC/ WB >2 dies µ-flipchip Thru Si via PP Pack. n SiP ewlb New Prcesses Wafer level packaging Frnt-end and wafers Back-end merge Recnstituted 2.5D & 3D integratin Wafer thinning (+ handling thinned wafers) Frntend and Backend merge Embedded pwer 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 11

12 We develp tlbx elements fr SiP integratin: example: different types f vertical 3D cntacts Traditinal 3D by Wire Bnding Innvative 3D by TEV Nrmal crss sectin X-ray tmgraphy 3D by TSV package (curtesy f ams AG) 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 12

13 Make the right chice fr yur tlbx: TSV with (via first), via middle, via last Cmplexity requires careful technlgy chice fr applicatin Surce: YOLE Develppement D IC integratin & TSV intercnnects 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 13

14 SiP Tlbx elements based n ewlb: i) Opprtunities fr side by side cnnected by RDL 100 Ω differential transmissin line ii) Integratin f inductr in fan-ut regin M. Wjnwski et al (Infinen) ECTC 2011 Q = 25 at 6.5 GHz CSiP iii) Example fr 3D integratin f discrete passives (2 dice with stacked & duble sided RDL) iv) Example f integrated antenna (CATRENE prject 3DIM3) 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 14

15 Cntent Mtivatin Applicatins: Custmer needs drive system integratin everywhere Technlgies: Grwing imprtance f Mre than Mre System integratin: Packaging makes the Difference Success factrs Understand reliability requirements f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 15

16 New materials enable package innvatins Dielectrics e.g. islatin fr RDL, Inductrs & Caps, e.g. in thin film RDL Cu wire,. Barrier layers e.g. diffusin barrier,... Adhesives e.g. die attach, Nan-materials e.g. sintering, printing Cmpsite materials e.g. advanced mld cmpund (> 200 C) 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 16

17 Success factr: Material Knw Hw Example fr imprtance f materials in ewlb 1) Mld cmpund with small filler size and lw viscsity fr side by side SiP (experience frm TSLP) 2) CTE f materials allws lw warpage => advantageus fr package stacking 3) Plating resist and temprary adhesive 4) Understand and imprve interfaces f materials (adhesin, avidance f electrmigratin, ) 5) Material parameters capable fr mm-wave applicatin 6) Understand cherence f chip-package-bard materials 7) Thermal prperties => design pprtunities fr ht spts & thermal balls Miniaturisatin and System Integratin with new materials need an advanced failure analysis (FA) capability 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 17

18 Cntent Mtivatin Applicatins: Custmer needs drive system integratin everywhere Technlgies: Grwing imprtance f Mre than Mre System integratin: Packaging makes the Difference Success factrs Understand reliability requirements f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 18

19 First wrk n electrical design & layut in CSiP prject but needs t be extended by multi-physics and mre System Flrplanner Netlist Manager Next steps: Implement Multi-physics => Data Exchange Backbne thermal mechanical thermmechanical & Die Design CSiP nd 22 f January 2014 Package Design PCB Design Cpyright Infinen Technlgies AG All rights reserved. manufacturability & csts Page 19

20 Cntent Mtivatin Applicatins: Custmer needs drive system integratin everywhere Technlgies: Grwing imprtance f Mre than Mre System integratin: Packaging makes the Difference Success factrs Understand reliability requirements f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 20

21 Managing Cmplexity: Summarized we bserve 5 trends Demanding system reliability & thermal management Diversity f technlgy Cmplex material mix Cnvergence f IC/Package/PCB technlgy 3D designs Expansin twards high reliability applicatins (autmtive, aviatin pwer distributin, medical) High reliability f system requires even higher reliability f sub cmpnents! Varius analg & digital specific IC technlgies (memries, RF, prcessrs, pwer ) MEMS (sensrs, actuatrs ) Passives Wide range f material prperties (Si, metal, ceramics, plymers, cmpsites etc.) Wafer level packaging Chip embedding in laminate Thrugh silicn via & thrugh encapsulant via Further shrink f intercnnects (fine pitch wire bnd, thinfilm technlgy, TSV) Integratin f passives r functins in RDL/TSV Stacked die appraches Multiple stacks f sub-packages, interpsers PP (package n package) MEMS Set-up Knw Hw and investigatwe standardizatin 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 21

22 Cntent Mtivatin Applicatins: Custmer needs drive system integratin everywhere Technlgies: Grwing imprtance f Mre than Mre System integratin: Packaging makes the Difference Success factrs Understand reliability requirements f custmers Innvative assembly and packaging technlgies Understand material physics Cherent chip-package-bard c-design Management f cmplexity Cnclusins 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 22

23 What d we need? Understand yur applicatin requirements (reliability) Understand yur custmer (price, perfrmance, ) Understand trade-ffs between technlgies (TSV, TEV, ) Understand and develp the apprpriate tlbx elements Understand physics f prcesses, failures, perfrmance, Understand yur supply chain. We need T-shaped persns The EUREKA CATRENE Prgram pens cllabratin pprtunities 22 nd f January 2014 Cpyright Infinen Technlgies AG All rights reserved. Page 23