Semiconductor Components, Instruments and Subsystems (SCIS)

Transcription

1 Semiconductor Components, Instruments and Subsystems (SCIS) SCIS Overview & Activity Status August 2017 Special Interest (SIG)

2 Supply Chain Issue Problem Statement: Defects introduced by process-critical OEM components affect final wafer quality resulting in lower yields and higher manufacturing costs. Several yield excursions are linked to wide range of component and subcomponents induced defectivity. Components and sub-components defect traceability lack the rigor for advanced technologies (detectability, sensitivity/methodology). Existing standards, if any, are inadequate for addressing advanced process control requirements.

3 SEMI SCIS Special Interest (Semiconductor Components, Instruments, and Subsystems) Focus: Establishing a baseline for measuring defects introduced by processcritical components. Particle or defect limits will not be defined, but will focus on defining consistent methodologies for measuring defects. SCIS provides a forum that fosters discussion and aligns stakeholders on pre-competitive industry-critical issues. Participants are not expected to disclose IP but are expected to provide parameters for standardized measurement.

4 SCIS Organizational Structure SCIS Executive Advisory Committee SCIS Steering Committee Seals & Valves Critical Chamber Components Traceability Verification RF Gas Delivery Liquid Delivery Dry Pumps

5 Structure Executive Advisors Oversight Roadmap Stakeholder management Meets bi-monthly Steering Committee Monitor subteam progress Provide guidance Resolve escalated issues Assist in recruitment of key stakeholders Meets monthly Working s Component characterization Test method development for measuring defects Standardization of formats and protocols for parts traceability process Meets bi-weekly

6 Addressing Defectivity Problems in HVM # Item Description Phase 1 Phase 2 Define Key Characteristics / Parameters Sub-Component Survey Document Characterization Plan Define Independent Test Plan Part/Sub-system Specification Primary characteristics which contribute to defects: New state End of Useful Life Larger community IDM-OEM-Supplier input: Primary contributors to defects High impact processes which create elevated defects Define how each characteristic is tested, Sample size Processes used to simulate end of life Test Plan which verifies defect levels Cleanliness testing Particle measurement SPC Analysis Summary Key Characteristic Capability Defect Characteristic Capability Create a standard system of comparable metrics which will be used to rate, compare, and classify process-critical OEM components in order to reduce defects generated in semiconductor manufacturing. 6

7 SCIS Activity Status Focus: Establishing a baseline for measuring defects introduced by process-critical components. [Particle or defect limits will not be defined, but will focus on defining consistent methodologies for measuring defects.] Deliverable SCIS Development Target Completion Standardization Target Completion Seals & Valves Guide for Seal Cleaning & Packaging Completed 3Q16 Publication 3Q17 Measurement Method for Seal Leak Rate In progress 4Q17 Not Started --- RF Measurement Method for RF Generator Transient Response Completed 1Q17 In progress 1Q18 Traceability Verification Standardized Part Traceability Protocol In progress 4Q17 Not Started --- Critical Chamber Components Measurement Method for Showerheads ICPMS Measurements, Particles In progress 4Q17 Not Started --- Dry Pumps Measurement Method for Vibration & Noise In progress 4Q17 Not Started --- Gas Delivery Liquid Delivery Measurement Method for Metallic Contamination of Gas Delivery Systems Measurement Method for Hydrocarbon Contamination of Gas Delivery Systems Particle Measurement Method for Pressure Pulsed Operation Measurement Approach for Particle Contribution of Liquid Delivery System Measurement Approach for Metallic Contribution of Liquid Delivery System Measurement Method for Organic Contribution of Liquid Delivery System Completed 2Q16 In progress 1Q18 Completed 2Q16 In progress 1Q18 In progress 1Q18 Not Started --- Completed 4Q16 In progress 4Q17 Completed 4Q16 In progress 4Q17 In progress 2Q18 Not Started ---

8 Participating Companies Subcomponent Suppliers Equipment OEMs Device Makers / Foundries Advanced Energy Greene, Tweed Applied Materials GLOBALFOUNDRIES Applied Seals NA Horiba ASM Intel AP Tech INFICON ASML Texas Instruments Brooks Automation Kashiyama KLA-Tencor Micron Busch Pall Lam Research IM Flash Chemours Parker / Veriflo Tokyo Electron Samsung ChemTrace Pfeiffer SCREEN recruiting TSMC recruiting CKD USA PPE Comet QEI DuPont SHI Cryo Ebara Swagelok Edwards UCT Entegris Valqua America Festo VAT Valve

9 SCIS Accomplishments Standardization Measurement methods for seal outgassing, ashing conditions, leachables, total organic content (TOC). [SEMI F ] Coming soon! Guide for Seal Cleaning & Packaging [SEMI F51-xx17] Measurement Method Development RF Generator Transient Response Standardization in progress, RF Measurements TF under the Metrics Technical Committee Metallic Contamination for Gas Delivery Systems Standardization in progress, Materials of Construction TF under the Gases Technical Committee Hydrocarbon Contamination for Gas Delivery Systems Standardization in progress, Materials of Construction TF under the Gases Technical Committee Organizational Structure Established Executive Advisory Committee Recruited key supply chain stakeholders (4 IDMs, 5 Equipment OEMs, 30+ Component Suppliers)

10 Value Proposition Benefits SCIS Suppliers Equipment OEMs End Users Improves product development efficiency by streamlining product testing requirements. Reduces overhead of duplicate but different test requirements. x x Increases design efficiency by defining user performance requirements and measurement methods. Improves alignment between customer and supplier. x x Enables faster root cause analysis, containment and problem resolution when parts traceability information is required. x x x Provides standardized metrics to enable customer and supplier to differentiate between product choices and identify best suited for the target application. x x x Provides baseline for assessing incoming parts quality. Facilitates partnering between customer and supplier to improve performance. x x x Enables superior fab process control. Reduces costs and improves yield. x

11 Upcoming SCIS Meetings September 18, 2018 [tentative] SEMI Headquarters 673 S. Milpitas Blvd Milpitas, California In conjunction with the SEMI Strategic Materials Conference (SMC) September Welcome Reception on Sept 18 Evening DoubleTree by Hilton 2050 Gateway Place San Jose, California 95110

12 Why? Why Does it Matter? 1. You can t fix what you can t find. 2. You can t control what you can t measure. 3. The most expensive defect is the one that was not detected inline. 4. Variability is the enemy of a well controlled process. 5. SCIS mission: agree what the most impactful parameters to part. agree to meaningful measurements. agree to traceability across supply to end-customer And we have a fundamental to reducing defects

13 Contact Information Paul Trio Senior Manager, Strategic Initiatives 673 S. Milpitas Blvd Milpitas, California Phone: