Printed Circuit Board Assembly. Value Stream Mapping Activity

Transcription

1 Printed Circuit Board Assembly Value Stream Mapping Activity

2 NMI Manufacturing Excellence Conference Presentation SLIDE 2 Presentation Title Printed Circuit Board Assembly value stream mapping improvement activity Presentation Abstract We are in the process of completing a project to improve the assembly lead time for a family of four printed circuit board assemblies. We have used lean methodologies to conduct a baseline assessment and capture the current state process. The assessment captured some undesirable observations some of which were addressed immediately. A current state value stream map (VSM) was produced, this clearly identified significant non-value added activity. From this we were able to create a future state VSM which makes our proposed improvements highly visible. Our next step will be to implement our changes and re-baseline to ensure the improvements are achieved.

3 The Product IPC Class 3 PCB assembly SLIDE 3

4 Observation of the Process Capture Undesirable Observations (UDO s) SLIDE 4 Excessive false calls identified on AOI rework (Automated Optical Inspection). Loose components on surface mount. Depanelisation with hand router (risk of damage). Variation in material format. Surface mount components are supplied in unsuitable format. Occasional component shortages. Partner boards run through surface mount at different times increasing overall set up time. Excessive WIP

5 Brainstorming Thought Process Map SLIDE 5

6 Brainstorming Key Points SLIDE 6 Eliminate false calls identified on AOI rework (Automated Optical Inspection). No loose components on surface mount. Improve depanelisation possibly using laser machine. Eliminate variation in material format. Ensure surface mount components are supplied in correct format. Occasional component shortages. Improve stock accuracy (eliminate unplanned shortages). Improve information flow within / between departments (to provide clear visibility of requirements and any changes).

7 Observation of the Process Undesirable Observations (UDO s) SLIDE 7 Cause & Effect Analysis

8 Observation of the Process Undesirable Observations (UDO s) SLIDE 8 Cause & Effect Analysis Prioritisation of Issues

9 Prioritisation of Improvement Opportunities PICK Chart (Plan, Implement Challenge, Kill) SLIDE 9

10 Current State Value Stream Map The Process Today! SLIDE 10

11 Current State VSM, Baseline Timings SLIDE 11 Average monthly demand 118 current batch size 232. Value added time Non value added time 5.88 minutes 1254 hours Therefore <0.5% of production time is value added activity. What is our biggest problem? 52 days waiting / queue time.

12 Future State Value Stream Map How We Can Improve Things! SLIDE 12

13 Future State Improvements What can we do? SLIDE 13 Kit job when production start is planned. Saving 20 days Plan to finish production with smaller finished goods buffer. Saving 12 days Reduce batch size from 232 to 140. Saving 92 parts This allows time saving between operations. Saving 8 days Load components before previous job finishes. Saving 200 mins Change panelisation from 2 to 6. Saving 1 min Improve false calls. Saving 1.6 min Check component format during kitting operation. Saving -10 min Add component quantity check when surface mount reel are returned to stores. Saving 65 min TIME SAVING >40 days, 2 hours INVENTORY SAVING 92 parts

14 Ideal State Value Stream Map How We Can Further Improve! SLIDE 14

15 Ideal State, Further Improvements What else can we do? SLIDE 15 Implement one piece flow (1 panel of 6 PCBA s). This allows for parts to be finished as they are completed on surface mount. Waiting time between work stations now 3 minutes. Saving 5 days Change method of depanelisation Saving 1 minute Negotiate LTA with supplier with possible VMI / buffer stock. Supplier OTIF 100% TIME SAVING >5 days SUPPLIER DELIVERY OTIF 100%

16 SLIDE 16 Thank You! Questions?