Molding Power Choke. - CSAB0730 Series. Marking. Marking. Date Code. Outline: 1 Appearance and dimensions (mm)

Transcription

1 Outline: Magnetic shielded structure: excellent resistance to electro magnetic interference(emi). A composite structure, ultra low buzz noise. Low loss, high efficiency, wide application frequency. Lightweight design, save space, suitable for high density SMT. Die-casting by low loss alloy powder: low impedance, small parasitic capacitance. Operating temperature : (Including coil s temperature rise) ( ) 1 Appearance and dimensions (mm) 7.0± ± ± ± ± ± / Reference land pattern (mm) 4 Schematic / 7

2 5 Electrical characteristics Part No. Inductance (μh) D.C.R. (mω) Saturation current (A) Temperature rise current (A) 20% Typical Max Typical Typical CSAB0730-R22M CSAB0730-R33M CSAB0730-R47M CSAB0730-R56M CSAB0730-R68M CSAB0730-1R0M CSAB0730-1R5M CSAB0730-2R2M CSAB0730-3R3M CSAB0730-4R7M CSAB0730-5R6M CSAB0730-6R8M CSAB0730-8R2M CSAB M CSAB M All data is tested based on 25 ambient temperature Inductance measure condition at 100kHz, 1V. 100kHz, 1V 2 Saturation current the actual value of DC current when the inductance decrease 30% of its initial value. 30% 3 Temperature rise current the actual value of DC current when the temperature rise is ΔT40 (Ta=25 ). ΔT40 (Ta=25 ) Special remind Circuit design, component placement, PWB size and thickness, cooling system and etc. all will affect the product temperature. Please verify the product temperature in the final application. (PWB) 2 / 7

3 6 Saturation current VS temperature rise current curve 3 / 7

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5 7 Packing specification 7.1 Carrier tape dimensions (mm) 3.6 Ref 3.4± ± ±0.1 A +0.1 Φ ± ± ±0.05 B A 12.0±0.1 B 7.5± ±0.3 (6.75) A-A 7.05±0.1 B-B Packing is referred to the international standard IEC IEC Tape direction End Feeding direction Sprocket hole Start Carrier tape No component 160mm Min. Component No component 100mm Min. 400mm Min. 7.3 peel off condition 165 ~180 peel force shall be 0.1 to 1.3N N Reference peel speed mm/min mm/ Pull direction Carrier tape Unreeling direction 5 / 7

6 7.4 Reel dimensions (mm) Max. W2 W Label 13.0± ± ± ± Min. Sprocket hole Unreeling direction 7.5 Carton dimensions W Min. Inner Carton mm Out Carton mm Product Series Quantity / Reel / Inner Carton Quantity Out Carton Quantity CSAB pcs 3000pcs = (3 1000) 9000pcs = (3 3000) 7.6 Label making The following items will be marked on the reel of product label and shipping label. Production Label Part No. Electrical Information Quantity Packing No. Shipping Label Customer Name Customer Part No. Supplier Part No. Supplier Name Country of origin 6 / 7

7 Temperature 8 Soldering specification 8.1 Reflow profile for SMT components SMT T( ) T P Max. Ramp Up Rate = 3 /s Max. Ramp Down Rate = 6 /s t P 20~30s T C -5 T L 217 T S Max. 200 Preheat Area t L 60~150s T S Min. 150 t S 60~120s s Max. (Time of 25 to peak temperature) Time t(s) 8.2 Classification of peak package body temperature (T P ) (T P) PB-Free Assembly Package Volume Package Thickness <350 mm mm 3 >2000 mm 3 <1.6mm mm mm Reflow is referred to standard IPC/JEDEC J-STD-020D. IPC/JEDEC J-STD-020D 7 / 7