Chip Beads & Inductors

Transcription

1 Chip Beads & Inductors Introduction Chip Components Guide SAMWHA s CB, CBA,CM, CD series of chip components consist of compact, high performance beads and inductors. Their innovative components and case structures mean low DC resistance and outstanding highfrequency characteristics. These series are designed for a variety of applications, facilitating component selection for individual circuit requirements. Products Guide Product Name Application Material Part Number / Dimensions Inductance range Signal Line (G) General Frequency (A) CB GA CB GK 1~4 6~1 Chip Ferrite Beads High Power Line (P) Medium Frequency (K) CB GM CB PA 5~1 11~ Ultra High Power Line(U) High Frequency (M) CB PM CB UM 5~6 5~12 Chip Ferrite Beads Array Signal Line General Frequency (A) Medium Frequency (K) High Frequency (M) CBA GA CBA GK CBA GM 3~1 6~1 3~ Chip Ferrite Inductors Signal Line Ferrite (F) CM F.47~33 H Chip Ceramic Inductors Signal Line Ceramic (C) CD C 1.~47nH

2 Chip Beads & Inductors Part Numbering CB 168 G A 12 T CBA 3216 G A 12 N4 E CM 168 F 22 K T CD 168 C 22N J T Series Mark CB CBA CM CD Product Name Chip Ferrite Beads Chip Ferrite Beads Array Chip Ferrite Inductors Chip Ceramic Inductors Dimension Mark Dimension 15 1.mm.5mm mm.8mm mm 1.25mm mm 1.6mm Applications Mark Applications G Signal Line P High Power Line U Ultra High Power Line Material Mark A K M F C Material General Frequency Medium Frequency High Frequency Ferrite Ceramic 3 = 3 21 = 2 61 = 6 12 = 1 Inductance 22N = 22nH 22 = 2.2 H Number of circuits N4 = 4 array Inductance Tolerance Mark G J K M N C S D Packaging Code Mark B T E 3N3 = 3.3nH 22 =.22 H Tolerance 2% 5% 1% 2% 3%.2nH.3nH.5nH Packaging Bulk Pack Tape & eel Pack Embossed Tape Pack 37

3 Chip Ferrite Beads Array Features 1. Good reliability (Monolithic Structure) 2. High impedance characteristics 3. Flow/eflow solder application Applications 1. Computer and its peripherals 2. CD-OM, DVD, MD lines 3. I/O lines of notebook PCs, W/Ps 4. Digital TVs and VTs Product Identifications CBA 3216 G A 12 N4 E Series Code CBA : Chip Ferrite Beads Array Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal line Material Code A : General frequency K : Medium frequency M : High frequency Value Code The first two digits are significant The last digit is the number of zeros following Number of circuits N4 = 4 array Packaging Code T : eed paper packaging E : eed embossed tape packaging B : Bulk packaging Shape & Dimensions (Unit:mm) Model L W T B D E CBA

4 Chip Ferrite Beads Array Specifications 57

5 Chip Ferrite Beads Array Electrical Characteristics 6 CBA 3216 GA 3 N4 12 CBA 3216 GA 6 N4 24 CBA 3216 GA 121 N CBA 3216 GA 151 N4 4 CBA 3216 GA 21 N4 4 CBA 3216 GA 221 N CBA 3216 GA 31 N CBA 3216 GA 471 N4 8 6 CBA 3216 GA 61 N

6 Chip Ferrite Beads Array Electrical Characteristics 12 CBA 3216 GA 12 N4 2 CBA 3216 GA 6 N4 24 CBA 3216 GA 121 N CBA 3216 GK 151 N CBA 3216 GK 221 N CBA 3216 GK 31 N CBA 3216 GK 471 N4 8 CBA 3216 GK 61 N4 12 CBA 3216 GK 12 N

7 Chip Ferrite Beads Array Specifications 6

8 Chip Ferrite Beads Array Electrical Characteristics 12 CBA 3216 GM 3 N4 2 CBA 3216 GM 6 N4 24 CBA 3216 GM 8 N CBA 3216 GM 121 N4 6 CBA 3216 GM 21 N4 6 CBA 3216 GM 31 N CBA 3216 GM 471 N CBA 3216 GM 61 N CBA 3216 GM 12 N

9 eliability and Test Conditions Chip Ferrite Beads Array Item equirements Test Conditions Operating temperature range Storage temperature range Solderability esistance to soldering heat eflow soldering High temperature resistance High temperature load resistance Humidity resistance More than 9% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. shall not change more than 3% More than 5% of the terminal electrode shall be covered with new solder 1. No mechanical damage -55 ~ max., 7%H max. 2. shall not change more than 3% Preheat temperature : 1~15 Preheat time : 6 sec. Solder temperature : 23 1 Soldering time : 4 sec. Preheat temperature : 1~15 Preheat time : 6 sec. Solder temperature : 27 1 Soldering time :1.5 sec. Preheat temperature : 15 Preheat time : 6 sec. Solder temperature : 23 1 Soldering time :1 sec. max. (eflow soldering profile) Temperature : 85 2 Time : 5 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 85 2 Applied current : rated current Time : 1 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 4 2 Humidity : 9 2%H Time : 5 12 hours Measurement at room ambient temperature after placing for 24 hours - at packing condition Chip Beads Chip Inductors 76

10 eliability and Test Conditions Chip Ferrite Beads Array Item equirements Test Conditions Humidity lood resistance Low temperature resistance Thermal Shock Vibration Drop Flexure strength 1. No mechanical damage 2. shall not change more than 3% No mechanical damage Type 4 Array A [mm].8 B [mm].8 C [mm] 3. D [mm].4 W [kgf] 5. Temperature : 4 2 Humidity : 9 2% H Applied current : rated current Time : 5 12 hours Measurement at room ambient temperature after placing for 24hours Temperature : -4 5 Time : 1 12 hours Measurement at room ambient temperature after placing for 24hours for 3 minutes for 3 minutes 3. repeat 1 cycle Frequency : 1~55 Hz Amplitude : 1.5 mm Direction :, T, Sweep time : 2 hours for each axis Drop 1 times on a concrete floor from a height of 1 cm Bending Strength The terminal electrode shall be neither break off nor the chip damage Chip Beads Chip Inductors 77

11 Packaging Bulk packaging eel packaging (Unit:mm) Type Array Q TY(PCS) 1, 4, (T).85 (T)1.25 4, 3, 3, 3, Leader and Blank portion 78

12 Packaging Taping Dimension Embossing Tape Unit : mm Paper Tape Unit : mm 79

13 Land Pattern Design Land Patten Design Chip Ferrite Beads, Chip Ceramic/Ferrite Inductors Unit : mm Chip Ferrite Beads Array Unit : mm 8

14 Soldering Profile Typocal Soldering Performance Profile Characteristics eflow Soldering Pre-heating Soldering 23 5 Cooling 6 sec. min 1 sec. max 6 sec. min Flow Soldering Pre-heating Soldering Cooling sec. min 3 sec. max 6 sec. min Flow Soldering 3 To Soldering Iron : 3W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max Specifications which provide more details for the proper and safe use described product are available upon request. All specifications are subject to change without notice. 81