Ferrite Chip Inductor(Lead Free)

Transcription

1 Ferrite Chip Inductor(Lead Free) FCI- Series P1. 1. Features 1.Monolithic inorganic material construction. 2.Closed magnetic circuit avoids crosstalk. 3.S.M.T. type. 4.Suitable for flow and reflow soldering. 5.Shapes and dimensions follow E.I.A. spec. 6.Available in various sizes. 7.Excellent solderability and heat resistance. 8.High reliability. 9.This component is compliant with RoHS legislation and also support lead-free soldering. 2. Dimension Chip size Size A(mm) B(mm) C(mm) D(mm) 1.6± ± ± ± ± ± ± ± ± ± Part Numbering FCI 2012 F - K A B C D E A: Series B: Dimension L x W C: Material Lead Free Material D: Inductance =10.0uH E: Inductance Tolerance J= 5%, K= 10%, L= 15%, M= 20%, N= 25% 4.Specification Part Number Thickness Inductance C size (mm) (uh) Q min. Test Frequency (MHz) Rated Current (ma) DC Resistance (Ohm) max. SRF (MHz) min. FCI1608F-47N 0.8± FCI1608F-68N 0.8± FCI1608F-82N 0.8± FCI1608F-R10 0.8± FCI1608FR12 0.8± FCI1608F-R15 0.8± FCI1608F-R18 0.8± FCI1608F-R22 0.8± FCI1608F-R27 0.8± FCI1608F-R33 0.8± FCI1608F-R39 0.8± FCI1608F-R47 0.8± FCI1608F-R56 0.8± FCI1608F-R68 0.8± FCI1608F-R82 0.8± FCI1608F-1R0 0.8± FCI1608F-1R2 0.8± TOLERANCE J: +/-5% K:+/-10% L:+/-15% M:+/-20%.

2 P2. Part Number Thickness Inductance C size (mm) (uh) Q min. Test Frequency (MHz) Rated Current (ma) DC Resistance (Ohm) max. SRF (MHz) min. FCI1608F-1R5 0.8± FCI1608F-1R8 0.8± FCI1608F-2R2 0.8± FCI1608F-2R7 0.8± FCI1608F-3R3 0.8± FCI1608F-3R9 0.8± FCI1608F-4R7 0.8± FCI1608TF-5R6 0.8± FCI1608TF-6R8 0.8± FCI1608TF-8R2 0.8± FCI1608TF- 0.8± FCI1608TF ± FCI1608TF ± FCI1608TF ± FCI2012F-47N 0.85± FCI2012F-68N 0.85± FCI2012F-82N 0.85± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-R ± FCI2012F-1R0 0.85± FCI2012F-1R2 0.85± FCI2012F-1R5 0.85± FCI2012F-1R8 0.85± FCI2012F-2R2 0.85± FCI2012F-2R7 1.25± FCI2012F-3R3 1.25± FCI2012F-3R9 1.25± FCI2012F-4R7 1.25± FCI2012F-5R6 1.25± FCI2012F-6R8 1.25± FCI2012F-8R2 1.25± FCI2012F- 1.25± FCI2012F ± FCI2012F ± FCI2012F ± TOLERANCE J: +/-5% K:+/-10% L:+/-15% M:+/-20%.

3 P3. Part Number Thickness Inductance C size (mm) (uh) Q min. Test Frequency (MHz) Rated Current (ma) DC Resistance (Ohm) max. SRF (MHz) min. FCI2012F ± FCI2012F ± FCI2012F ± TOLERANCE J: +/-5% K:+/-10% L:+/-15% M:+/-20%.

4 5. Reliability and Test Condition Item Performance Test Condition P4. Series No. FCB FCM HCB HPB HFB FCA FCI FHI FCH HCI -- Operating Temperature -55~+125 (Including self-temperature rise) -40~+85 (Including self-temperaturerise) -- Storage Temperature -55~ ~ Impedance (Z) Inductance (Ls) Q Factor DC Resistance Refer to standard electrical characteristics list HP4291A, HP4287A+16092A HP4338B Rated Current Temperature Rise Test Solder heat Resistance 30 max. ( T) Appearance: No significant abnormality. Impedance change: Within 30%. ** 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat: 150,60sec. No mechanical damage. Solder: Sn-Ag3.0-Cu0.5 Remaining terminal electrode:70% min. Solder tamperature: Flux for lead free: rosin Dip time: sec. Preheating Dipping Natural cooling 260 C 150 C 60 10±0.5 second second Solderability More than 90% of the terminal electrode should be covered with solder. 245 C 150 C Preheating Dipping Natural cooling 60 4±1 Preheat: 150,60sec. Solder: Sn-Ag3.0-Cu0.5 Solder tamperature: 245±5 Flux for lead free: rosin Dip time: 4±1sec. second second Terminal strength The terminal electrode and the dielectric must not be damaged by the forces applied on the right conditions. W W For FCB FCM HCB HPB HFB FCI FHI FCH HCI: Size Force (Kfg) Time(sec) > For FCA: Size Force (Kfg) Time(sec) >25 20(.787) Flexture strength The terminal electrode and the dielectric must not be damaged by the forces applied on the right conditions. 45(1.772) 45(1.772) Bending 40(1.575) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in)and return. (3.937) Bending Strength The ferrite should not be damaged by Forces applied on the right condition. R 0.5(0.02) Size mm(inches) P-Kgf (0.033) (0.055) 1.0 FCA (0.079) (0.079) (0.106) 2.5 Random Vibration Test Appearance: Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: within 30% Frequency: Hz for 1 min. Amplitude: 1.52mm Directions and times: X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours).

5 P5. Item Performance Test Condition Loading at High Temperature Humidity Thermal shock Low temperature storage test Drop Appearance: no damage. Impedance: within 30%of initial value. Inductance: within 10%of initial value. Q: within 30%of initial value. (FCI FHI FCH) Q: within 20%of initial value. (HCI ) For Bead Appearance: no damage. Phase Temperature( ) Time(min.) Impedance: within 30%of initial value. Inductance: within 10%of initial value Measured: 5 times Q: within 30%of initial value. (FCI FHI FCH) For Inductor Q: within 20%of initial value. (HCI) Phase Temperature( ) Time(min.) Measured: times a: No mechanical damage b: Impedance change: 30% Temperature: (bead),85 5 (inductor) Applied current: rated current. Duration: 8 12hrs. Measured at room temperature after placing for 2 to 3hrs. Humidity: 90~95%RH. Temperature: Temperature: 60 2.(HCI) Duration: 8 12hrs. Measured at room temperature after placing for 2 to 3hrs. For FCB FCM HCB HPB HFB FCA Condition for 1 cycle Step1: min. Step2: min. Number of cycles: 5 For FCI FHI FCH HCI Condition for 1 cycle Step1: min. Step2: min. Number of cycles: Measured at room temperature after placing for 2 to 3 hrs. Temperature: Duration: 8 12hrs. Measured at room temperature after placing for 2 to 3hrs. Drop 10 times on a concrete floor from a height of 75cm Derating **Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Derated Current(A) A 5A 4A 3A 2A 1.5A 1A 6.Soldering and Mounting 6-1. Recommended PC Board Pattern 0 85 Operating Temperature( C) 125 Land Patterns For Chip Size Reflow Soldering Series Type A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) FCB FCA Land Solder Resist FCM HCB HPB HFB FCI FHI FCH HCI UHI Pitch 0.4 L G H PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

6 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure Solder Wave: Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure Soldering Iron(Figure 3): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note Preheat circuit and products to 150 Never contact the ceramic with the iron tip Use a 20 watt soldering iron with tip diameter of 1.0mm 350 tip temperature for Ferrite chip bead (max) 1.0mm tip diameter (max) Limit soldering time to 3 sec. Reflow Soldering TEMPERATURE( C) PRE-HEATING TP(260 C / 10s max.) ~180s SOLDERING 20~40s 60~150s NATURAL COOLING TEMPERATURE C TEMPERATURE 0 C s max. TIME( sec.) Figure 1. Re-flow Soldering(Lead Free) Figure 2. Wave Soldering Figure 3. Hand Soldering Solder Volume: Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: t Upper limit Recommendable 7.Packaging Information 7-1. Reel Dimension A D B 0 P PRE-HEATING SOLDERING NATURAL COOLING PRE-HEATING SOLDERING 3s(max.) 10s(max.) NATURAL COOLING Over 2 min. Within 10 sec. Gradual Cooling Over 1 min. Gradual Cooling 2± ±0.5 R10.5 Type A(mm) B(mm) C(mm) D(mm) C R1.9 R0.5 7 x8mm x12mm "x8mm 7"x12mm Tape Dimension / 8mm Material of taping is paper E:1.75±0.1 P2:2±0.1 P0:4±0.1 D: B0 W:8.0±0.1 t Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) FCB.FCM.HCB HPB.HFB.FCI none none F:3.5±0.1 P A0 Ko FHI.FCH.HCI none Material of taping is plastic E:1.75±0.1 P2:2±0.05 Po:4±0.1 D: A W:8.0±0.1 Bo t Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) FCB,FCM none HCB,HPB HFB.FCI F:3.5±0.05 P D1:1±0.1 A Ao Ko FHI.FCH HCI SECTION A-A FCA

7 7-2.2 Tape Dimension / 12mm P ±0.1 Po:4±0.1 P2:2.0±0.05 D: t Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) FCB, ±0.05 W:12.0±0.1 Bo HCB.FCM FCI D1:1.5±0.1 P Ko Ao 7-3. Packaging Quantity Chip Size Chip / Reel Inner box Middle box Carton Bulk (Bags) Tearing Off Force Top cover tape F 165 to180 The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. ( ) Room Humidity (%) Room atm (hpa) Tearing Speed mm/min Base tape 5~35 45~85 860~ Application Notice Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40 and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized.

8 Typical Impedance v.s. Frequency Curve Q-Frequency Characteristics Inductance-Current 120 FCI1608-Series Q vs Freq. FCI1608-Series L vs IDC. Inductance(uH) R0 1R5 R10 Inductance(uH) R7 1R2 20 4R DC Current(mA) FCI2012-Series Q vs Freq. 120 R DC Current(mA) FCI2012-Series L vs IDC. 330 Q R0 4R7 R10 Inductance(uH) R7 1R R FREQUENCY(MHz) DC Current(mA)