POSISTRIP EKC830. Will effectively remove hard to remove positive photoresist

Transcription

1 EKC Technology POSISTRIP EKC830 Rev. C POSISTRIP EKC830 Posistrip EKC830 is an organic photoresist remover which removes positive photoresists that have experienced harshly treated processing. Posistrip EKC830 offers the following advantages: Will effectively remove hard to remove positive photoresist May be used in automated equipment Water rinsable No corrosive to metals Contains no Phenol or chlorinated solvents Low in metal ions and filtered to 0.10 microns Product Support EKC Applications Engineers available worldwide to provide on-line product support. Completely equipped Quality Control facility to ensure batch-to-batch consistency. On-Staff Environmental, Health, and Safety Engineer to consult or assist customer in the safe use and handling of EKC products.

2 Revision C, Page 2 of 4 APPLICATIONS Standard Applications Maximum Resist Bake: Resist Processing Substrates Metal Layer Structures 200 C. RIE, Deep UV, Plasma Etch Silicon and Hybrids Aluminum, AL/Si, AL/Si/Cu, NiCr and TiW. Special Applications Wax Removal E-Beam Resist Dry Film Resist Multi-Level Processing Polyimide (Cured and semi-cured) Contact EKC's technical staff for specific applications information. PERFORMANCE CHARACTERISTICS Rapid Removal Time. Posistrip EKC830 removes positive photoresists in 5-10 minutes under normal circumstances. For best results, two baths in sequence are preferred. The operating temperature of the chemistry and process times may need to be adjusted to accommodate individual applications. Contact EKC's technical staff for specific process recommendations. Long Bath Life. Posistrip EKC830 was designed for use at elevated temperatures without affecting resist removing properties. The length of time is determined by the operating temperature chosen for the process, the size of the baths and resist loading. High Wafer Throughput. Posistrip EKC830 will process wafers per setup. The actual throughput will vary according to wafer size, resist thickness, and degree of coverage.

3 Revision C, Page 3 of 4 INSTRUCTIONS FOR USE Manual Wet Station 1. Set Up 1.1. Fill suitable processing tanks with full strength Posistrip EKC830. The use of two tanks in series is preferred Heat both tanks to 95 C* ± 5 C. (Do NOT exceed 125 C.) 2. Procedure 2.1. Immerse substrates in first bath for 10 minutes.* 2.2. Transfer substrates to the second bath for 10 minutes Transfer substrates to Posistrip EKC800, EKC4000 PCT, or Posistrip EKC8000 bath for 1-2 minutes. (Recommended when AI/Cu is present. Optional for pure aluminum.) 2.4. Transfer substrates into a D.I. water, spray dump rinser or equivalent Rinse substrates for 5-10 dump cycles or until meg OHM-CM resistivity is obtained Spin dry substrates or use equivalent system. *Time and temperature may need to be adjusted to accommodate a specific photoresist process. Automatic Equipment Posistrip EKC830 may be used in automatic equipment. For specific instructions, contact EKC Technology or the automatic equipment manufacturer. TECHNICAL DATA Physical Data Each batch of Posistrip EKC830 is analyzed in EKC's Quality Control Lab under stringent quality control procedures to ensure batch-to-batch consistency utilizing Direct Current Plasma Emission Spectroscopy, Karl Fischer Water Analysis, Graphite Furnace Atomic Absorption, and Gas Chromatography. Product Specifications Contact your local EKC Representative or the EKC Customer Service Department.

4 Revision C, Page 4 of 4 Handling Use Posistrip EKC830 only in an exhausted fume hood or equivalent. Avoid inhalation of fumes or contact with eyes, skin, and clothing. Operators should wear chemical resistant gloves, safety glasses or face shields, and protective clothing. Do not take internally. Do not use in any system in direct contact with PVC or PVDF components. Storage Storage in a dry, ventilated area 40 to 90 F (5 to 32 C) is recommended. Posistrip EKC830 should be kept in its original closed containers. Do not mix or store with oxidizers, acids, or bases. Spill In the event of a spill, remove all ignition sources. Add absorbent, neutralizing agent or flush with water. Gather into a suitable container for waste removal. Minor spills may be wiped up. If a spill does occur, ensure that adequate ventilation is provided and that personnel wear appropriate safety protection. Disposal Dispose of Posistrip EKC830 in accordance with Federal, State, and local regulations. For additional guidance, refer to Material Safety Data Sheet or contact EKC Technology's technical staff. Waste Minimization Spent Posistrip EKC830 may be recycled to alternative markets. Contact EKC Technology for additional program information. The information and recommendations herein are based on available data and use under normal circumstances. See MATERIAL SAFETY DATA SHEET for additional safety and technical information. For information on this or other EKC Technology, Inc. products, contact U.S. customer service at (800) or write to the address below: EKC Technology, Inc Barrington Court Hayward, CA USA Phone: Fax: EKC Technology, Ltd. 19 Law Place,Nerston Industrial Estate East Kilbride, Glasgow. Scotland, G74 4QL Phone: Fax:

5 Revision C, Page 5 of 4 EKC Technology, K.K Araki-cho Shinjuku-ku Tokyo Japan Phone: Fax: The information in this document is believed to be correct based on the experience and knowledge of EKC Technologies, Inc. ( EKC ). Because the conditions for use and handling vary from customer to customer and are beyond the control of EKC, EKC makes no warranty, express or implied, regarding the use, handling, storage or possession of the products, and EKC makes no warranty or guaranty that any particular result will be obtained. Additionally, nothing in this document should be construed as a recommendation to use any product in violation of the patent rights of others. All sales are subject to EKC s standard terms and conditions. 12/11/ EKC Technology, Inc.