iniaturization of medical devices thanks to flexible substrates ISO 9001 certified

Transcription

1 iniaturization of medical devices thanks to flexible substrates

2 Hightec MC Presentation 2 Medical industry is clearly and urgently in need of the development of advanced interconnection solutions that can meet the growing demand for miniaturization, also for implantable medical devices that demand increased functionality with decreasing size, weight, and power (SWaP). Embedding more functionality in a smaller volume, assembling on standard flexible PCB technology becomes more and more critical in regard of new components with smaller and smaller die pads pitch.

3 Hightec MC Presentation 3 Combination of ultra thin polyimide flex substrate (10 µm) and thin film deposition process (PVD - Physical vapor deposition 4/6/24 inch)) to achieve resolution with a pitch down to 30 µm offers for medical devices: very high density, very low thickness for very high flexibility, low mass and devices up to 580 mm long.

4 Hightec MC Presentation 4 The Retina implant by Retina implant AG

5 Hightec MC Presentation 5 The HiCoFlex

6 Hightec MC Presentation 6

7 Hightec MC Presentation 7 Retina implant flexible substrate requirements Ultra thin thickness and ultra high flexibility in the retina area High density gread array in the retina area SMD process on glass carreer before releasing of the flex 2 Type of studies to get the CE market, HiCoFlex with bio compatible coating and HiCoFlex without,actually one year in the human body. Goal is 20 years.

8 Hightec MC Presentation 8 Retina implant HiCoFlex substrate solution and benefits Flexible substrate HiCoFlex 2 layers : retina area thickness is only 7 µm including polyimide and bio-compatible metal deposition. Pitch of 30 µm in the interconnexion area Glueless technology, full polyimide. Very low outgassing Bio compatibility long term stable with uncoated HiCoFlex (1 year) First HiCoFlex design was very long at the beginning and was going out of the eye, now the new HiCoFlex version is fully in the eye and outside it s a cable.

9 Hightec MC Presentation 9 The PillCam By Given Imaging Swallowable diagnostic device 20 minuts frames 6 to 8 hours frames

10 Hightec MC Presentation 10 The PillCam By Given Imaging The Pillcam Colon 2 measures mm and weighs less than 4g (1,3 cm³ for electronic). The four LEDs on each end of the pill flash alternately and allow images to be taken looking forward and behind, deep into the colon mucosa, as the capsule tumbles. There is one Aptina CMOS image sensor at the center of each end of the Pillcam

11 Hightec MC Presentation 11 The PillCam By Given Imaging 3-Battery(33% of the overall volume) 6 - HiCoflex 3 layers Hightec MC 4 - Lenses and white leds 7 - Zarlink chip 5 CMOS Image sensor 8 MEMS Switch

12 Hightec MC Presentation 12 The PillCam flexible substrate requirements Combination of ultra low thickness and minimum number of layers. Low thickness of metal deposition to allow bending radius < 1 mm. SMD process on glass carrer required for a high positionning accuracy. Price positionning for high quantities

13 Hightec MC Presentation 13 The PillCam HiCoFlex substrate solution and benefits 3 layers HiCoFlex with 80 µm pitch, 80 µm pads for 30 µm plated holes. Total metal thickness of 6 to 7 µm per layer to achieve a good conductivity and high flexibility HiCoFlex production with 24 inch line using glass career and offering accessible pricing for high quantities

14 Hightec MC Presentation 14 EU. SHIFT projects for OTICON HiCoFlex 2 layers - 40 µm thick 80 µm pitch 15 mm 4 mm

15 EU. SHIFT projects for OTICON Thin dies, 50 µm Small bumps, 10 µm (90 µm) Sharp bending Adhesive: 60 µm BGA bumps: 250 µm Hightec MC Presentation 15

16 Company Presentation 16 The HiCoFlex Process Separation layer Ceramic, Glass Polyimide Deposition of Separation Layer 1 st Polyimide Ti/Cu/Ni/Au Polyimide 2 nd Metal 3 rd Polyimide Ti/Cu/Ni 1 st Metal Assembling, Bonding, Protection, Test Polyimide 2 nd Polyimide Force-free Separation

17 Company Presentation 17 HiCoFlex Technology Fabrication of multilayer structure Fabrication on rigid of Multilayer carrier Structure on substrate Rigid Carrier Substrate Assembling, Bonding Protection, Test Assembling, Bonding, Protection, Test Separation of multilayer from rigid substrate Separation of Multilayer from Rigid Substrate Reuse of Carrier Gold top Pad Via HiCoFlex Release Layer Rigid Substrate

18 Company Presentation 18 HiCoFlex Technology 15 μm line/space conductors Laser cut vias 30 μm Electroplated vias

19 Company Presentation 19 HiCoFlex Long Micro Cables Layout 6 substrate Medical application for catheter and endoscope connection in 24 inch panel Length typ. 785 mm Width min 200 μm Number of lines: from 2 to 128 ( 4 layers) Laser cut meander and spiral test sample Test sample has 10 conductor lines Total length = nearly 3 x 300 mm Picture: Right end and turning point) Laser cut sample

20 HiCoFlex Applications Igightec MC AG; Dr. Gerhard Kunkel, Wolfgang Kapischke

21 HiCoFlex Properties Properties Value Unit dielectric constant (23 C) 3.1 dissipation factor (23 C) coefficient of thermal expansion 3 ppm/k thermal conductivity 0.4 W/mK volume resistivity 1 x Ohm cm breakdown voltage > 250 V/μm glass transition temperature > 400 C decomposition temperature > 500 C weight (3-layer circuit) 8 mg/cm 2 water absorption (23 C, 95% rel. humidity) 0.4 % min. bending radius dynamic (3 layer circuit) 1 mm

22 The HiCoFlex line of Hightec MC AG Glass substrates 24 x 24 Higher volume at lower cost Larger flex formats Equipment: LDI for 15 µm line and space Sputter Tool (vertical) Electroplating Cu, Ni, Au UV Laser AOI Spray Clean, Develop, Etch and Strip 3D Measurement Microscope, etc. Investment 8 Mio. CHF Company Presentation 22

23 Company Presentation 23 Thank you Ludovic Godin