Current Sensing Resistor Metal Foil Type > SMD Series

Transcription

1 Metal Foil > SMD Series Page:1 of 7 General Chip size from 0603 to 2512 value from 3 m to 600m High power rating Low inductance 0.5nH to 5nH LowCR Compatible with RoHS & Halogen free pplication Switching model power supply Battery pack Notebook, personal computer est Instrument Power mplifier Electrical Specifications Power Rating at 70 () Range CR (ppm/ ) tolerance Operating emperature ~9 ±100 ±1%(F) 10~75 ±50 ±0.5%(D),±1%(F) 4~9 ±100 ±1%(F) 10~100 ±50 ±0.5%(D),±1%(F) 3~9 ±100 ±1%(F) 10~500 ±50 ±0.5%(D),±1%(F) 5~9 ±100 ±1%(F) 10~250 ±50 ±0.5%(D),±1%(F) 5~9 ±100 ±1%(F) 10~600 ±50 ±0.5%(D),±1%(F) -55 ~+155

2 Metal Foil > SMD Series Page:2 of 7 Catalo Part Number Information SMD 25 2 F R Series Name: SR Metal Foil 2 Chip size: 06: : : : : Material Code: :lloy 4 Power Code:: 0.5 B: 1.5 C: : 1 2: 2 5 olerance: F: ±1% D: ±0.5% 6 Code: R003 = 3 mω R050 = 50 mω R200 =200 mω 7 Packaging Code: :ape& Reel B: Bulk Pack Dimensions Shape & Dimensions: L ± ± ± ±0.20 6~ ± ± ± ±0.20 L ~ ± ± ± ±0.20

3 Metal Foil > SMD Series Page:3 of L 3~4 3.30± ± ± ±0.30 5~ ± ± ± ± ~ ± ± ± ± ~ ± ± ± ±0.30 Recommended Land Patterns B C D ~ ~ ~ ~ ~ ~ Materials No. Materials No. Materials 1 Ceramic 4 Coating 2 MnCu-lloy 5 Marking 3 erminal electrode / /

4 Metal Foil > SMD Series Page:4 of 7 emperature Derating Curve Recommended Solder Curve 1. Infrared Reflow emperature: 260 ime: 5sec Max. Recommend Reflow profile: Profile Feature verage Ramp-up Rate (smax to p) Preheat emperature Min.(smin) emperature Max.(smax) ime(smin to smax) Pb-Free ssembly 3 /sec Max sec~120sec Peak emperature(p) 260 ime within 5 of actual Peak emperature(p) Melting tin time(l) Ramp-down Rate ime 25 to peak emperature 5sec 20sec~30sec 6 /sec Max. 8min Max. 2. ave soldering 3. Hand Soldering Reservoir emperature: 260 emperature: 350 ime in Reservoir: 10sec Max. ime: 5sec Max.

5 Metal Foil > SMD Series Page:5 of 7 Product Reliability Characteristics est: Item est condition / Methods Performance Standard Short ime Overload P= 2.5Pr;=25 ±2,t = 5sec R ±(1%+0.5 mω) IEC emperature Coefficient of (CR) CR =(R-R0)/R0(2-1)X est temperature:+25 ~+125 Refer to SR Spec IEC hermal Shock -55 (30min)/+150 (30min),100 cycles R ±(1%+0.5 mω) IEC to Solder Heat 275 ±5, 20sec ± 1sec R ±(1%+0.5mΩ) IEC Solderability 245 ±5, 3.0sec ± 0.5sec 95% coverage Min. IEC Load Life Moisture Load Life (60 95%RH) Bending test 70 ±2, 1000 hours,at rated power 1.5hours ON, 0.5hours OFF =60 ±2 ;RH=95%;Vtest = Vmax. t= 90min ON, 30min OFF, 1000hours Bending width 2mm, Epoxy thickness 1.6mm, Fulcrums distance 90mm R ±(2% +0.5 mω) IEC R ±(2%+0.5 mω) IEC R ±(1%+0.5 mω) IEC High emp. Exposure = +170 ±2 ;t = 1000 hours R ±(1%+0.5 mω) IEC Low emp. Storage = -55 ±2 ;t = 1000 hours R ±(1%+0.5 mω) IEC Mechanical Shock a =100G, t =11msec, 5 times shock R ±(1%+0.5 mω) IEC

6 Metal Foil > SMD Series Page:6 of 7 Packaging 1. ape Packaging Dimensions 0 B0 F E ± ± ± ± ± ± ± ± ± ± ± ±0.20 P P0 P2 D0 / / ± ± ± ±0.10 / / ± ± ± ±0.10 / / 0 B0 F E ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.10 P P0 P2 D0 1 K ± ± ± ± Max. 0.85± ± ± ± ± Max. 0.85± ± ± ± ± Max. 1.00±0.20

7 Metal Foil > SMD Series Page:7 of 7 2. Reel Dimensions N ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±1.00 Quantity of Package Quantity(pcs) Peeling est Storage he ambient temperature shall between 5 ~30. he relative humidity recommended for storage is between 25%RH~60%RH. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. he products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.