Epoxy. Epoxy 90, ,000. Epoxy. Epoxy. low ion content, Encapsulation of electronic

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1 - - and Light Curing Adhesives Our comprehensive range of systems covers a multitude of applications and offers many advantages: systems are used in many fields in both trade and industry. adhesives and sealants are single-component systems that cure within a few seconds, only. The Main Advantages of the Systems are: Simple dosing, immersion, spray, roller application, etc; No mixing of several components and no pot life Depending on the application, curing times of 0.5 to 60 seconds can be achieved by exposure to high-energy light. Thus permitting shorter cycle times also in mass production Solvent-free, therefore environmentally safe Low energy costs due to short curing times Excellent electrical insulating properties Outstanding temperature and chemical resistance Low heating The short exposure time allows bonding of temperaturesensitive materials. With their low space requirement, the systems are ideal even for complex fully-automated high-volume production lines and can be well integrated in existing plants. Please feel free to contact us for support. We help you chose the ideal product for your particular application, complete with all technical specification. Adhesive Application Viskosity [mpas] Base Curing* Properties 1505 Optical cement, Potting material Very high glass transition temperature, low attenuation , ,000 Low shrinkage, very high Tg, low heat expansion Very high tg, low attenuation, high transmission, high chemical resistance, nanostructured fillers 1528 Optical cement, Allows post-curing in shadowed areas, low attenuation, very high tg 1600 LV 5,000-6,000 Very high Tg, low water absorption, low ion content, very high chemical resistance ww.t chs.co.uk, * = nm, VIS = 405 nm Technical Datasheets:

2 Klebstoff Adhesive Anwendung Application Viskosity Viskosität [mpas] (mpas) Base Basis Curing* Aushärtung* Properties Besondere Eigenschaften 1605 Optical cement, Low shrinkage, low heat expansion, very high tg, certified to ISO standards 1650, 6,000-9,000 Electronic grade, low ion content, suitable for chip protection 1655 component,s Flexible, certified to USP Class VI and ISO standards, resistant to all common sterilization methods 1657 Display bonding 120, ,000 Low ion content, low water absorption, suitable for covering open bonded chips , ,000 Stable dam compound, high ion purity, electronic grade adhesive, high temperature conductivity, low water absorption ,000-9,000 Very high resistance to heat and humidity, electronic grade adhesive, low ion content, suitable for chip protection ,000-4,000 Excellent flow properties and levelling, electronic grade adhesive, low ion content, suitable for chip protection, excellent resistance to heat and humidity 1691 Glob top encapsulation 280, ,000 Black color, high ion purity, electronic grade adhesive, high temperature resistance, fast surface curing with light Transparent, capillary flow, certified to USP Class VI standards , ,000 Stable, certified to USP Class VI standards * = nm, VIS = 405 nm Technical Datasheets:

3 1720 2,700-3,700 Low shrinkage, high temperature resistance ,000-8,000 Very high adhesion to most thermoplastics, low shrinkage, high temperature resistance 2004 F Fluorescing, flexible, autoclavable, dry surface after curing, low ion content, sprayable 2007 F Fluorescing, flexible, autoclavable, low ion content Dry surface after -curing, autoclavable, scratch resistant coating 2009 F Fluorescing, flexible, autoclavable, high chemical resistance, low ion content 2020 Dome Coating, Dry surface after -curing, scratch-resistant, transparent 2025 Dome Coating, Dry surface after -curing, scratch-resistant, transparent, very high chemical and thermal resistance 2655 Flip Chip Underfill Flexible, capillary flow, high ion purity, 2667 Flip Chip Underfill 3,000-5,000 Low thermal expansion, low ion content 3385 Optical cement 1,000-2,000 Low shrinkage, transparent, non-yellowing /anaerobic curing thread locking, fast anaerobic post-curing * = nm, VIS = 405 nm Technical Datasheets:

4 4282 mod /anaerobic curing thread locking, fast anaerobic post-curing, light green color ,000-5,000 /anaerobic curing thread locking, fast anaerobic post-curing 4451 Dome Coating Low shrinkage, soft and elastic, dry surface after curing, protective coating ,000-2,500 Fast curing, elastic, flexible, high resilience 4730 Plastic film lamination Capillary flow, flexible and tear-proof adhesive, suitable for potting, dry surface 4731 Display potting compound, Dry surface after curing, certified to USP Class VI and ISO standards 4731 VT Display potting compound, 22,000-28,000 Dry surface after curing, flexible and tear-proof, excellent adhesion to many plastics 4732 VT Display potting compound, 33,000-40,000 Very high adhesion to many plastics, dry surface after curing, flexible and tear-proof 4735 HC Display potting compound, / thermal Very high adhesion to many plastics, dry surface after curing, flexible and tear-proof, thermal post-curing, suitable for potting 5140, Flexible, well suited for bonding plastics with low translucence and permeable to visible light, certified to USP Class VI standards 5140 VT shear thinning High resistance to thermal stress and moisture, flexible and stable, * = nm, VIS = 405 nm Technical Datasheets:

5 6008 VLV Capillary flow, transparent ,500-5,000 Very high adhesion to metals and sintered materials, transparent ,500-6,000 Very high adhesion to metals and sintered materials 6104 VT 80,000-90,000 Very high adhesion to metals and sintered materials, ideal for bonding large components on circuit boards (corner bonding) ,500-6,000 Very high adhesion to metals and sintered materials 6108, / thermal Non-yellowing, excellent flow properties, certified to USP Class VI and ISO standards 6108 T, 4,000-6,000 / thermal Non-yellowing, excellent gap-filling, certified to USP Class VI standards ,000-6,000 Contains chemical activator, excellent adhesion to stone, glass, metals and thermoplastics, high temperature resistance, medium viscosity High purity, specially formulated for bonding glass Contains chemical activator, very high adhesion to stone, glass, metals and thermoplastics, high temperature resistance 6128 VT Attaching components on PCBs 18,000-30,000 Contains chemical activator, high temperature resistance, high viscosity, excellent adhesion to stone, glass, metals and thermoplastics * = nm, VIS = 405 nm Technical Datasheets:

6 6129 PCB Assembly, SMD assembly 10,000-40,000 White color, very high resistance to heat and chemicals, very good thermal conductivity High strength and impact resistance, very high adhesion to glass, metals, and anodized aluminium, transparent Very high adhesion to stainless steel, stone, granite, high purity, suitable for bonding optical transparent 6137 Various applications for electronics, PCB and SMD assembly 150, ,000 Very high chemical resist., suitable for high temper. ranges, excellent temper. conductivity, white color, fast fixing of components with light, thermal post-curing optional Excellent adhesion to glass, plastics and metals, certified to USP Class VI/ ISO 10993/-4/-5 standards 7041 F Fluorescing, excellent adhesion to glass, plastics and metals, certified to USP Class VI/ISO 10993/-4/-5 standards 7041 T shear thinning Excellent adhesion to glass, plastics and metals, certified to USP Class VI/ISO 10993/ -4/-5 standards, high viscosity, stable 7044 VLV, Bonding rubber High peel strength, perfect solution for bonding large surfaces, flexible 7090 VHS, hard to bond plastic substrates Certified to USP Class VI standards, dry surface, very high adhesion to plastics Certified to USP Class VI standards, scratch resistant, transparent Non-yellowing, transparent 7283 Plastic bonding Perfect solution for bonding large surfaces, very high adhesion to glass, metals and plastics 7311 Plastic bonding High resistance to alcohols and moisture, non-yellowing, very high adhesion to plastics, glass and metals 7313 Plastic bonding Flexible, high elongation at break, perfect solution for bonding large surfaces, very high adhesion to plastics, glass and metals Elastic, low water absorption, perfect solution for bonding large surfaces, high resistance to moisture Optically clear, flexible, elastic, high resistance to moisture Very high shear strength and bond strength, excellent adhesion to plastics, capillary flow behavior Specially formulated for bonding PMMA, high adhesion, capillary flow * = nm, VIS = 405 nm Technical Datasheets:

7 7642 1,500-2,000 Excellent adhesion to many plastics, high bond strength, excellent flow properties 7989, hard to bond plastic substrates 3,000-5,000 Excellent adhesion to plastics, especially to PC and PMMA, certified to USP Class VI standards 9140 VL 1,000-2,000 Flexible, high resistance to moisture, cures thick layers of adhesive 9179 Encapsulation of plastic parts, Attaching components on PCBs Fast curing, very well suited for automated production lines, yellow color, dry surface 9180 Encapsulation of plastic parts, Attaching components on PCBs Dry surface, fast curing of thick layers, yellow color 9181 Encapsulation of plastic parts, Attaching components on PCBs 4,000-7,000 Yellow color, dry surface, fast curing of thick layers FIPG Display bonding shear-thinning Flexible, elastic, liquid gasket, high relience, easy to apply, fast curing with light UC 1618 Optical cement, Lens bonding cement High glass transition temperature, high chemical resistance, transparent, low thermal expansion UC 1619 Optical cement, Lens bonding cement 3,000-5,000 Low ion content, non-yellowing, low thermal expansion UC 6215 Dome Coating, 400-1,100 Low outgassing, high temperature resistance, slightly flexible, high ion purity, suitable for potting UC 6684 Dome Coating 1,500-2,500 Transparent, brilliant and dry surface, scratch resistant UD 2018 Attaching components on PCBs shear thinning Resistant to temperature cycles, low shrinkage, low thermal expansion coefficient, pink color, pink fluorescent UD ,000-25,000 Hybrid / thermal -Hybrid, low thermal expansion, low shrinkage, impact resistant, dry surface, optional thermal post-curing of shadowed areas, grey color UD ,000-30,000 Yellowish colour, perfect solution for bonding flexible circuit paths, optional thermal post-curing, resistant to reflow processes, grey color * = nm, VIS = 405 nm Technical Datasheets:

8 Klebstoff Adhesive Anwendung Application Viskosity Viskosität [mpas] (mpas) Base Basis Curing* Aushärtung* UD 8050 Conformal Coatings shear thinning / moisture Isocyanacrylate, fast moisture post-curing in shadowed areas, easy to dispense with jet or dispenser e.a., resistant to moisture, fixing and protecting electronic components UD 8559 LV PU Hybrid / moisture Tackfree surface, liquid, suitable for pin sealing ,000-32,000 Hybrid hybrid, superior strength, low thermal expansion, impact resistant, low shrinkage, resistant to soldering stress, excellent flow properties ,000-30,000 Hybrid hybrid, superior strength, low thermal expansion, low shrinkage, impact resistant, resistant to soldering stress, paste-like, stable and high viscous Modified acrylate, impact resistant, fast curing, very high adhesion to plastics ,500-2,500 High bond strength, impact resistant, dry surface, resistant to high temperatures and chemicals 2725 High peel strength, flexible, optically clear, for bonding large surfaces Certified to ISO standards, modified acrylate, impact resistant, very fast curing, very high adhesion to plastics VBB 1 Display encapsulation, 1,000-1,500 Elastic, high peel strength, optically clear, very flexible, suitable for potting VBB1Gel Display encapsulation and display sealing, 150, ,000 Elastic, high peel strength, optically clear, very flexible, stable gel VBB-2N LV Bonding rubber, Display encapsulation, Flexible, perfect solution for bonding large surfaces, high peel strength VBB-N2 SV Display encapsulation, Very elastic, high peel strength, perfect solution for large surfaces VBB-N Display encapsulation, Transparent, elastic, high peel strength * = nm, VIS = 405 nm Technical Datasheets: