Data sheet METAL-PLATE CHIP RESISTOR; LOW OHM RLP16,20,32,63, MLP20,32,63. AEC-Q200 qualified. RoHS COMPLIANCE ITEM Halogen and Antimony Free

Transcription

1 Spe. No.: RLP K HTS 0001 /12 Date: Data sheet Title: Style: METAL-PLATE CHIP RESISTOR; LOW OHM RLP16,20,32,63, MLP20,32,63 AEC-Q200 qualified RoHS COMPLIANCE ITEM Halogen and Antimony Free Note: Stok onditions Temperature: +5 C +35 C Relative humidity: 25% 75% The period of guarantee: Within 2 year from shipmen t by the ompany. Solderability shall be satisfied. Produt speifiation ontained in this data sheet are subjet to hange at any time without notie If you have any questions or a Purhasing Speifiation for any quality Agreement is neessary, please ontat our sales staff. Hokkaido Researh Center Approval by: T. Sannomiya Drawing by: M. Shibuya

2 RLP16, 20, 32, 63, MLP20,32, 63 Page: 1/24 1. Sope 1.1 This data sheet overs the detail requirements for metal plate hip resistor ; low ohm, style of RLP16, 20, 32, 63, MLP20,32, Appliable douments JIS C : 2011, JIS C : 2014, JIS C : 2014 IEC : 2008, IEC : 2009, IEC : Classifiation Type designation shall be the following form. (Example) RLP 63 K R010 F TE Style 1 Metal - plate hip resistor; low ohm 2 Size Style 3 Temperature oeffiient of resistane 10-6 / C 10-6 / C (Dash) ± / C 4 Rated resistane 5 Tolerane on rated resistane F ±1% J ±5% 6 Pakaging form RLP size, 0.33W RLP size, 0.5W RLP size, 1W RLP size, 1W MLP size, 1W MLP size, 1.5W MLP size, 2W 1L50 R mΩ 2mΩ TP TE Paper taping Embossed taping

3 RLP16, 20, 32, 63, MLP20,32, 63 Page: 2/24 3. Rating 3.1 The ratings shall be in aordane with Table RLP series Style Rated dissipation (W) RLP RLP Rated urrent (A) Table 1(1) Temperature oeffiient of resistane (10 6 / C) Rated resistane (mω) Tolerane on rated resistane F(±1%) J(±5%)

4 RLP16, 20, 32, 63, MLP20,32, 63 Page: 3/24 Style Rated dissipation (W) RLP Rated urrent (A) Table 1(2) Temperature oeffiient of resistane (10 6 / C) (Standard) ±150 Rated resistane (mω) Tolerane on rated resistane F(±1%) J(±5%)

5 RLP16, 20, 32, 63, MLP20,32, 63 Page: 4/24 Style RLP63 Rated dissipation (W) Rated urrent (A) Table 1(3) Temperature oeffiient of resistane (10 6 / C) (Standard) ±150 Rated resistane (mω) Tolerane on rated resistane F(±1%) J(±5%)

6 RLP16, 20, 32, 63, MLP20,32, 63 Page: 5/ MLP series Style Rated dissipation (W) MLP MLP Rated urrent (A) Table 1(4) Temperature oeffiient of resistane (10 6 / C) (Standard) ±150 Rated resistane (mω) Tolerane on rated resistane F(±1%) J(±5%) F(±1%) J(±5%)

7 RLP16, 20, 32, 63, MLP20,32, 63 Page: 6/24 Style Rated dissipation (W) MLP Rated urrent (A) Table 1(5) Temperature oeffiient of resistane (10 6 / C) Rated resistane (mω) Tolerane on rated resistane 0.5 J(±5%) F(±1%) J(±5%) Style RLP16 RLP20 RLP32 RLP63 MLP20 MLP32 MLP63 Isolation voltage (V) Category temperature range ( C) Climati ategory 55/155/56 Lower ategory temperature 55 C Upper ategory temperature +155 C Duration of the damp heat, steady state test 56days 3.3 Stability lass 5% Limits for hange of resistane: for long term tests ±5% for short term tests ±1%

8 RLP16, 20, 32, 63, MLP20,32, 63 Page: 7/ Derating The derated values of dissipation at temperature in exess of 70 C shall be as indiated by the following urve. 100 Perentage of the rated dissipation (%) Area of reommended operation Ambient temperature ( C) Figure 1 Derating urve 3.5 Rated voltage d.. or a.. r.m.s. voltage alulated from the square root of the produt of the rated resistane and the rated dissipation. E: Rated voltage (V) E = P R P: Rated dissipation (W) R: Rated resistane (Ω) 3.6 Rated urrent The rated urrent alulated from the square root of the quotient of the rated resistane and the rated dissipation. I: Rated urrent (A) I = P / R P: Rated dissipation (W) R: Rated resistane (Ω) The rated urrent shall be orresponding to rated voltage. 4. Pakaging form The standard pakaging form shall be in aordane with Table 2. Table 2 Symbol Pakaging form Standard pakaging quantity / units Appliation TP Paper taping 8mm width, 4mm pithes 5,000 ps. RLP16, 20, 32, MLP20,32 TE Embossed taping 12mm width, 4mm pithes 4,000 ps. RLP63, MLP63

9 RLP16, 20, 32, 63, MLP20,32, 63 Page: 8/24 5. Dimensions 5.1 The resistor shall be of the design and physial dimensions in aordane with Figure 2 and Table RLP series L H W d d Figure 2 Table 3(1) Style Rated resistane (mω) L W H d RLP ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.2 RLP ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.25 RLP ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.25

10 RLP16, 20, 32, 63, MLP20,32, 63 Page: 9/24 L H W d d Table 3(2) Style Rated resistane (mω) L W H d 1 3.2± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.25 RLP ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.25

11 RLP16, 20, 32, 63, MLP20,32, 63 Page: 10/ MLP series L H W d d Table 3(3) Style Rated resistane (mω) L W H d ± ± ± ± ± ± ± ± ± ± ± ±0.2 MLP ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.25 MLP ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.25 MLP ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.25

12 RLP16, 20, 32, 63, MLP20,32, 63 Page: 11/ Net weight (Referene) Style Rated resistane (mω) Net weight (mg) 5 RLP ,4 to 10 3 RLP RLP RLP

13 RLP16, 20, 32, 63, MLP20,32, 63 Page: 12/ Net weight (Referene) Style Rated resistane (mω) Net weight (mg) 2,4 to 10 3 MLP MLP MLP Marking The Rated resistane of RLP16 should not be marked standard. 6.1 RLP63, MLP63 The rated resistane shall be marked in 4 haraters onsisting of 3 figures and a letter and marked on over oat side. (Example) R [Ω] 10 [mω] 1L [Ω] 1.5 [mω] 6.2 RLP20, 32, MLP20, 32 The rated resistane shall be marked in ombination of two figures and underlines and marked on over oat side. (Example) [Ω] 5 [mω] [Ω] 10 [mω]

14 RLP16, 20, 32, 63, MLP20,32, 63 Page: 13/24 7. Performane 7.1 The standard ondition for tests shall be in aordane with Sub lause 4.2, JIS C : The performane shall be satisfied in Table 4. Table 4(1) No. Test items Condition of test (JIS C ) Performane requirements 1 Visual examination Sub lause Cheked by visual examination. 2 Dimension Resistane Sub lause Resistane value shall be measured by mounting the substrate of the following ondition. a b Current terminal Voltage terminal Current terminal :Copper lad :Solder resist Unit:mm Style Resistane value(mω) a b RLP RLP20 2, to RLP and to RLP63 3, to MLP20 2, to MLP and to MLP63 0.5,2 to , 5 to Thikness of opper lad: 0.035mm 4-Terminal method Measurement urrent: 1(A) Note: The measuring apparatus orresponding to DC Low ohm Mater (1A) of AX 1152D for ADEX CORPORATION. As in The marking shall be legible, as heked by visual examination. As speified in Table 3 of this speifiation. As in The resistane value shall orrespond with the rated resistane taking into aount the speified tolerane.

15 RLP16, 20, 32, 63, MLP20,32, 63 Page: 14/24 Table 4(2) No Test items Condition of test (JIS C ) Performane requirements 3 Voltage proof Sub lause 4.7 Method: (See Figure 5) Test voltage: Alternating voltage with a peak value of 1.42 times the insulation voltage. Duration: 60 s±5 s Insulation resistane No breakdown or flash over R 1 GΩ Test voltage: Insulation voltage Duration: 1 min. 4 Solderability Sub lause 4.17 Without aging Flux: The resistors shall be immersed in a non ativated soldering flux for 2 s. Bath temperature: 235 C±5 C Immersion time: 2 s±0.5 s As in The terminations shall be overed with a smooth and bright solder oating. 5 Mounting Overload (in the mounted state) Solvent resistane of the marking 6 Mounting Bound strength of the end fae plating Final measurements Sub lause 4.31 Substrate material: Epoxide woven glass Test substrate: RLP16: Figure 3 1 RLP20, MLP20 Figure 3 2 RLP32 MLP32 Figure 3 3 RLP63, MLP63 Figure 3 4 Sub lause 4.13 The applied voltage shall be 2.5 times the rated voltage or the urrent orresponding to. Duration: 2 s Visual examination Resistane Sub lause 4.30 Solvent: 2 propanol Solvent temperature: 23 C±5 C Method 1 Rubbing material: otton wool Without reovery Sub lause 4.31 Substrate material: Epoxide woven glass Test substrate: Figure 4 Sub lause 4.33 Bent value: 3mm(RLP16, 20, 32, MLP20, 32) 1 mm(rlp63, MLP63) Resistane Sub lause Visual examination No visible damage R ±1% Legible marking R ±1% No visible damage

16 RLP16, 20, 32, 63, MLP20,32, 63 Page: 15/24 Table 4(3) No Test items Condition of test (JIS C ) Performane requirements 7 Resistane to soldering heat Sub lause 4.18 (JEITA RC ) Substrate material: Epoxide woven glass Test substrate: Figure 3 1 T 1 :Pre-heat minimum temp.:150±5 C T 2 :Pre-heat maximum temp.:180±5 C T 3 :Soldering temp.:220 C T 4 :Peak temp.:250 C t 1 :Pre-heat duration:120±5 s t 2 :Soldering duration:60 to 90 s t 3 :Peak duration(t 4-5 C):20 to 40 s Pre-reflow soldering: 1 time (Initial measurements) Reflow soldering: 3 times T 4 t 3 T 3 t 2 T 2 T 1 t 1 Component solvent resistane 8 Mounting Adhesion Rapid hange temperature Visual examination Resistane Sub lause 4.29 Solvent: 2 propanol Solvent temperature: 23 C±5 C Method 2 Reovery: 48 h Visual examination Resistane Sub lause 4.31 Substrate material: Epoxide woven glass Test substrate: Figure 3 1 Sub lause 4.32 Fore: 5 N Duration: 10 s±1 s Visual examination Sub lause 4.19 Lower ategory temperature: 55 C Upper ategory temperature:+155 C Duration of exposure at eah temperature: 30 min. Number of yles: 5 yles. Visual examination Resistane No visible damage R ±1% No visible damage R ±1% No visible damage No visible damage R ±1%

17 RLP16, 20, 32, 63, MLP20,32, 63 Page: 16/24 Table 4(4) No Test items Condition of test (JIS C ) Performane requirements 9 Climati sequene Dry heat Damp heat, yle (12+12hour yle) First yle Cold Damp heat, yle (12+12hour yle) Remaining yle D.C. load 10 Mounting Endurane at 70 C 11 Mounting Variation of resistane with temperature Sub lause 4.23 Sub lause Test temperature: +155 C Duration: 16 h Sub lause Test method: 2 Test temperature: 55 C [Severity(2)] Sub lause Test temperature 55 C Duration: 2h Sub lause Test method: 2 Test temperature: 55 C [Severity (2)] Number of yles: 5 yles Sub lause The applied urrent shall be the rated urrent. Duration: 1 min. Visual examination Resistane Sub lause 4.31 Substrate material: Epoxide woven glass Test substrate: RLP16: Figure 3 1 RLP20, MLP20 Figure 3 2 RLP32 MLP32 Figure 3 3 RLP63, MLP63 Figure 3 4 Sub lause Ambient temperature: 70 C±2 C Duration: 1000 h The urrent shall be applied in yles of 1.5 h on and 0.5 h. The applied urrent shall be the rated urrent Examination at 48 h, 500 h and 1000 h: Visual examination Resistane Sub lause 4.31 Substrate material: Epoxide woven glass Test substrate: Figure 3 1 Sub lause C / +155 C No visible damage R ±5 % No visible damage R ±5 % As in Table 1

18 RLP16, 20, 32, 63, MLP20,32, 63 Page: 17/24 Table 4(5) No Test items Condition of test (JIS C ) Performane requirements 12 Mounting Damp heat, steady state Sub lause 4.31 Substrate material: Epoxide woven glass Test substrate: Figure 3 1 Sub lause 4.24 Ambient temperature: 40 C±2 C 13 Dimensions (detail) +2-3 Relative humidity: 93 % Without urrent applied. Visual examination Resistane Sub lause No visible damage Legible marking R ±5% As in Table 4 Mounting Endurane at upper ategory temperature Sub lause 4.31 Substrate material: Epoxide woven glass Test substrate: Figure 3 1 Sub lause Ambient temperature:155 C±2 C Duration: 1000 h Examination at 48 h, 500 h and 1000 h: Visual examination Resistane No visible damage R ±5%

19 RLP16, 20, 32, 63, MLP20,32, 63 Page: 18/24 8. Test substrate b a b 6 e d e :Copper lad :Solder resist Style Rated resistane (mω) a b d e RLP RLP20 2, to RLP and to RLP63 3, to MLP20 2, to MLP and to MLP63 0.5, 2 to , 5 to Figure 3 1 RLP16, 20, 32, 63, MLP20,32, 63 TEST SUBSTRATE Remark: Material: Epoxy resin based as glass fabri(speified in JIS C 6484). Thikness: 1.6mm Thikness of opper lad: 0.035mm

20 RLP16, 20, 32, 63, MLP20,32, 63 Page: 19/24 : 銅箔パターン b a b 6 e d e : ソルダーレジスト Style Rated resistane (mω) a b d e RLP20 2, to MLP20 2, to Figure 3 2 RLP20, MLP20 TEST SUBSTRATE Remark: Material: Epoxy resin based as glass fabri(speified in JIS C 6484). Thikness: 1.6mm Thikness of opper lad: 0.035mm b a b f e d e f g :Copper lad :Solder resist Style Rated resistane (mω) a b d e f g RLP and to MLP and to Figure 3 3 RLP32, MLP32 TEST SUBSTRATE Remark: Material: Epoxy resin based as glass fabri(speified in JIS C 6484). Thikness: 1.6mm Thikness of opper lad: 0.07mm

21 RLP16, 20, 32, 63, MLP20,32, 63 Page: 20/24 28 :Copper lad b a b :Solder resist Style Rated resistane (mω) a b RLP63 3, to MLP63 0.5, 2 to , 5 to Figure 3 4 RLP63, MLP63 TEST SUBSTRATE Remark: Material: Epoxy resin based as glass fabri(speified in JIS C 6484). Thikness: 1.6mm Thikness of opper lad: 0.07mm Remark: In the ase of onnetion by onnetor, the onneting terminals are gold plated. However, the plating is not neessary when the onnetion is made by soldering. b a b :Copper lad :Solder resist 40 Style Rated resistane (mω) a b RLP RLP20 2, to RLP and to MLP20 2, to MLP and to RLP16, 20, 32, MLP20 32 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE

22 RLP16, 20, 32, 63, MLP20,32, 63 Page: 21/24 b a b Style Rated resistane (mω) a b RLP63 3, to MLP63 0.5, 2 to , 5 to RLP 63, MLP63 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE Figure 4 Remark. Material: Epoxy resin based as glass fabri(speified in JIS C 6484). Thikness: 1.6mm Thikness of opper lad: 0.035mm 40 :Copper lad :Solder resist Metal blok measurement Point A Insulation plate Metal plate R0.5mm Measurement point B Insulation surfae Component Figure 5 Pressure by spring (1±0.2N)

23 RLP16, 20, 32, 63, MLP20,32, 63 Page: 22/24 9. Taping 9.1 Appliable douments JIS C : 2014, EIAJ ET 7200C: Taping dimensions Paper taping (8mm width, 4mm pithes) Taping dimensions shall be in aordane with Figure 6 and Table 5. t 1 Sproket hole +0.1 φ ±0.1 2± ±0.1 A Figure 6 Table 5 Style A B t 1 t 2 RLP ± ± ± max. RLP20 MLP ± ± ± max. RLP32 MLP ± ± ± max Embossed taping (12mm width, 4mm pithes) Taping dimensions shall be in aordane with Figure 7 and Table max. Sproket hole 2± φ ± ±0.1 A B W E B 8±0.2 t 2 Carrier avity 4± ±0.05 Diretion of unreeling t1 Carrier avity 4±0.1 Figure 7 Table 6 Diretion of unreeling Style A B W E t 1 RLP63 MLP63 3.6± ± ± ± ±0.15

24 RLP16, 20, 32, 63, MLP20,32, 63 Page: 23/24 1). The over tapes shall not over the sproket holes. 2). Tapes in adjaent layers shall not stik together in the paking. 3). Components shall not stik to the arrier tape or to the over tape. 4). Pith tolerane over any 10 pithes ±0.2mm. 5). The peel strength of the top over tape shall be with in 0.1N to 0.5N on the test method as shown in the following RLP16, 20, 32, MLP20, 32: Figure 8, RLP63, MLP63: Figure 9. 6). When the tape is bent with the minimum radius for (RLP16, 20, 32, MLP20, 32: 25mm, RLP63, MLP63 : 30mm) the tape shall not be damaged and the omponents shall maintain their position and orientation in the tape. 7). In no ase shall there be two or more onseutive omponents missing. The maximum number of missing omponents shall be one or 0.1%, whihever is greater. Top over tape Carrier tape Diretion of unreeling 165 to180 Peel off (About 300mm/min) Figure 8 Top over tape Carrier tape Diretion of unreeling 165 to 180 Peel off (About 300mm/min) Figure 9

25 RLP16, 20, 32, 63, MLP20,32, 63 Page: 24/ Reel dimension Reel dimensions shall be in aordane with the following Figure 10 and Table 7. Plasti reel (Based on EIAJ ET 7200C) Marking A 2±0.5 φ13± φ φ φ21±0.8 Marking B Figure 10 Table 7 Style A B Note RLP16, 20, 32, MLP20, ±1.0 Injetion molding 13±1.0 Vauum forming RLP63, MLP ±1.0 Vauum forming Note : Marking label shall be marked on a plae of Marking A or two plae of Marking A and B. A B 9.4 Leader and trailer tape. 160mm min. 100mm min. 400mm min. End Start Trailer Diretion of unreeling Figure 11 Leader 10. Marking on pakage The label of a minimum pakage shall be legibly marked with follows Marking A (1) Classifiation (Style, Temperature oeffiient of resistane, Rated resistane, Tolerane on rated resistane, Pakaging form) (2) Lot number (3) Quantity (4) Manufaturer s name or trade mark (5) Others 10.2 Marking B (KAMAYA Control label)