Instruction Manual SM10 Series of Power Modules

Transcription

1 Lambda s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. Instruction Manual SM10 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York Tel: (516) or Toll Free: (800) LAMBDA-4/5 Fax: (516)

2 REVISION HISTORY Revision Date Description Program Manager Quality Manager Marketing Manager A 4/30/98 SM10 Instruction Manual Peter Brune David Wandrey Mike Wagner B 8/5/98 ECN Alan Alagar David Wandrey Mike Wagner C 8/11/99 Drawings Update Peter Brune David Wandrey Mike Wagner - a -

3 Table of Contents Page I. PRODUCT SPECIFICATION...1 II. RECOMMENDED CIRCUIT HOOK-UP...5 III. MECHANICAL INFORMATION...5 IV. RECOMMENDED PCB LAYOUT...6 V. RECOMMENDED EMI FILTER...7 VI. RECOMMENDED EMI PCB LAYOUT...8 VII. RECOMMENDED REFLOW SOLDER PROFILES...8 Exhibit A...9 Exhibit B...10 Exhibit C...10 VIII. RECOMMENDED SOLDERING TO DIFFERENT METAL FINISHES...11 IX. RECOMMENDED DE-SOLDERING TOOL i -

4 I. PRODUCT SPECIFICATION SM10-24S & SM10-24D DC-DC CONVERTERS: The SM10 is a DC-DC converter which provides a regulated output at power levels up to 10 watts. It accepts a wide range DC input and provides a fully isolated, regulated output. In operation, either (or neither) input pin, as well as either (or neither) output pin can be grounded. *SM10 units provide full output power for ambient temperatures up to 70 C, with linear derating from 70 C to zero power at 105 C. In forced air applications, full output power can be maintained as long as the chassis temperature, as measured in the center of the unit s label, is maintained at less than or equal to 100 C. (*) For safety agency approval of the end use equipment to safety standards (such as UL-1950 Third Edition, CAN CSA 22.2 No , DIN VDE 0805 and EN60950), the output of the converter is ELV if the input to the converter is ELV; the output of the converter is SELV only if its input is SELV. The input and output are to be both floating or both grounded. The converter is to be protected by the specified fuse, provided in the ungrounded leg. Specifications for 24 Volt Input, Single Output SM10-24S SERIES ITEMS UNITS SM10-24S03 SM10-24S05 SM10-24S12 SM10-24S15 Nominal Output Voltage V Voltage Accuracy - ± 1% Output Current 70 C A/W 2.55 (8.4) 2.00 (10.0) 0.83 (10.0).67 (10.0) Operating Temperature Range C to C. Derate linearly above + 70 C to 0 watts at 105 C Output Voltage Adjustment Range V Adjustable ± 10% Output Ripple (20MHz BW) mv 75 mvp-p 100 mvp-p Line Regulation mv Load Regulation (10% - 100%) mv Temperature Coefficient - ±.015% / C Overshoot - No overshoot at turn on, turn off, power failure Input Voltage Range Vdc Efficiency (Typical) % No Load Input Power W 0.4 Conducted EMI - EN55022 Level B, Fcc Level B, Ansi with external filter Overload/Short Circuit Protection - 30 Seconds (@ Nominal Input, +25 C) Overvoltage Clamp Point (fixed) V 4.8 max max max max. Isolation (Input to Output) - 500Vac, 700Vdc, 10MΩ Regulatory Agency Compliance - ETSI , Bellcore GR-1089, UL1950 Third Edition, CAN CSA C22.2 No , EN60950 Size (W.H.D.) in 1.4 X 1.4 X.4 Storage Temperature C to C Cooling - Convection cooling allows full o/p rating. Vibration - 2.5G RMS,10Hz Hz Sweep Vibration, 1 Hr. per axis Shock - 70G/6mS ½ Sine, 3 Shocks x 6 Sides = 18 Total Relative Humidity - 5% - 95%, non-condensing Altitude - 10,000 feet max. operating / 45,000 feet max. storage Fungus Proofing - Units are inherently fungus inert Thermal Cycling C Ramped to C ramped to C, 10 ESD Protection - SM modules are not ESD sensitive devices and meet ENC severity levels 3 and 4. Warranty - 2 year warranty includes parts and labor SM10_IM Page 1 of 11 Rev. C

5 Specifications for 24 Volt Input, Dual Output SM10-24D SERIES ITEMS MODEL SM1024-D12 SM1024-D15 OUTPUT 1 OUTPUT 2 OUTPUT 1 OUTPUT 2 Nominal Output Voltage V Voltage Accuracy - ± 1.0% Output Current 70 C A/W 0.42 (5.0).42 (5.0).33 (5.0).33 (5.0) Operating Temperature Range C to C. Derate linearly above + 70 C to 0 watts at 105 C Output Voltage Adjustment Range V Adjustable ± 10% Output Ripple (20MHz BW) mv 100 mvp-p Line Regulation mv Load Regulation (10% - 100%) mv Temperature Coefficient - ± 0.015% / C Overshoot - No overshoot at turn on, turn off, power failure Input Voltage Range Vdc Efficiency (Typical) % 80 No Load Input Power W.4 Conducted EMI - EN55022 Level B, Fcc Level B, Ansi with external filter Overload/Short Circuit Protection - 30 Seconds (@ Nominal Input, +25 C) Overvoltage Clamp Point (fixed) V 30.2 max. (total output) 40.2 max. (total output) Isolation (Input to Output) - 500Vac, 700 Vdc, 10MΩ Regulatory Agency Compliance - ETSI , Bellcore GR-1089, UL1950 Third Edition, CAN CSA C22.2 No , EN60950 Size (W.H.D.) in 1.4 X 1.4 X.4 Storage Temperature C to C Cooling - Convection cooling allows full o/p rating. Vibration - 2.5G RMS,10Hz Hz Sweep Vibration, 1 Hr. per axis Shock - 70G/6mS ½ Sine, 3 Shocks x 6 Sides = 18 Total Relative Humidity - 5% - 95%, non-condensing Altitude - 10,000 feet max. operating / 45,000 feet max. storage Fungus Proofing - Units are inherently fungus inert Thermal Cycling C ramped to C ramped to C, 10 ESD Protection - SM modules are not ESD sensitive devices and meet ENC severity levels 3 and 4. Warranty - 2 year warranty includes parts and labor SM10_IM Page 2 of 11 Rev. C

6 SM10-48S & SM10-48D DC-DC CONVERTERS: The SM10 is a DC-DC converter which provides a regulated output at power levels up to 10 watts. It accepts a wide range DC input and provides a fully isolated, regulated output. In operation, either (or neither) input pin, as well as either (or neither) output pin can be grounded. *SM10 units provide full output power for ambient temperatures up to 70 C, with linear derating from 70 C to zero power at 105 C. In forced air applications, full output power can be maintained as long as the chassis temperature, as measured in the center of the unit s label, is maintained at less then or equal to 100 C. *Note: For safety agency approval of the end use equipment to safety standards (such as UL-1950 Third Edition, CAN CSA C22.2 No , DIN VDE 0805 and EN60950), the output of the converter is ELV if the input to the converter is ELV; the output of the converter is SELV only if its input is SELV. The input and output are to be both floating or both grounded. The converter is to be protected by the specified fuse, provided in the ungrounded leg. The CE mark on the product is applied to show conformance to the requirements outlined in the European Union s low voltage directive (72/23/EEC) as amended by the CE mark directive (93/68/EEC). Specifications for 48 Volt Input, Single Output SM10-48S SERIES ITEMS MODEL SM10-48S03 SM10-48S05 SM10-48S12 SM10-48S15 Nominal Output Voltage V Voltage Accuracy - ± 1% Output Current 70 C A/W 2.55 (8.4) 2.00 (10.0) 0.83 (10.0).67 (10.0) Operating Temperature Range C to C. Derate linearly above + 70 C to 0 watts at 105 C Output Voltage Adjustment Range V Adjustable ± 10% Output Ripple (20MHz BW) mv 75 mvp-p 100 mvp-p Line Regulation mv Load Regulation (10% - 100%) mv Temperature Coefficient - ±.015 / C Overshoot - No overshoot at turn on, turn off, power failure Input Voltage Range Vdc Efficiency (Typical) % No Load Input Power W 0.4 Conducted EMI - EN55022 Level B, FCC Level B, ANSI with external filter Overload/Short Circuit Protection - 30 Seconds (@ Nominal Input, +25 C) Overvoltage Clamp Point (fixed) V 4.8 max max max max. Isolation (Input to Output) - 900Vac, 1500Vdc, 10MΩ Regulatory Agency Compliance - ETSI , Bellcore GR-1089, UL1950 Third Edition, CAN CSA C22.2 No , EN60950 Size (W.H.D.) in 1.4 X 1.4 X.4 Storage Temperature C to C Cooling - Convection cooling allows full o/p rating. Vibration - 2.5G RMS,10Hz Hz Sweep Vibration, 1 Hr. per axis Shock - 70G/6mS ½ Sine, 3 Shocks x 6 Sides = 18 Total Relative Humidity - 5% - 95%, non-condensing Altitude - 10,000 feet max. operating / 45,000 feet max. storage Fungus Proofing - Units are inherently fungus inert Thermal Cycling C ramped to C ramped to C, 10 cycles ESD Protection - SM modules are not ESD sensitive devices and meet ENC severity levels 3 and 4. Warranty - 2 year warranty includes parts and labor SM10_IM Page 3 of 11 Rev. C

7 Specifications for 48 Volt Input, Dual Output SM10-48D SERIES ITEMS MODEL SM1048-D12 SM1048-D15 OUTPUT 1 OUTPUT 2 OUTPUT 1 OUTPUT 2 Nominal Output Voltage V Voltage Accuracy - ± 1.0% Output Current 70 C A/W 0.42 (5.0).42 (5.0).33 (5.0).33 (.5w) Operating Temperature Range C to C. Derate linearly above + 70 C to 0 watts at 105 C Output Voltage Adjustment Range V Adjustable ± 10% Output Ripple (20MHz BW) mv 100 mvp-p Line Regulation mv Load Regulation (10% - 100%) mv Temperature Coefficient - ± 0.015% / C Overshoot - No overshoot at turn on, turn off, power failure Input Voltage Range Vdc Efficiency (Typical) % 80 No Load Input Power W.4 Conducted EMI - EN55022 Level B, FCC Level B, ANSI with external filter Overload/Short Circuit Protection - 30 Seconds (@ Nominal Input, +25 C) Overvoltage Clamp Point (fixed) V 30.2 max. (total output) 40.2 max. (total output) Isolation (Input to Output) - 900Vac, 1500Vdc, 10MΩ Regulatory Agency Compliance** - ETSI , Bellcore GR-1089, UL1950 Third Edition, CAN CSA C22.2 No , EN60950 Size (W.H.D.) in 1.4 X 1.4 X.4 Storage Temperature C to C Cooling - Convection cooling allows full o/p rating. Vibration - 2.5G RMS,10Hz Hz Sweep Vibration, 1 Hr. per axis Shock - 70G/6mS ½ Sine, 3 Shocks x 6 Sides = 18 Total Relative Humidity - 5% - 95%, non-condensing Altitude - 10,000 feet max. operating / 45,000 feet max. storage Fungus Proofing - Units are inherently fungus inert Thermal Cycling C ramped to C ramped to C, 10 ESD Protection - SM modules are not ESD sensitive devices and meet ENC severity levels 3 and 4. Warranty - 2 year warranty includes parts and labor SM10_IM Page 4 of 11 Rev. C

8 II. RECOMMENDED CIRCUIT HOOK-UP Notes: 1. Input can have -Vin, +Vin or neither terminal grounded. Input ground connection should be placed as close to SM unit input as possible. 2. Output can have -Vo, +Vo or neither terminal grounded. Output ground connection should be placed as close to SM unit input as possible. 3. Recommended input fusing:.... SM1048 (.5A/125V) SM1024 (1A/125V) Input fuse must be connected in series with the ungrounded input lead. III. MECHANICAL INFORMATION Dimensions are in inches with metric in brackets. SM10_IM Page 5 of 11 Rev. C

9 IV. RECOMMENDED PCB LAYOUT SINGLE OUTPUT Pin Function Pin Function 1 Thermal 13 Rem Prg 2 Thermal 14 Thermal 3 Vin - 15 Thermal 4 Vin - 16 Vout + 5 Thermal 17 Vout + 6 Thermal 18 Vout + 7 Thermal 19 Thermal 8 Vin + 20 Vout - 9 Vin + 21 Vout - 10 Thermal 22 Vout - 11 No Conn 23 Thermal 12 Rem ON/OFF 24 Thermal DUAL OUTPUT Pin Function Pin Function 1 Thermal 13 Rem Prg 2 Thermal 14 Thermal 3 Vin - 15 Vout + 4 Vin - 16 Vout + 5 Thermal 17 Thermal 6 Thermal 18 Common 7 Thermal 19 Common 8 Vin + 20 Common 9 Vin + 21 Thermal 10 Thermal 22 Vout - 11 No Conn 23 Vout - 12 Rem ON/OFF 24 Thermal 1. Dimensions are in inches with metric in brackets. 2. For proper installation copper plane as shown is required for heatsinking of module and should not be connected to the electrical circuit or system ground. 3. A clearance of.10 is required around the outer perimeter of the SM package to accommodate the Air-Vac custom nozzle solder and de-solder tool for module rework. (See recommended de-soldering tool in Section IX of this manual.) SM10_IM Page 6 of 11 Rev. C

10 V. RECOMMENDED EMI FILTER Vo- Vo+ The following table allows to specify EMI components necessary to meet EN55022 level A or B under different grounding conditions: Vi=24V Vi=48V Class A B A B Ground on: Vi+ N.C. Vo+ Vi+ N.C. Vo+ Vi+ N.C. Vo+ Vi+ N.C. Vo+ C C C C C C C L2 Sh Sh Sh L means one capacitor or inductor should be installed 2 - means two equal capacitors should be installed in parallel Sh - means inductor should be shorted N.C. - means that ground is not connected to both Vi+, Vo+ but is still connected to the common point of the capacitors C1,C2 and\or C6,C7 if these capacitors are required Vi=24V Vi=48V Value Rating Vendor Part # Value Rating Vendor Part # C1,C2,C3,C6,C7 0.1 uf 100 V Novocap 1206B104K101N 0.1 uf 100 V Novoca p 1206B104K101N C4,C uf 50 V Novocap 1812B824K500N 0.56 uf 100 V Novoca p 1812B564K101N L1,L2 47 uh 0.8 A Coilcraft DS3316P uh 0.34 A TDK NLC565050T-470K SM10_IM Page 7 of 11 Rev. C

11 VI. RECOMMENDED EMI PCB LAYOUT Note: System ground is connected via routing on a layer not shown. VII. RECOMMENDED REFLOW SOLDER PROFILES Today most reflow solder furnaces use forced convection as the heat transfer technique but passive infrared and straight infrared (IR) systems are still encountered. Vapor phase reflow systems are seldom encountered in today s surface mount assembly lines. It does not matter what type of reflow system is used; the heat transfer technique to reflow solder on the printed wiring board (PWB) is still basically the same. Heat is transferred from the heat source to the PWB surface, to the pads melting the solder paste, which forms the required solder joint. Source temperature or furnace set points are higher than the resulting PWB surface with the exception of vapor phase soldering where the temperatures are the same. It is not uncommon to see 30 o C or more temperature differences between furnace set points and actual PWB surface temperatures. Reliable solder joints require accurate profiles to be run to insure that the solder pads reach required temperatures for adequate periods of time. SM10_IM Page 8 of 11 Rev. C

12 Proper profiles require several thermocouples be attached to points on the PWB to insure that each portion of the PWB is reaching proper temperatures for the right amount of time. Thermocouples need to be 36 gage or approximately.004 or.1mm in diameter. This insures that the thermocouple mass does not interfere with accurate readings. Thermocouples need to be embedded into high temperature solder on a lead or component pad, typically 10/88/2 or 10% Sn, 88% Pb, and 2% Ag is ideal to attach thermocouples. Loose thermocouple wire can be taped to the PWB surface with high temperature tape. Leads of SM power supplies cannot exceed 220 o C so its components do not undergo secondary reflow, which would damage the supply. Profiling a PWB should include a thermocouple attached to a SM lead, a component pad near a corner of the PWB and at a minimum of one more attached to a component pad near the center of the PWB. These points need to be monitored to insure that the hottest portion of the PWB or corner does not get to potentially harmful temperatures while the coolest portion of the PWB or board center or SM lead is hot enough to insure proper reflow of the solder paste. Typically 63/37 solder needs to be above 205 o C to insure low viscosity and good intermetallic compound (IMC) layer formation. Temperatures above 230 o C can be harmful to plastic molded integrated circuits (plastic package cracking) and lead to excessive IMC formation. Most solder paste manufacturers recommend dwell times above the solder liquidus temperature or 186 o C for 63/37 solder of approximately 45 to 60 seconds with peak temperatures of 210 to 220 o C. These are measured temperatures on the PWB surface and not furnace set points. The SM Unit s electronics and identifying label can withstand all standard cleaning method available for electronic manufacturing processes. Exhibit A (Before Reflow) CORNER CENTER PIN SM10_IM Page 9 of 11 Rev. C

13 Exhibit B REFLOW PROFILE Degrees C Thermocouples Locations Pin Corner Center :18 9:18 9:19 9:19 9:19 9:20 9:20 9:20 9:21 9:21 9:21 9:22 9:22 9:22 9:23 9:23 Time Exhibit C (After Reflow) SM10_IM Page 10 of 11 Rev. C

14 VIII. RECOMMENDED SOLDERING TO DIFFERENT METAL FINISHES Electronic components and printed wiring boards (PWB) are available with a variety of lead finishes including solder, typically 60/40, pure tin, gold flash over nickel, silver over nickel and palladium over nickel. Solder finish and pure tin are the most common followed by gold flash. Silver and palladium finished PWB and components are less common but are also encountered. Soldering and solder wetting to a surface finish are two different phenomena and must be considered separately. Solder wetting to a finish like gold, silver or palladium involves the molten solder in a solder process alloying with those materials. For soldering to take place, tin which is the active metal in the solder, needs to alloy with the base metal of copper or nickel and not the precious metal layer. This resulting alloy is an intermetallic compound (IMC) that is the result of solid state diffusion of tin into that base metal. Once the solder has wet to a finish, the precious metal finish needs to be dissolved into the solder to then allow tin to diffuse into the base metal of copper or nickel. So gold, silver and palladium over nickel components and boards need to be soldered at slightly higher temperatures and for slightly longer periods of time. This insures dissolution of the precious metal finish into the solder and to allow tin diffusion into the base metal to form the required IMC layer in a solder joint. Solder and tin plated surfaces do not pose problems because IMC layers form even at room temperature and is accelerated at soldering temperatures. During the soldering process solder plated surfaces wet to the solder and an IMC has already been formed. Tin plated surfaces also have the required IMC. Reflow temperatures do not need to reach the melting temperature of tin because it rapidly dissolves into the solder. Also the solder does not need to completely dissolve the tin layer but just wet to it because an IMC layer has already formed. Tin rapidly dissolves into the solder forming a very slightly tin rich solder as a result of it alloying with the base solder. Typical tin plate thickness ranges micro inch or 2-3 microns. Solder mass on a pad from solder paste screened on prior to reflow has typically 30 to 40 times more solder. The resulting solder alloy from dissolving thin tin plating into the solder joint is still nearly that of the starting solder. Nickel-plated copper leads are used on the SM series of power supplies to eliminate excessive tin copper intermetallic layers from forming. Tin-nickel IMC layers form at much lower rates at commonly encountered soldering and use temperatures than do tin-copper layers. Intermetallic compound layers are very brittle and can fracture if they are too thick. Nickel is commonly used as a diffusion barrier to protect the copper lead frame. Nickel plated copper leads are used to minimize IMC formation during all solder and repair temperature cycles and still provide a solderable surface. The SM power supply has copper lead frames, which is soldered to the customer s Printed Circuit Board, to provide a more compliant mechanical interface. IX. RECOMMENDED DE-SOLDERING TOOL For all SM soldering and de-soldering rework requirements, custom nozzles designed for the Air-Vac DRS24 series automated rework system can be ordered directly from Air-Vac as follows: Model SM10 SM20 SM30 Air-Vac Part Number N2510B2510BA N1810B1810BA N1410B1410BA Address: Air-Vac Engineering Company Inc. 30 Progress Avenue Seymour, CT Telephone: (203) SM10_IM Page 11 of 11 Rev. C