EPON and EPI-REZ Epoxy Resins

Transcription

1 Selector EPON and EPI-REZ Epoxy Resins Our s for America (North and South) Qualifying a resin system that offers the best balance of performance and processability can be a significant challenge. You not only need quality products from a reliable supplier, you need a company that is willing to share its technical expertise and that will provide services to help satisfy your unique requirements. That s where Hexion Inc. comes in. We are the Epoxy Business of Hexion, one of the world s leading suppliers of epoxy resins, curing agents, modifiers and epoxy systems. We offer a diverse line of epoxy resins that vary in chemical structure, molecular weight, viscosity and functionality providing the formulator with a multitude of options. What s more, our products have over sixty years of innovation and success in a wide variety of markets and end-use applications. At our world-class technology centers in the U.S., Europe and Asia Pacific we pursue advanced processing technologies while creating new resin products and systems with broad performance ranges. We bring you processing advantages such as easy workability at room temperature with variable cure rates, and help you create products with special characteristics such as flexibility, good chemical and water resistance, and superior performance in elevated temperature service. By continually tackling technical challenges in our application laboratories, we are able to translate real world requirements into high quality, production-oriented materials. The EPON and EPI-REZ families of resins were developed to provide superior overall performance in a variety of end-use applications. These products enable manufacturers to achieve nearly any desired performance level, while optimizing processability and strength retention at elevated temperatures. Key Benefits EPON resins, in thermoset systems with our curing agents and modifiers, offer advantages such as: Low room temperature viscosity Long working life Low moisture absorption Superior epoxy performance Flexibility Reactivity High elongation Adjustable cure times Good chemical and corrosion resistance Heat resistance Fire retardance

2 At A Glance EPON Liquid Epoxy Resins and Blends This segment of our product line represents the most widely used products in a number of industries. The most commonly used EPON Resin/V. C. HELOXY Modifier blends are available in several types and viscosity grades. EPON Epoxy Resin s These products are higher molecular weight standard or modified epoxies which are dissolved in solvent to allow easier handling and formulation because of lower viscosity. EPON Solid and Powder Grade Resins These epoxy resins are in the molecular weight range most suitable for use in epoxy solutions, powder coating, composite and electronic applications. These products have a good balance of properties, including appropriate epoxy functionality for proper curing, good physical stability (sintering resistance), and good melt flow (low melt viscosity). EPON Epoxy Resins These products are specifically designed to provide increased levels of thermal stability and chemical resistance, and are used in composites, structural adhesives, electronics / electrical and coating applications. EPON Epoxy Polyacrylates These are very low viscosity resins possessing excellent wetting characteristics and rapid reaction rates with amine curatives over a broad temperature range. EPON Elastomer Epoxy Resins These products offer improved adhesive properties, thermal shock resistance and toughness, with good fatigue resistant properties. EPONEX Cycloaliphatic Resin This segment offers a low viscosity liquid epoxy based on hydrogenated Bisphenol A for applications requiring UV resistance. EPON and EPONOL Electrical Laminating Resins These products can be used to obtain fire retardance in a base epoxy resin formulation. The ultra-high molecular weight resin can be used to improve flexibility and modify the flow properties of the system. EPON and EPIKOTE Epoxy Resins for Composites Epoxy resins that provide the property retention, toughness and corrosion protection required in composite applications EPI-REZ Epoxy Waterborne Resins These non-ionic aqueous dispersions of our epoxy resins provide benefits such as lower VOC, extended pot life, high crosslink density, high temperature performance, very good chemical resistance, B-stage capability, low color, and complete water-reducibility. Many of the Hexion EPIKURE Curing Agents can be used with these epoxy dispersions. In addition, since dicyandiamide is water soluble, it may be used to provide extended pot life formulations. 15 2

3 The Formulator s Choice Resin Coding System All of our products are manufactured to high standards of quality and have very specific property ranges. To help you assess the many production and performance advantages of Hexion s complete line of resins, we ve summarized typical properties and resin characteristics in this product bulletin. The data in this bulletin is intended to give only basic product information for quick reference individual product technical data sheets with additional information are available for most of the products listed in the following pages. For additional information about these products, or to contact us, visit the Epoxy, Curing Agents and Modifiers section of the Hexion website at Epoxy resins employ a simple three-part coding system for designating the composition of resin solutions. The coding system consists of a number indicating the epoxy resin used in the particular solution, followed by one or more letters that describe the solvent or combination of solvents used to make up the solution. The last two numbers indicate the percent solids (by weight) of the composition. For example: EPON Resin 1001-H-75 In this example, the base resin used to make this solution is the EPON Resin 1001F type. The solvent used is Propylene Glycol Monomethyl Ether (PM), as shown in the next table, and the solids content is 75 percent by weight. The coding system that is used to designate the solvents in resin solutions is shown on the next table (pg 5): 3

4 Solvent Coding System Letter Code Solvent Name Abbr Non HAPS 1 VOC Exempt 2 A Acetone Yes Yes B Methyl Ethyl Ketone MEK Yes C Methyl Isobutyl Ketone MIBK D Diacetone Alcohol DAA Yes E Isopropyl Alcohol IPA Yes F n-butyl Alcohol (Converting to Code "N") NBA Yes G n-butyl Acetate NBAC Yes H Propylene Glycol Monomethyl Ether PGMME / PM Yes I iso-butyl Alcohol Yes J Ethyl 3-Ethoxy Propionate EEP K t-butyl Acetate TBAC Yes Yes L Propylene Glycol Mono n-butyl Ether PGMnBE / PnB Yes M Ethylene Glycol Monobutyl Ether EGMBE / EB Yes N n-butyl Alcohol NBA Yes O Methyl n-amyl Ketone MNAK Yes P n-propyl Alcohol NPA Yes Q Propylene Glycol Monomethyl Ether Acetate PGMMEA / PMA Yes R Dimethyl Formamide DMF S Cyclohexanone Yes T Toluene U Aromatic 100 A 100 < 5% HAPS V Dipropylene Glycol Monomethyl Ether DPGME Yes W Water Yes Yes X Xylene Y Ethylene Glycol Monopropyl Ether EGMPE / EP 1 HAP is the acronym for hazardous air pollutant as defined by the U.S. Clean Air Act Amendments of VOC is the acronym for Volatile Organic Compound as defined by the U.S. 40 CFRS1.100 (s). VOC exempt solvents are classified as such by the U.S. EPA, local state and regional air quality districts. 4

5 Table 1: Typical Properties of EPON Unmodified Liquid Epoxy Resins at 25 C (P) EPON Ultra high purity, low viscosity liquid epoxy used for high solids coatings and specialty composites. EPON Low viscosity liquid epoxy used in coatings and composite applications. EPON Medium viscosity liquid epoxy resin that falls between EPON 826 and EPON 828. It is used mainly in composite applications. EPON Predominant liquid epoxy product, widely used in multiple applications. EPON Higher molecular weight liquid epoxy. EPON Highest molecular weight liquid epoxy used in adhesives and as a modifier of liquid epoxy systems. EPON 862 DGEBPF Low viscosity Bisphenol F liquid epoxy used alone or in blends with other resins. Allows high solids formulations with good chemical resistance. A high performance alternative to diluted EPON 828 resins. EPON 863 DGEBPF Comparable performance to EPON 862 with improved crystallization resistance. 1 Platinum-Cobalt Color Scale 2 70% by weight solution in Diethylene Glycol Monobutyl Ether Table 2: Typical Properties of EPON Liquid Epoxy Resins at 25 C (P) EPON 824 EPON 829 EPON 8280 EPON 8281 EPON Liquid epoxy modified for low viscosity and may be used as an alternative to diluted EPON 828 resins. Offers improved crystal resistance Liquid epoxy resin pre-catalyzed for subsequent up-staging with BPA Anti-foaming and anti-settling modified liquid epoxy resin for systems with fillers and pigments Anti-foaming and anti-settling modified liquid epoxy resin for silica filled systems Liquid epoxy modified for flexibility and toughness. Used in applications where thermal shock or impact resistance is important. 1 Platinum-Cobalt Color Scale 2 75% by weight solution in Xylene 3 Gardner Color Scale 5

6 Table 3: Typical Properties of EPON Epoxy Resin Blends EPON 235 EPON 813 EPON 815C EPIKOTE 816 EPON 8112 EPON 8131 EPON 8132 EPON CS 241 EPON CS 242 EPON CS 243 EPON CS 377 EPON 8201 / DGEBPF at 25 C (P) Blend of BPA and BPF liquid epoxy resins. It provides lower viscosity than standard LER as well as improved crystallization resistance Liquid epoxy with HELOXY 62 Cresyl Glycidyl Ether, for good chemical and crystallization resistance Liquid epoxy with HELOXY 61 Butyl Glycidyl Ether, providing superior wetting characteristics Liquid epoxy with CARDURA E10P - glycidyl ester of neodecanoic acid, for good pigment wetting and resistance to filler settling. Offers good resistance to crystallization Similar to EPON 815C with slightly higher viscosity Liquid epoxy with HELOXY 505 Castor Oil Glycidyl Ether, for flexibility in flooring and adhesive applications Liquid epoxy with HELOXY 8 Alkyl Glycidyl Ether, utilized in a broad range of applications Liquid epoxy with HELOXY 8 Alkyl Glycidyl Ether. A higher viscosity version of EPON Liquid epoxy modified with HELOXY 8 Alkyl Glycidyl Ether. A medium viscosity version of EPON 8132 most often used in flooring systems Liquid epoxy with HELOXY 8 Alkyl Glycidyl Ether that provides easier handling with good overall performance Resin solution, 96% solids with HELOXY 65 p-tert-butyl Phenyl Glycidyl Ether Liquid epoxy with HELOXY 62 Cresyl Glycidyl Ether and modified for anti-settling and anti-foaming, primarily used in highly filled systems. 1 Platinum-Cobalt Color Scale 6

7 Table 4: Typical Properties of EPON Liquid Epoxy s EPON 828-X-95 EPON 834-F-90 EPON 834-X-80 EPON 834-X-90 EPON 836-C-75 EPON 8521-MX-60 EPON 872-X-75 EPON 873-CX-80 EPON 874-B-90 EPON 874-CX-90 EPIKOTE 874L-X-90 at 25 C (P) Resin solution, 95% solids in Xylene Resin solution, 90% solids in n-butanol Resin solution, 80% solids in Xylene Resin solution, 90% solids in Xylene Resin solution, 75% solids in MIBK resin solution, 60% solids in Ethylene Glycol Monobutyl Ether/Xylene, for improved surface tension characteristics resin solution, 75% solids in Xylene, for applications needing flexibility and toughness resin solution, 80% solids in MIBK/Xylene, for applications needing flexibility, toughness and reduced VOC levels resin solution, 80% solids in MEK, for applications needing flexibility, toughness and reduced VOC levels resin solution, 90% solids in MIBK/Xylene, for applications needing flexibility, toughness and reduced VOC levels resin solution, 90% solids in MIBK/Xylene, for applications needing higher flexibiity, toughness, and lower VOC levels 7

8 Table 5: Typical Properties of EPON Solid Epoxy s EPON 1001-A-80 EPON 1001-B-80 EPON 1001-CX-75 EPON 1001-DNT-75 EPON 1001-FT-75 EPON 1001-G-70 EPON 1001-H-75 EPON 1001-K-65 EPON 1001-O-75 EPON 1001-T-75 EPON 1001-UY-70 EPON 1001-X-75 EPON 1004-O-65 EPON 1007-CT-55 EPON 1007-FMU-50 EPON 1007-HT-55 EPON 1009-DU-40 EPON 1009-MX-40 at 25 C (P) Resin solution, 80% solids in Acetone (VOC Exempt) Resin solution, 80% solids in MEK Resin solution, 75% solids in MIBK/Xylene Resin solution, 75% solids in Diacetone Alcohol/ n-butanol/toluene Resin solution, 75% solids in n-butanol/toluene Resin solution, 75% solids in n-butyl Acetate Resin solution, 75% solids in Propylene Glycol Monomethyl Ether Resin solution, 65% solids in t-butyl Acetate (VOC-exempt) Resin solution, 75% solids in MNAK Resin solution, 75% solids in Toluene Resin solution, 70% solids in Aromatic 100/Ethylene Glycol Monopropyl Ether Resin solution, 75% solids in Xylene Resin solution, 65% solids in MNAK ,600 2, Resin solution, 55% solids in MIBK/Toluene ,600 2, Resin solution, 50% solids in n-butanol/ethylene Glycol Monobutyl Ether/Aromatic ,600 1, Resin solution, 55% solids in Propylene Glycol Monomethyl Ether/Toluene ,300 3, Resin solution, 40% solids in Diacetone Alcohol/ Aromatic ,300 3, Resin solution, 40% solids in Ethylene Glycol Monobutyl Ether/Xylene. 8

9 Table 6: Typical Properties of EPON Solid Epoxy Custom s EPON CS 258 EPON CS 267 at 25 C (P) ,250 2, Resin solution, 50% solids in Propylene Glycol Monomethyl Ether Acetate ,700 3, High molecular weight resin modified for high toughness, 65% solids in Propylene Glycol Monomethyl Ether Acetate/Toluene. Table 7: Typical Properties of EPON Solid Epoxy Resins Fusion Grades 1 at 25 C (cp) Color 2 Softening Point C Melt at 150 C (P) EPON 1001F Lowest molecular weight solid epoxy used to provide improved toughness, flexibility, flow control and tack. Standard resin for coatings and pre-preg. Susceptible to sintering g/ml. EPON 1002F Slightly higher molecular weight than EPON 1001F. Better sintering resistance g/ml. EPON 1004F Medium molecular weight solid epoxy resin containing hydroxyl groups. Often reacted with vegetable oil acids to produce epoxy ester resins. Can also add toughness, flexibility and rheology control g/ml. EPON 1007F ,700 2, Moderately high molecular weight solid epoxy resin used for industrial coatings cured with urea-formaldehyde and phenolformaldehyde resins g/ml. EPON 1009F ,300 3, > 500 High molecular weight solid epoxy resin for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins g/ml. 1 40% by weight solution in MEK 2 Platinum-Cobalt Color Scale 9

10 Table 8: Typical Properties of EPON Solid Epoxy Resins Powder Coating and Molding Grades 1 at 25 C (cp) Color 2 Softening Point C Melt at 150 C (P) EPON Medium low molecular weight solid epoxy resin used primarily for thin film epoxy powder coating applications g/ml. EPON Medium molecular weight solid epoxy resin used primarily for thin or thick epoxy powder coating applications g/ml. EPON Medium molecular weight solid epoxy resin used primarily for thin or thick film epoxy powder coating applications g/ml. EPON ,200 1, > 300 Moderately high molecular weight solid epoxy resin used primarily for intermediate and thick film epoxy powder coating applications g/ml. EPON 2014 EPON 2024 EPON Moderately high molecular weight solid epoxy resin modified with epoxy phenol novolac used primarily in high performance powder coating applications to provide superior chemical and corrosion resistance g/ml Medium molecular weight solid epoxy resin modified with a flow control agent. 1.2 g/ml Medium low molecular weight solid epoxy resin modified for improved flow. 1 40% by weight solution in MEK 2 Platinum-Cobalt Color Scale Table 9: Typical Properties of EPON Solid Epoxy Resins Electrical Grade EPON cp at 25 C Color 2 Softening Point C Melt at 150 C (P) Solid epoxy resin flake, modified for low melt viscosity and high reactivity. Primarily used for electrical encapsulation. 1 40% by weight solution in MEK 2 Platinum-Cobalt Color Scale 10

11 Table 10: Typical Properties of EPON and EPIKOTE Epoxy Resins EPON 1031 EPON 1031-A-70 EPON HPT 154-A-85 EPON 154 EPON SU-2.5 EPON SU-8 EPON 160 EPON 161 EPON 162 EPON 164 EPON 165 TGETPE Flake TGETPE Epoxy Phenolic Epoxy Phenolic Epoxy BPA Epoxy BPA Flake Epoxy BPF Epoxy BPF Epoxy BPF Epoxy Cresol Flake Epoxy Cresol Flake at 25 C (P) Tetraglycidyl Ether of Tetraphenol Ethane with a functionality of 3.5. Used in applications requiring high temperatures and chemical resistance EPON 1031 solution, 70 % solids in Acetone EPON 154 solution, 85% solids in Acetone Epoxy phenolic novolac resin with a functionality of 3.6, providing high chemical and temperature resistance, and dimensional stability Epoxy Bisphenol A novolac with a functionality of 2.5, providing good thermal stability and chemical resistance. Used in electrical, adhesive and composite applications Epoxy Bisphenol A novolac with a functionality of 8, providing rapid development of green strength, with good high temperature performance. Used in electrical, adhesive and composite applications BPF epoxy novolac with a functionality of 2.6 a low viscosity version of EPON 154. High functionality with easy processing, good thermal stability and chemical resistance BPF epoxy novolac with a functionality of 2.5 a lower viscosity version of EPON 160. High functionality with easy processing, good thermal stability and chemical resistance BPF epoxy novolac with a functionality of 2.2 the lowest viscosity version of EPON 160. Adequate functionality with easiest processing, yet with good thermal stability and chemical resistance Solid epoxy cresol novolac resin with a functionality of 4.1 and is used in high performance laminates, molding compounds, aerospace composites, special adhesives and tooling systems Solid epoxy cresol novolac resin with a functionality of 5.5 and is used in very high performance laminates, molding compounds, special adhesives, aerospace composites and tooling systems. 2 at 120 C 3 at 52 C 4 at 130 C 5 60% by weight solution in MEK 6 at 50 C 11

12 Table 11: Typical Properties of EPON Epoxy Polyacrylates at 25 C (cp) EPON 8021 EPON 8111 EPON 8161 Epoxy Polyacrylate Epoxy Polyacrylate Epoxy Polyacrylate Equivalent Weight Very low viscosity epoxy diacrylate resin that imparts high reactivity and superior wetting characteristics. 13 minute gel time with TETA , Low viscosity epoxy triacrylate resin that provides rapid reaction rates. Uses include high-build sealers, wear-resistant surfacing and low temperature cure applications. 2.5 minute gel time with TETA. 1,800 2, Moderate viscosity epoxy diacrylate resin with performance similar to EPON 828. Applications include flooring, grouts, adhesives, casting and encapsulation systems. 27 minute gel time with TETA. Table 12: Typical Properties of EPON Elastomer Epoxy Resins at 25 C (P) EPON EPON EPON EPON EPON CTBN CTBN CTBN DGENPG CTBN CTBN 3,000 8, CTBN modified BPA epoxy resin with an elastomer content of 40%. Utilized in high performance adhesives for peel strength, thermal shock resistance, toughness and fatigue resistance. 1,500 3, CTBN modified BPA epoxy resin with an elastomer content of 40%, but a slightly lower acrylonitrile level than EPON For flexibility and fatigue resistance in adhesives and composites CTBN modified HELOXY 68 with an elastomer content of 50%. Used as a low viscosity and high toughness modifier for adhesives and sealants ,050 3 CTBN modified solid epoxy resin with an elastomer content of 20%. Used for adhesion, thermal shock, fatigue and impact resistance in functional pipe and thick film powder coatings as well as for electrical powders. 1,000 5, CTBN modified BPA epoxy resin with an elastomer content of 5%. Provides flexibility and tack for early green strength, and also provides flow control for adhesives, prepregs and sealants. 2 at 150 C Table 13: Typical Properties of EPONEX Cycloaliphatic Resin at 25 C (cp) EPONEX 1510 Hydrogenated 1,800 2, Low viscosity Cycloaliphatic Glycidyl Ether. Used to obtain epoxy performance in coatings, electronics and specialty composites where improved UV resistance is a requirement. 1 Platinum-Cobalt Color Scale 12

13 Table 14: Typical Properties of EPON Electrical Laminating Resins at 25 C (cp) EPON 1124-A-80 DGETBBPA 1,200 2, Acetone solution of brominated resin for flame retardant electrical laminates. Bromine content 19.5% by weight. EPON 1163 DGETBBPA 100 1, Low melting solid epoxy with 48% by weight bromine. Softening point at 64 C. Imparts fire retardancy in laminating, casting and molding applications. EPON CS 373 Brominated Epoxy One-pack, DICY-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of Methyl Ethyl Ketone (MEK) and Propylene Glycol Monomethyl Ether (PGME). Used for high Tg applications at 180 C. Bromine content 13.5 % by weight. 2 at 120 C 3 Platinum-Cobalt Color Scale Table 15: Typical Properties of EPONOL Ultra High Molecular Weight Resin at 25 C (cp) at 25 C (Gardner) EPONOL 53-BH ,600 U - Z Ultra high molecular weight epoxy resin used for adhesives and prepreg laminates to impart flexibility and to modify flow properties of the system. Table 16: Typical Properties of EPON and EPIKOTE Epoxy Resins for Composites at 25 C (cp) EPON ,000 5, For CIPP (Cured In Place Pipe) applications where long term physical integrity, durability and resistance to chemical attack is needed. Typically used with EPIKURE

14 Table 17: Typical Properties of EPI-REZ Waterborne Epoxy Resin s EPI-REZ 3510-W-60 EPI-REZ 3515-W-60 EPI-REZ 3520-WY-55 EPI-REZ 3522-W-60 EPI-REZ 3540-WY-55 EPI-REZ 3546-WH-53 EPI-REZ 5003-W-55 EPI-REZ 5520-W-60 EPI-REZ 5522-WY-55 EPI-REZ 6006-W-68 EPI-REZ 6520-WH-53 BPA OCN at 25 C (cp) ph 500 5, Waterborne dispersion of a low molecular weight liquid Bisphenol A epoxy resin (EPON Resin 828 type). 4,000 15, Waterborne dispersion of a semi-solid Bisphenol A epoxy resin. 7,000 17, Waterborne dispersion of a semi-solid Bisphenol A epoxy resin (EPON 1001 type) with an organic co-solvent. Primarily used in coatings systems 8,000 18, Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1002 type). Typically used in film and fiber adhesives and finishes, FRP, and electrical dip coatings. 7,000 17,000 1,600 2, Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007 type) with an organic co-solvent. Generally used in baked industrial finishes, fiber finishes/binders, and as a modifier for ambient cure systems. 1,000 15,000 1,900 2, Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007 type) similar to EPI-REZ 3540-WY-55 with a non HAPS co-solvent. 2,000 15, Waterborne dispersion of an epoxidized Bisphenol A novolac modified epoxy resin with an average functionality of 3 (EPON SU-3 type). Promotes wetting and adhesion to a variety of fibers and enhances chemical resistance in coatings. 2,000 15, Waterborne dispersion of a urethane-modified Bisphenol A epoxy resin. Provides improved chemical resistance and thermal performance for fiber finishes and industrial textile applications. 8,000 19, Waterborne dispersion of a novolac modified Bisphenol A epoxy resin (EPON 1002 type) with an organic co-solvent. Used for high performance coatings where higher chemical resistance and corrosion protection are required , Waterborne dispersion of an epoxidized o-cresylic novolac resin with an average functionality of 6. Provides high temperature stability, abrasion and chemical resistance in coatings, composites, adhesive and electronic applications. 1,000 6, New Gen Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001 type) with a non HAPS co-solvent. Provides exceptional corrosion protection for metal substrates as primers, DTM and topcoats. Table 18: Typical Properties of EPI-REZ Water Reducible Epoxy Resins EPI-REZ WD-510 EPI-REZ WD-512 Water Red. Water Red. at 25 C (P) Water dispersible Bisphenol A epoxy resin Water dispersible Bisphenol A epoxy resin. 14

15 Safety, Storage and Handling Please refer to the Material Safety Data Sheet (MSDS) for the most current Safety and Handling information. Please refer to the Hexion website for shelf life and recommended storage information. Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored or transported until the handling precautions and recommendations as stated in the MSDS for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs about non-hexion products should be obtained from the respective manufacturer. Packaging Available in bulk and drum quantities. Contact Information For product prices, availability or order placement, call our toll-free customer service number at For literature and technical assistance, visit our website at 15

16 Hexion: Helping you make it in today s world. Our global team produces the best in specialty chemicals and performance materials and provides the technical expertise to customize them to your exact needs. The result? Specific solutions, not generic products, leading to thousands of breakthroughs that improve bottom lines and enhance lives. Reach our Global Customer Service network at: U.S., Canada and Latin America / information@hexion.com Europe, Middle East, Africa and India / information.eu@hexion.com China and Other Asia Pacific Countries information.ap@hexion.com Please refer to the literature code HXN-152 when contacting us. World Headquarters 180 East Broad Street Columbus, OH Hexion Inc. All rights reserved. and denote trademarks owned or licensed by Hexion Inc. HXN /17 The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion s specifications. Nothing contained herein constitutes an offer for the sale of any product.