Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components

Transcription

1 Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN M. DEDE, MASANORI ISHIGAKI, SHAILESH N. JOSHI, & FENG ZHOU TOYOTA RESEARCH INSTITUTE OF NORTH AMERICA J U N E 1 3, I N T E R N AT I O N A L S Y M P O S I U M O N 3 D P O W E R E L E C T R O N I C S I N T E G R AT I O N A N D M A N U FA C T U R I N G ( 3 D - P E I M )

2 Acknowledgements o National Renewable Energy Lab o Mr. Kevin Bennion o Dr. Gilbert Moreno o Dr. Sreekant Narumanchi o Purdue University CTRC o Professor Suresh V. Garimella o Dr. Matthew J. Rau o Toyota Central R&D Labs o Dr. Tsuyoshi Nomura o Toyota Motor Corporation o Mr. Tomohiro Takenaga o Toyota Technical Center o Dr. Yan Liu o Wolfspeed o Dr. Kraig J. Olejniczak o Dr. Brandon Passmore 2

3 Outline o Overview of Research Group o Motivation for 3D Integration o Why Explore Additive Manufacturing? o Applications for Additive Manufacturing o Circuit-Level Concepts o System-Level Concepts o Future Opportunities & Challenges o Conclusions o References 3

4 Overview of Research Group o Toyota Research Institute of North America o Electronics Research Department Investigation of Next Gen. SiC, GaN Devices Intelligent & WBG Devices (Lab E-1 & E-2) Development of Automotive Phased Array Radar Development of 14X Power Density SiC Charger Prototype Advanced Circuit & Control (Lab E-1 & E-2) Optimized Electro-Thermal Power Systems High Temperature Packaging (Lab E-2) Ni Ni 3 Sn 4 10 um (a) Binary-Composite, Ni-Sn Al Research on TLP for Advanced Packaging 10 um (b) Ternary-Composite, Ni-(Ag-Al)-Sn Research focused on environment, safety, and human interaction To outlet Thermocouple holes Inlet Thermal Energy Management (Lab E-2) Heat Flow Control for Electronics Center-to-edge Flow Figure 2: Zoomed cross section views of the diffusion bonded multi-device cold plate including the inlet region Optimization for Air, Single, with a single cooling cell on the right and the middle transition region with a second cooling cell on the left. Two-Phase Cooling Note that the blue arrows indicate the coolant flow path through the manifolds and local cooling cells. 4

5 Motivation for 3D Integration o Current Power Control Unit (PCU) architecture compact, highly integrated packaging Ref.: Shimadu, H., et al., EVTeC 2016 Ref.: Okamoto, K., et al., Denso Tech. Rev DC-DC Converter with High Frequency Integrated Magnetics 4 th Gen. PCU Power Card Structure with Interleaved Double-Side Cooling 5

6 Why Explore Additive Manufacturing? o Core ideas behind Additive Manufacturing (AM) o Expand design space Enhance integration & create new function o multimaterial o lightweight structures o internal cooling passages o unparalleled geometric complexity o functionally grade material compositions Ref.: Rosen, D.W., et al., J. Mech. Design 2015 (Guest Editorial, Special Issue: Design for Additive Manufacturing) Above characteristics highly sought in future power-dense wide band-gap (WBG) electronics systems 6

7 Applications for Additive Manufacturing CIRCUIT-LEVEL CONCEPT CURRENT SENSOR 7

8 Permeability High Frequency Passives o High operational frequency expected with WBG devices Paradigm shift in magnetics design Pros: Linear (air core) - No frequency dependence - No saturation Simple Low cost Frequency (MHz) *Ref.: Higher frequency: Air core device Ex: Rogowski-coil Cons: Manufacturing dependency 8

9 Sheet-Wound Coil Concept o Re-conceptualize the traditional wire-based structure Less noise in/out Design inductance accurately Noise (flux) Counter flux (from eddy current) Eddy current Plate Wire-Based Toroid Structure Sheet-Wound Structure [Cancel] Electromagnetic Shielding Effect 9

10 Sheet-Wound Coil Fabrication o Metal plating of 3D AM bobbin for structure realization Bobbin Assembled Sensor Experimental Result & Final Custom Sensor Image Fewer turns fabricated with greater precision enables high frequency, accuracy measurement in compact space 10

11 Applications for Additive Manufacturing CIRCUIT-LEVEL CONCEPT LC RESONANT TANK 11

12 Extension to LC Resonant Tank o Integrate resonant capacitance into structure o Magnetic flux packed inside due to shielding effect, while capacitance conserves magnetic flux 3D Isometric View & Equivalent Circuit Transparent & Sectioned Views 12

13 Extension to LC Resonant Tank o Application to air core transformer o Improve power transfer from primary to secondary coil with air core (i.e. no traditional ferrite core) Circuit Diagram (Wireless Power Transfer using Resonant Inductive Coupling) Sheet-Wound LC Tank Simulation Result* *Magnetic Flux Density Contours Shown Wire-Based Toroid Simulation Result* 13

14 LC Resonant Tank Fabrication o Direct Metal Deposition (DMD) 3D printing o Fabricated using three components to properly construct air gap Multi-material (metal-plastic) 3D printer technology required for one-piece construction! Sharp resonance with high quality factor AM Manufacturing Strategy Experimental Results for 3D Resonant Tank 14

15 Applications for Additive Manufacturing SYSTEM-LEVEL CONCEPT AIR COOLING 15

16 Air-Cooled Heat Sink Design o Structural optimization plus AM applied to study performance limits o Optimization for steady-state heat conduction plus side-surface convection Movie of Example 2-D Structural Optimization Design Evolution 3D Topology Optimization Result Quarter-Symmetry Point Cloud Data Synthesized Solid Model CAD Geometry Extension to 3D Design AlSi12 Rapid Prototype Variable geometry pin fin design obtained to maximize heat transfer 16

17 Heat Sink Performance Evaluation COP = 1/(Rth(cnv) P ሶ V) Case 1 Case 1 experimental results for Al alloy heat sinks, HS 1 HS 5, with 38.1 mm orifice at 12.7 mm jet-to-target spacing (Re ~ 4,700-19,000) Case 2 experimental results for pin-fin heat sinks, HS 1 & HS 5 HS 8, with 12.7 mm orifice at 12.7 mm jet-to-target spacing (Re ~ 14,000-43,000) Case 2 17

18 Applications for Additive Manufacturing SYSTEM-LEVEL CONCEPT LIQUID COOLING 18

19 Modular Liquid Cooling for Power Electronics o Manifold microchannel (MMC) system for high performance single-phase liquid cooling Manifold Section plus Insert & Heat Sink Transparent Views with Flow Operation MMC Detailed View 19

20 Modular Liquid Cooling for Power Electronics o Cold plate flow configurations considering three power modules Exploded View of Cold Plate 20

21 Modular Cold Plate AM Rapid Prototype o Polymer prototype manifold system with snap-fit connections 3D AM Optimized MMC Heat Sink Concept Disassembled Cold Plate Showing Two AM Manifold Sections Insert on Top of Fin Structure 21

22 Liquid Cold Plate Design Another Quick Note o Precision machined & diffusion bonded, but why not 3D print? Multi-Pass Microchannel System To outlet Inlet 12-Piece Single-Phase Liquid Cold Plate R&D 100 Award Winner (2013) Thermocouple holes Cross-Section View Figure 2: Zoomed cross section views of the diffusion bonded multi-device cold plate including the inlet region with a single cooling cell on the right and the middle transition region with a second cooling cell on the left. Note that the blue arrows indicate the coolant flow 22 path through the manifolds and local cooling cells.

23 Applications for Additive Manufacturing SYSTEM-LEVEL CONCEPT TWO-PHASE COOLING 23

24 Two-Phase Cooling for Enhance Performance o High power density systems single-phase liquid cooling reaching fundamental limit o Design of high performance two-phase cooling technology Upper outlet manifold Coolant outlet slot Jet orifice plate Middle outlet manifold Gasket Lower outlet manifold Inlet Outlet 400 μm Porous Structure Detail Operational Concept for Two-Phase Jet Impingement Cooling Copper heat spreader PEEK AM AlSi12 Heat Spreader Cold Plate with Vapor Extraction Manifold 24

25 Performance Characteristics o Flow visualization and understanding heat transfer and pressure drop comparison Inherent porosity of AM surface extends CHF Two-Phase Jet Impingement Movie Approaching Critical Heat Flux (CHF) 25

26 Compact Manifold Design o Exploit optimization of single-phase inlet manifold for size reduction of cold plate * Dimensions in mm Fluid inlet Fluid distribution manifold Design Evolution Movie Final Design Target plate with four 15 mm square heat sources Jet orifice plate Fluid outlet via 100 jet orifices via four 5 5 jet arrays Fig. 1: Schematic of general jet impingement heat transfer system with coolant fluid distribution structure. Manifold Layout for Four Power Devices Design Verification by Simulation AM Rapid Prototype for Design Visualization 26

27 Future Possibilities Target Surface Design o Opportunity for structural design optimization as two-phase conjugate simulation evolves Jet Nozzle Impingement Region (Location of high heat transfer in single-phase) Target Surface Jet CL *Ref.: Rau, M.J. and Garimella, S.V., IJHMT *Ref.: Rau, M.J. and Garimella, S.V., IJHMT Typical Jet Impingement Scenario Two-Phase Temperature Map (3 x 3 jet array) Variation in Local Heat Transfer Coefficient (3 x 3 jet array) 27

28 Future Possibilities Target Surface Design o Example optimization study for heat conduction plus side-surface convection (following air cooling study) o Assume inverse spatial heat transfer coefficient distribution is known a priori 9X Jet impingement location (at valleys) Interspersed two-phase regions for surface enhancement (at peaks) Impose Heat Transfer Coefficient Profile to Optimize Two-Phase Surface Regions Movie of Evolution of Surface Structure AM Possibility? 28

29 Challenges & Future Opportunities o AM material related challenges in context of present work o Multi-material printing combining metals and plastics for 3D circuits o Technologies now starting to emerge o High thermal conductivity (e.g. copper) and high temperature materials o NASA demonstrated need transition to wider commercial space o Fully dense metal deposition (heat transfer) & plastic printing (flow) o Comprehensive design methods that address AM o Re-think traditional design paradigms and re-phrase methods to remove traditional manufacturing limitations o Democratization of manufacturing logical byproduct of AM o But, will low cost, high volume production become a reality? 29

30 Conclusions o AM supports exploration of future 3D power electronics integration and manufacturing o New compact, high performance electrical device and circuit concepts realizable o Benefits rapid investigation of unique thermal management technologies o Synergy with advanced structural optimization methods o Complex topologies no longer limited by traditional fabrication o How to realize full potential of AM for power-dense electronics systems? o Further research and development for multi-material printing technologies, finished material quality, and new material compositions o What is applicability for high volume manufacturing? 30

31 References 1. Zhou, F., Liu Y, Liu, Y., Joshi, S.N., and Dede, E.M., Modular design for a single-phase manifold mini/microchannel cold plate. Journal of Thermal Science and Engineering Applications, 8: (13 pages). 2. Dede, E.M., Joshi, S.N., and Zhou F., Topology optimization, additive layer manufacturing, and experimental testing of an air-cooled heat sink. Journal of Mechanical Design, 137: (9 pages). 3. Joshi, S.N. and Dede, E.M., Effect of sub-cooling on performance of a multi-jet two phase cooler with multi-scale porous surfaces. International Journal of Thermal Sciences, 87: Rau, M.J., Dede, E.M., and Garimella, S.V., Local single- and two-phase heat transfer from an impinging cross-shaped jet. International Journal of Heat and Mass Transfer, 79: Dede, E.M., Lee, J., and Nomura, T., Multiphysics simulation electromechanical system applications and optimization. Springer, London. 6. Dede, E.M. and Nomura, T., Topology optimization of a hybrid vehicle power electronics cold plate application to the design of a fluid distribution structure. EVTeC and APE 2014, Yokohama, Japan. 7. Rau, M.J. and Garimella, S.V., Local two-phase heat transfer from arrays of confined and submerged impinging jets. International Journal of Heat and Mass Transfer, 67: Ishigaki, M., et al., Proposal of high accurate and tiny rogowski-coil current sensor. IEEJ Annual meeting (Japanese), 4: