Specification For LTCC 2-way Power Divider

Transcription

1 Specification For LTCC 2-way Power Divider Model Name : Customer : Title: Name : APPROVED By Date : Signature : RN2 Technologies co., Ltd. RN2 Technologies co., Ltd , Galgot-ri, Jinwe-myeon, Pyeongtaek-si, Kyunggi-do, KOREA Phone : (+82) FAX : (+82) Issued Date : Designed : Approved :

2 2 / Description 1-1. Part number: 1-2. Features - Suitable for operation frequency 800~1000 MHz - Multilayer LTCC( Low Temperature Cofired Ceramics) Technology - High stability in temperature and humidity for LTCC base - Miniature size and high power capability - Surface mount type - RoHS compliance - Low loss for Silver(Ag) conductor - Lead-free alloy solderable - Thermal expansion corresponding with common substrate 2. Electrical Specification Freq. Insertion Loss VSWR Isolation (MHz) max (db) In/Out Max min (db) / Phase Balance Amplitude Balance Power Capacity Operating Temp. (degrees) (db) Avg. (Watts) ( ) ±2 ± to +125

3 3 / Mechanical Specification 3-1. Outline Dimension PROJECTION NO. DATE REVISION & DESCRIPTION SIGNATURE NO. DESCRIPTION TITLE 3-2. Weight Grams typical

4 4 / Port Configuration IN OUT1 OUT2 Configuration Port 1 Port 2 Port 3 Case 1 0 dbm -3 db -3 db 5. Schematic Drawing

5 5 / Typical Performance Data (25 ) Freq. S21 S31 I.L. Iso. Amp. Bal. Phase. Bal. Return Loss [db] [MHz] [db] [db] [db] [db] [db] [degree] S11 S22 S ±0.03 ± ±0.02 ± ±0.03 ± ±0.02 ± ±0.02 ± ±0.02 ± ±0.01 ± ±0.01 ± ±0.01 ± ±0.00 ± ±0.00 ± ±0.00 ± ±0.01 ± ±0.01 ± ±0.01 ± ±0.02 ± ±0.02 ± ±0.02 ± ±0.02 ± ±0.03 ± ±0.03 ±

6 6 / Operation Curve (a) Return Loss 0 CXD090S02_Return Loss(Port1) CXD090S02_Return Loss(Port2) 0 CXD090S02_Return Loss(Port3)

7 7 / 15 (b) Insertion Loss, Amplitude Balance, Phase Balance, Isolation CXD090S02_Transmission(S21) CXD090S02_Transmission(S31) CXD090S02_Insertion Loss 0.4 CXD090S02_Amplitude Balance CXD090S02_Phase Balance 0 CXD090S02_Isolation

8 8 / Measurement board layout PROJECTION No DATE REVISION & DESCRIPTION SIGNATURE REVIEWED CHECKED Signal(50ohm) Line Top-GND Through Via for connecting Bottom to GND No. DESCRIPTION UNIT TOTAL QUANTITY PERUNIT TOTAL TITLE CXD090S02-Measuremnet Board Outline RN2 DWG No. SCALE SIZE A4 DIMENSION mm

9 9 / Recommended PCB layout and Solder mask pattern PROJECTION No DATE REVISION & DESCRIPTION SIGNATURE REVIEWED CHECKED Signal(50ohm) Line Solder Area('A') Solder Area('B') Solder Area('C') 100 ohm resistor Top-GND Solder Resistor area Through Via for connecting Bottom to GND No. DESCRIPTION UNIT TOTAL QUANTITY PERUNIT TOTAL TITLE S size - Recommended Solder Quantity &Area RN2 DWG No. SCALE SIZE A4 DIMENSION mm

10 10 / Reflow profile Temp.[ ] T1 T2 T3 T4 t4 Air 100 Coolin 50 t1 t2 t Time [sec] Ramp Up Pre-Heating Peak Soaking Temp.[ ] T1:160±5 T2:180±5 T4:260±5 T3:230±5 Time [sec] t1:60±5sec t2:100±15sec t3:30±5sec t4:60±10sec

11 11 / Using note for LTCC Divider I. Be careful when transporting A. Excessive stress or shock may make products broken or cracked due to the nature of ceramics structure. B. The products cracked or damaged on terminals may have their property changed. II. Be careful during storage A. Store the products in the temperature of -55 ~ 125 B. Keep the humidity at 45 ~ 75% around the products. C. Prevent corrosive gas (Cl 2, NH 3, SO X, NO X, etc.) from contacting the products. D. It is recommended to use the products within 6 months of receipt. If the period exceeds 6 months, solderability may need to be verified. III. Be careful when soldering A. All the ground terminals, IN and SUM pad of combiner should be soldered on the ground plane of the PCB. B. Products may be cracked or broken by uneven forces from a claw or suction device. C. Mechanical stress by any other devices may damage products when positioning them on PCB. D. A dropped product is recommended not to be used. E. Soldering must be carried out by the condition of specification sheet. F. Any combiners which are de-soldered from PCB should not be used again.

12 12 / 15 IV. Be careful when Screw A B V. Be careful when SMD or Assembly A. LTCC couplers require appropriate measures to avoid its base PCB from warping. B. PCB excessively warping over defined standard may result in crack of LTCC couplers potentially.

13 13 / Packaging D0=1.55±0.05 P=4*10=40±0.1 P0=4.0±0.1 P2=2.0±0.1 B E=1.75±0.1 F=11.5±0.1 W=24.0±0.3 T=0.4±0.05 A' (10.75) B0=14.7± MIN10.0 P1=12.0±0.1 B' K0=2.3±0.1 A0=5.5±0.1 Feed Direction

14 14 / Environmental Reliability ITEM PROCEDURE REQUIREMENTS/RESULT 1. One Cycle : 30 min Step1: 125 ± 5 C for 15 min Temperature Step2: -55 ± 5 C for 15 min 1. Meet the electrical Specification Cycle 2. Approach high or low temperature in 10 seconds after test (Thermal Shock) 3. Number of Cycles : Normal temperature for 1 hour 1. More than 85% of the I/O Solderability 1. Solder : 230 ± 5 C for 5± 1 sec. electrode pad shall be covered with solder. Heat Resistance 1. Temperature : 100 ± 2 C 1. Meet the electrical Specification 2. Duration : 96 ± 2 hours after test Low Temp. Resistance 1. Temperature : -55 ± 5 C 2. Duration : 24 ± 2 hours 1. Meet the electrical Specification after test 1. Frequency: 5~ 15MHz 1. No appearance damage Vibration 2. Acceleration : 10g 2. Meet the electrical Specification Resistance 3. Sweep Time: 0.1 oct/min, 15min/axis after test 4. Axis : X, Y and Z direction Humidity Resistance Drop Shock 1. One Cycle : Step1:increase Temperature -25~65 C for 2hours with humidity 85% Step2:Maintain for 4 hour after increasing Humidity 90% to 95% Step3: Decrease Temperature 65 C to 25 C 2. Number of Cycles : Maintain for 3hour after decreasing temperature -10 C 1. Dropped onto hard wood from height of 50 cm for 5 times; each x, y and z direction except I/O direction. 1. Meet the electrical Specification after test 1. No appearance damage 2. Meet the electrical Specification after test

15 15 / RoHS test result - RN2 Technologies warrants and represents as follows.