Curriculum Vitae. Doctor of Philosophy in Engineering. Master of Engineering in Mechanical Engineering

Size: px
Start display at page:

Download "Curriculum Vitae. Doctor of Philosophy in Engineering. Master of Engineering in Mechanical Engineering"

Transcription

1 Curriculum Vitae Name: Tadahiro Shibutani Sex: Male Birth: 1973 Office address: Department of Risk management and Environmental Sciences, Faculty of Environment & Information Sciences Yokohama National University, 97-7 Tokiwadai, Hodogaya, Yokohama, Japan phone: , fax: WORK EXPERIENCE 2009 to Present Associate Professor, Faculty of Environment & Information Science, Yokohama National University 2000 to 2009: Research Associate, Faculty of Engineering, Yokohama National University, Japan 2007 to 2008: Visiting scholar, Center of Advanced Life Cycle Engineering, University of Maryland, USA EDUCATION 1998 to 2000 Kyoto University (Kyoto, Kyoto) Doctor of Philosophy in Engineering 1996 to 1998 Kyoto University (Kyoto, Kyoto) Master of Engineering in Mechanical Engineering 1992 to 1996 Kyoto University (Kyoto, Kyoto) Bachelor of Engineering in Mechanical Engineering AWARDS 2005 JSME Funai Award (with Prof. Masaki Shiratori and Prof. Qiang Yu) 2004 JSME Young Engineers Award RESEARCH SOCIETIES Japan Society of Mechanical Engineering: Member Japan Institute of Electronics Packaging, Member, Vice chairman of Reliability Analysis Committee Japan Society of Safety Engineering: Member

2 RESEARCH TOPICS Prognostics health management in electronics, Physics of failure in microelectronics, Reliability assessment of solder joints in electronics packaging PUBLICATIONS 17 papers in international professional journals, 17 Japanese papers, 27 papers on international conference and 1 Japanese book Journal papers: 1. Tadahiro Shibutani, "Effect of grain size on pressure induced tin whiskers", IEEE Trans. of Electronics Packaging & Technology,in press 2. Hyun-Seok Oh,Tadahiro Shibutani,Michael Pecht, " Precursor Monitoring Approach for Reliability Assessment of Cooling Fans ", Journal of Intelligent Manufacturing, Article in press 3. Tadahiro Shibutani, Qiang Yu and Michael Pecht, " Tin Whisker Reliability in Microelectronics", Micromaterials and Nanomaterials, Issue 9, pp , Tadahiro Shibutani, Michael Osterman and Michael Pecht, " Standards for Tin Whisker Test Methods on Lead-Free Components", IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 1, pp , Tadahiro Shibutani, Ji Wu, Qiang Yu, Michael Pecht, Key reliability concerns with lead-free connectors, Microelectronics Reliability, Vol. 48, No. 10, pp , October Tadahiro Shibutani, Qiang Yu, Masaki Shiratori and Michael Pecht, Pressure induced tin whisker formation, Microelectronics Reliability, Vol. 48, No. 6, pp , Qiang Yu, Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi and Masaki Shiratori, Effect of Process-Induced Voids on Thermal Fatigue Resistance of CSP Lead-Free Solder Joints, Microelectronics Reliability, Vol. 48, No. 3, pp , ( received; revised; accepted). 8. Tadahiro Shibutani, Takeshi Akai, Qiang Yu and Masaki Shiratori, Mechanism of Damage process on the Si 3 N 4 /Cu Interface in Nanoscratch Test, Journal of Solid Mechanics and Materials Science, 2007 (Translated paper). 9. Tadahiro Shibutani, Qiang Yu and Masaki Shiratori, A Study of Deformation Mechanism during Nanoindentation Creep in Tin-based Solder Balls, Journal of Electronics Packaging (Trans. of ASME), Vol. 129, No. 1, pp , ( submitted: accepted).

3 10. Tadahiro Shibutani, Qiang Yu, Takuma Yamashita and Masaki Shiratori, Stress-induced Tin Whisker Initiation under Contact Loadings, IEEE Trans. of Electronics Packaging & Technology, Vol. 29, No. 4, pp , ( submitted; accepted). 11. Tadahiro Shibutani, Qiang Yu and Masaki Shiratori, Evaluation of Diffusion Creep in Low Melting Point Materials by Nanoindentation Creep Test, JSME International Journal, Series A, Vol. 49, No.3, pp , Tadahiro Shibutani, Takayuki Kitamura and Masaki Shiratori, Effect of Grain Boundary/Interface Network on Cavity Growth Due to Atom Migration Induced by Stress and Electric Current in Polycrystalline LSI Conductor, Defect and Diffusion Forum, Vol. 249, pp , Jae Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe and Masaki Shiratori, The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints, Key Engineering Materials, Vol , pp , Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu and Masaki Shiratori, Evaluation of interface strength between thin films fabricated on a silicon substrate for an advanced LSI on the basis of fracture mechanics concept, Materials Science Forum, Vol , pp , Tadahiro Shibutani, Takayuki Kitamura and Futoshi Kawamura, Damage Process of Polycrystalline LSI Conductor Due to Atom Migration Induced by Electric Current and Stress International Journal of Damage Mechanics, Vol. 11, No. 2, pp , Takayuki Kitamura, Tadahiro Shibutani and Takashi Ueno, Crack initiation at free edge of interface between thin films in advanced LSI, Engineering Fracture Mechanics, Vol. 69, pp , Tadahiro Shibutani, Takayuki Kitamura, Ryuichi Ohtani, Creep Cavity Growth Under Interaction Between Lattice Diffusion and Grain Boundary Diffusion, Metallurgical and Materials Transactions, Vol.29A, pp , Proceedings: 1. Tadahiro Shibutani, Hyunseok Oh and Michael Pecht, " Precursor Monitoring Approach for Reliability Assessment of Cooling Fans", Proceedings on International Conference of Electronics Packaging (ICEP2009), pp , 2009 (Kyoto, Japan, April 15) 2. Tadahiro Shibutani and Qiang Yu, " Pressure Induced Tin Whisker Formation on SnCu Finish by Nanoindentation Creep", Proceedings of 10th Electronics Packaging & Technology Conference (EPTC), pp , 2008 (Singapore, Dec. 12).

4 3. Tadahiro Shibutani, Qiang Yu and Masaki Shiratori, Effect of Creep Properties on Pressure induced Tin Whisker Fromation, Proceedings of the Second International Conference on Secure System Integration and Reliability Improvement (SSIRI2008), pp , 2008 (Yokohama, Japan, July 14-17). 4. S. Mathew, M. Osterman, T. Shibutani, Q. Yu and M. Pecht, Tin Whiskers: How to Mitigate and Manage the Risks, Proceedings of the International Symposium on High Density Packaging and Microsystem Integration, pp.1-8, 2007 (Shanghai, China, June 26-28). 5. Qiang Yu, Tadahito Shibutani, Akifumi Tanaka, Takahiro Koyama and Masaki Shiratori, Low-cycle fatigue reliability evaluation for lead-free solders in vehicle electronics devices, Proceedings of the ASME InterPACK 2007, Interpack (CD-ROM), Satoshi Kondo, Qiang Yu, Tadahiro Shibutani, and Masaki Shiratori, Evaluation Method of Interaction Relation between Design Factors and Simple Assessment Approach for BGA Package Reliability, Proceedings of the ASME InterPACK 2007, No. Interpack (CD-ROM), Akihiko Tosaka, Qiang Yu, Tadahiro Shibutani, Satoshi Kondo and Masaki Shiratori, Reliability Evaluation of Lead Free Solder Joints Subjected to Multi-Loads, Proceedings of the ASME InterPACK 2007, Interpack (CD-ROM), Tadahiro Shibutani, Qiang Yu, Yoshitomo Fujisawa, Masaki Shiratori, Kazunori Tsurumi, Toshinori Ogashiwa, Masayuki Miyairi, Mechanical response of low-temperature sintered body consisting of clusters of submicron gold particles, Proc. of SPIE (Smart Materials IV), Vol. 6413, 64130P. 9. T. Yamashita,T. Shibutani,Q. Yu,and M. Shiratori, Study on Whisker Outbreak on Tin Plating by Contact Force, Proceedings of the 2006 ASME International Mechanical Engineering Congress and Exposition (IMECE2006), pp. 1-7 (IMECE ), 2006 (Chicago, USA). 10. Yu,Q.,Shibutani,T.,Kobayashi,Y. and Shiratori,M., The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting Standard, Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(ITherm 2006), pp , Fujisawa,Y.,Yu,Q.,Shibutani,T.,Tsurumi,K.,Ogashiwa,T. and Miyairi,M., Thermal Fatigue Reliability Evaluation for Micro-Sintered Compact Joints Made from Sub-Micron Gold Powder, Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(ITherm 2006), pp , Yu,Q.,Shibutani,T.,Jin,J.C.,Kondo,S. and Shiratori,M., Easy reliability design approach for solder joint BGA package considering correlation of each design factor, Proc. of

5 the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(ITherm 2006), pp , Tadahiro Shibutani, Qiang Yu and Masaki Shiratori, Evaluation of Creep Properties in Soldering Ball by Nanoindentation Creep, IMECE2005, Orland, 2005 (CD-ROM-IMECE ). 14. Do-seop Kim, Yusuke Yobayashi, Qiang Yu and Tadahiro Shibutani, Effect of Voids on Thermal Fatigue Reliability of Lead Free Solder Joint, InterPACK2005, San Francisco, 2005 (CD-ROM:IPACK ). 15. Tadahiro Shibutani, Qiang Yu, Masaki Shiratori and Takeshi Akai, Evaluation of Damage Process Near Interfaces During Nanoscratch Test, InterPACK2005, San Francisco, 2005 (CD-ROM:IPACK ). 16. Do-Seop Kim, Qiang Yu, Tadahiro Shibutani et al., Effect of Void Formation on Thermal Fatigue Reliability of Lead-Free Solder Joints, ITHERM2004, Las Vegas, pp , Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu and Masaki Shiratori, Evaluation of interface strength between thin films fabricated on a silicon substrate for mixed mode of fracture, ITHERM2004, Las Vegas, pp , Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu and Masaki Shiratori, Mechanism of Three-dimensional Interface Crack Initiation at the Corner in Cu Damascene Interconnects 1 st International Symposium of Micro & Nano Technology (ISMNT2004), Hawaii, pp.1-5, Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu and Masaki Shiratori, Evaluation of Interface Strength Between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the basis of Fracture Mechanics Concept, THERMEC2003, No.4, pp. 1-5, Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu, and Masaki Shiratori, Interface Strength between Sub-micron Thin Films in Opening and Sliding Delamination modes, IMECE2002, Tadahiro Shibutani, Qiang Yu, Masaki Shiratori and Takayuki Kitamura, Evaluation of Interface Strength between Thin Films in an LSI Based on Fracture Mechanics Concept, Stress-induced Phenomena in Metallization, Vol. 612, pp , Tadahiro Shibutani and Takayuki Kitamura, Stress-Induced Atom Transport Along Grain-Boundary/Interface Network in A Polycrystalline LSI Conductor, InterPACK'01, pp. 1-5 (CD-ROM), Tadahiro Shibutani and Takayuki Kitamura, Cavity Growth of Creep Cavity under Nabarro-Herring Creep, CREEP7, pp , Takayuki Kitamura and Tadahiro Shibutani, Cavity Growth Induced by Electric Current and Stress in LSI Conductor, 5-th Creep in Structures (IUTAM Symposium), pp , Takayuki Kitamura, Tadahiro Shibutani and Takashi Ueno, Evaluation of Interface Strength between thin films in an Advanced LSI, Field Analyses for Determination of Material

6 Parameters Experimental and Numerical Aspects (IUTAM Symposium), 2000.July 31st - August 4th, Abisko National Park, Kiruna, Sweden. 26. Takayuki Kitamura and Tadahiro Shibutani, Effect of Grain Boundary/Interface Network on Cavity Growth under Interacted Migration Induced by Stress and Electric Current, Stress Induced Phenomena in Metallization, pp , Takayuki Kitamura, Tadahiro Shibutani, Ryuichi Ohtani, Numerical Simulation on Cavity Growth under Interaction between Interface Diffusion and Lattice Diffusion in an LSI conductor, Stress Induced Phenomena in Metallization, pp , April 21, 2010