B-IS400 IS420/3 IS400 IS420 PCL370HR. Temperature resistant mid and high T g - base materials with low z-axis expansion CAF ENHANCED

Transcription

1 J B-IS4 IS42/3 IS4 IS42 PCL37HR Temperature resistant mid and high T g - base materials with low z-axis expansion CAF ENHANCED

2 Temperature-resistant base materials with low z-axis expansion IS4, IS42 and PCL37HR The demands relating to the reliability of printed circuit boards are increasing. Major influences besides the actual layout and design are the thermal attributes of the base materials such as the glass transition temperature T g, time to delamination at 26 C (T 26 ) and 288 C (T 288 ) thermal decomposition temperature (T D ) and the thermal expansion behaviour in the z-axis. In many cases the reliability of printed circuit boards is determined by destructive tests, especially in automobile applications. Typical terms are: -4 C up to +125 C/> 5 cycles or -4 C up to +14 C/ 1. cycles. It has been demonstrated that only base materials with a low expansion in the z-axis are able to pass these tests. The base material qualities IS4, IS42 and PCL37HR comply with these requirements without restrictions. For predictable reliability of printed circuit boards these materials offer excellent performance in order to prevent barrel cracks, corner cracks, resin recession and other failure mechanisms. Typical Applications High layer count multilayers Industrial electronics Automobile electronics Fine-line structures High temperature electronics IS4 Special properties IS4 Standard Prepregs High thermal resistance: T g approx. 15 C T 26 > 6 min T 288 > 5 min T D approx. 33 C Low z-axis expansion α z = 4-45 RT-12 C TCT > 1. cycles/- 4 C up to +14 C Low absorption of water Smooth surface Dimensionally stable CAF-enhanced IS42 Special properties High thermal resistance: T g approx. 165 C T 26 > 6 min T 288 > 15 min T D approx. 34 C Smooth surface Dimensionally stable CAF-enhanced Low z-axis expansion α z = 35-4 RT-12 C TCT > 3. cycles/- 4 C up to +14 C Type Resin content Viscosity Gel time Scaled flow % Pa s s mm/prepreg 16 FZ1 74 ± 3 38 ± 1 7 ± ±.5 18 FZ1 65 ± 3 38 ± 1 7 ± ± FZ1 53 ± 3 38 ± 1 7 ± 15 n/a 2125 FZ1 55 ± 3 38 ± 1 7 ± 15 n/a 7628 FZ1 46 ± 3 38 ± 1 7 ± 15 n/a IS4 Standard Laminate Thickness Nominal Thickness tolerance Mean resin Construction thickness IPC-411B cl. B IPC-411B cl. C content.1.4 ±.18 ± x ±.25 ± x ±.25 ± x ±.38 ± x 7628M.25.1 ±.38 ± x ±.5 ± x ±.5 ± x 7628M ±.64 ± x 7628M ±.64 ± x 7628M.9.35 ±.1 ± x 7628M Low absorption of water Nominal thickness Thickness tolerance Mean resin IPC-411B cl. L IPC-411B cl. M content ±.13 ±

3 Comparison of expansion in z-direction Raw materials height (%) IS4 ML IS41 IS42 Standard Prepregs IS42/PCL37HR Prepreg type Resin content Viscosity Gel time Scaled flow % Pa s s mm/prepreg ± 3 3 ± 15 8 ± 2.48 ± ± 3 3 ± 15 8 ± 2.58 ± ± 3 3 ± 15 8 ± 2.81 ± ± 3 3 ± 15 8 ± 2.99 ± ± 3 3 ± 15 8 ± ±.8 IS42 Standard Laminate Thicknesses Nominal Thickness tolerance Mean resin Construction thickness IPC-411B cl. B IPC-411B cl. C content.75.3 ±.18 ± x ±.18 ± x ±.25 ± x ±.25 ± x ±.38 ± x 7628M.25.1 ±.38 ± x ±.5 ± x ±.5 ± x ±.64 ± x ±.64 ± x ±.1 ± x 7628 The same types of E-glass-fabric are used as for all our base materials. Typical copper foil thicknesses (18, 35, 7 µm) correspond to IPC-4562, grade 3 (HTE-quality). For laminates with a substrate.1 mm VLP foils with HTE properties are used. Laminates are only available with double sided copper cladding. Supply forms and storage The laminates are produced in standard sheet size: 1225 x 17 mm warp. Prepregs are available with a standard roll width of approx. 125 mm (location oriented). Laminate and prepreg panels are cut to specification. For pin-lam technology, tooling holes are punched in the prepreg panels as specified. A variety of punch tools are available for this purpose. The prepregs can be stored for six months at < 5 C or for three months at < 2 C and relative humidity of < 5 %. When removing chilled product from storage, take appropriate steps to prevent condensation. Nominal thickness Thickness tolerance Mean resin IPC-411B cl. L IPC-411B cl. M content ±.13 ± Current product information can also be obtained from our website 3

4 PCL37HR Special properties High thermal resistance: T g approx. 17 C T 26 > 6 min T 288 > 1 min T D approx. 34 C Low z-axis expansion α z = 35-4 RT-12 C TCT > 1. cycles/- 4 C up to +14 C Low absorption of water Smooth surface Dimensionally stable CAF-enhanced PCL37HR Standard Prepregs Type Resin content Viscosity Gel time Scaled flow % Pa s s mm/prepreg ± 3 35 ± 15 8 ± 2.48 ± ± 3 35 ± 15 8 ± 2.58 ± ± 3 35 ± 15 8 ± 2.81 ± ± 3 35 ± 15 8 ± 2.99 ± ± 3 35 ± 15 8 ± ±.8 PCL37HR Standard Laminate Thickness Nominal Thickness tolerance Mean resin Construction thickness IPC-411B cl. B IPC-411B cl. C content.75.3 ±.18 ± x ±.18 ± x ±.25 ± x ±.25 ± x ±.38 ± x 7628M.25.1 ±.38 ± x ±.5 ± x ±.5 ± x ±.64 ± x ±.64 ± x ±.1 ± x 7628M Nominal thickness Thickness tolerance Mean resin IPC-411B cl. L IPC-411B cl. M content ±.13 ±

5 Processing Recommendations IS42 and PCL37HR should be pressed for 12 minutes at 19 C and IS4 for 7 minutes at C to assure a complete curing of the resin matrix. A post baking of the laminates is not required. We recommend to use copper foil of the type HTG for the multilayer production. As with all filled base materials adapted drill parameters are essential. Cross Sections Hole diameter.35 mm after 3x reflow, 1. thermal cycles -4/+14 C. Recommended press parameters IS4 Hydraulic vacuum press ADARA press spec. pressure (bar) C temperature hold for 7 min Transfer to cooling press time (min) 25 2 temperature spec. pressure (bar) 15 pressure (spec.) time (min) Recommended press parameters IS42/PCL37HR Hydraulic vacuum press ADARA press spec. pressure (bar) C temperature Transfer to 18 hold for 12 min 16 cooling press Hot start 19 C 2 bar pressure (spec.) time (min) spec. pressure (bar) 25 temperature 2 pressure (spec.) time (min) 5

6 Technical Values IS4 Specification Sheet #: IPC-411B/97 Reinforcement: woven E-glass Resin system: primary: difunctional epoxy secondary: multifunctional epoxy Flame Retardant Mechanism: brominated epoxy resin minimum requirement: V- Fillers: inorganic filler ID Reference: UL/ANSI: FR-4 RoHS-compliant Glass Transition Temperature (T g ): 11 C 15 C Explanations: C = preconditioning in humidity chamber E = preconditioning at temperature The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in C and with the third digit the relative humidity. Properties Units Laminate thickness <.5 mm Laminate thickness.5 mm Specification Isola-Value Specification Isola-Value 1. Peel Strength, minimum A. Low profile copper foil and very low profile profile copper foil all copper weights >17 µm N/mm.7 n/a*.7 n/a* B. Standard profile copper foil (35 µm) 1. After thermal stress N/mm.8 > > At 125 C N/mm.7 > 1..7 > After process solutions N/mm.55 > > 1.4 C. All other foil composite N/mm n/a* n/a* n/a* n/a* 2. Volume Resistivity, minimum A. C-96/35/9 MΩ cm n/a* n/a* B. After moisture resistance MΩ cm n/a* n/a* C. At elevated temperature E 24/125 MΩ cm Surface Resistivity, minimal A. C-96/35/9 MΩ n/a* n/a* B. After moisture resistance MΩ n/a* n/a* C. At elevated temperature E 24/125 MΩ Moisture Absorption, maximum % n/a* n/a*.8.1** 5. Dielectric Breakdown, minimum kv n/a* n/a* MHz, maximum (Laminate or prepreg as laminated) Loss 1MHz, maximum (Laminate or prepreg as laminated) Flexural Strength, minimum A. Length direction N/mm 2 n/a* n/a* B. Cross direction N/mm 2 n/a* n/a* Flexural Elevated Temperature, length direction, minimum N/mm 2 n/a* n/a* n/a* n/a* 1. Thermal Stress at 288 C, minimum A. Unetched s B. Etched s Electric Strength, minimum (Laminate or prepreg as laminated) kv/mm 3 42 n/a* n/a* 12. Flammability class V- V- V- V- 13. Glass Transition Temperature (T g ) DSC C Coefficient of Thermal Expansion (CTE) TMA Fill direction (below T g / above T g ) ppm/k 15/12 Warp direction (below T g / above T g ) ppm/k 12/5 Vertical (below T g / above T g ) ppm/k 45/22 Tests are carried out in accordance with IPC-65 test methods. *not applicable **measured at 1.55 mm laminate 6

7 Technical Values IS42 Specification Sheet #: IPC-411B/98 Reinforcement: woven E-glass Resin system: primary: epoxy secondary: multifunctional epoxy Flame Retardant Mechanism: brominated epoxy resin minimum requirement: V- Fillers: inorganic filler ID Reference: UL/ANSI: FR-4 ANSI: FR-4/98 RoHS-compliant Glass Transition Temperature (T g ): 15 C 2 C Explanations: C = preconditioning in humidity chamber E = preconditioning at temperature The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in C and with the third digit the relative humidity. Properties Units Laminate thickness <.5 mm Laminate thickness.5 mm Specification Isola-Value Specification Isola-Value 1. Peel Strength, minimum A. Low profile copper foil and Very Low Profile copper foil all copper weights >17 µm N/mm.7 n/a*.7 n/a* B. Standard profile copper foil (35 µm) 1. After thermal stress N/mm At 125 C N/mm After process solutions N/mm C. All other foil composite n/a* n/a* n/a* n/a* 2. Volume Resistivity, minimum A. C-96/35/9 MΩ cm 1, 1 6 2,6 1 7 n/a* n/a* B. After moisture resistance MΩ cm n/a* n/a* 1, 1 4 6,5 1 7 C. At elevated temperature E 24/125 MΩ cm 1, 1 3 1, , 1 3 2, Surface Resistivity, minimum A. C-96/35/9 MΩ 1, 1 4 2,9 1 6 n/a* n/a* B. After moisture resistance MΩ n/a* n/a* 1, 1 4 1,1 1 6 C. At elevated temperature E 24/125 MΩ 1, 1 3 3, , 1 3 1, Moisture Absorption, maximum % n/a* n/a*.8.8** 5. Dielectric Breakdown, minimum kv n/a* n/a* MHz, maximum (Laminate or prepreg as laminated) Loss 1MHz, maximum (Laminate or prepreg as laminated) Flexural Strength, minimum (as of.79 mm thickness) A. Length direction N/mm 2 n/a* n/a* B. Cross direction N/mm 2 n/a* n/a* Flexural Elevated Temperature, length direction, minimum N/mm 2 n/a* n/a* n/a* n/a* 1. Thermal Stress at 288 C, minimum A. Unetched s B. Etched s Electric Strength, minimum (Laminate or prepreg as laminated) kv/mm 3 4 n/a* n/a* 12. Flammability class V- V- V- V- 13. Glass Transition Temperature (T g ) DSC C Coefficient of Thermal Expansion (CTE) TMA Fill direction (below T g / above T g ) ppm/k 15/12 Warp direction (below T g / above T g ) ppm/k 12/5 Vertical (below T g / above T g ) ppm/k 4/2 Tests are carried out in accordance with IPC-65 test methods. *not applicable **measured at 1.55 mm laminate Our information and our eventual advice for the application of our products in any form (for instance oral, written or by tests) is given carefully and by the best of our knowledge but is not binding and is provided without making any representation or warranty, expressed or implied, and without any liability. The user is not released also in the case of our prior testing or if the use is based on our practical application advice from it s sole responsibility to use our product and to insure the correct application, the condition and fitness of our product for this application as well as the condition and fitness of the product itself. 7

8 Technical Values PCL37HR Specification Sheet #: IPC-411B/98 Reinforcement: woven E-glass Resin system: primary: epoxy secondary: multifunctional epoxy Flame Retardant Mechanism: brominated epoxy resin minimum requirement: V- Fillers: inorganic filler ID Reference: UL/ANSI: FR-4 ANSI: FR-4/98 RohS-compliant Glass Transition Temperature (T g ): 15 C 2 C Explanations: C = preconditioning in humidity chamber E = preconditioning at temperature The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in C and with the third digit the relative humidity. Properties Units Laminate thickness <.5 mm Laminate thickness.5 mm Specification Isola-Value Specification Isola-Value 1. Peel Strength, minimum A. Low profile copper foil and Very Low Profile copper foil all copper weights >17 µm N/mm.7 n/a*.7 n/a* B. Standard profile copper foil (35 µm) 1. After thermal stress N/mm At 125 C N/mm After process solutions N/mm C. All other foil composite n/a* n/a* n/a* n/a* 2. Volume Resistivity, minimum A. C-96/35/9 MΩ cm 1, 1 6 2,6 1 7 n/a* n/a* B. After moisture resistance MΩ cm n/a* n/a* 1, 1 4 6,5 1 7 C. At elevated temperature E 24/125 MΩ cm 1, 1 3 1, , 1 3 2, Surface Resistivity, minimum A. C-96/35/9 MΩ 1, 1 4 2,9 1 6 n/a* n/a* B. After moisture resistance MΩ n/a* n/a* 1, 1 4 1,1 1 6 C. At elevated temperature E 24/125 MΩ 1, 1 3 3, , 1 3 1, Moisture Absorption, maximum % n/a* n/a*.8.8** 5. Dielectric Breakdown, minimum kv n/a* n/a* MHz, maximum (Laminate or prepreg as laminated) Loss 1MHz, maximum (Laminate or prepreg as laminated) Flexural Strength, minimum (as of.79 mm thickness) A. Length direction N/mm 2 n/a* n/a* B. Cross direction N/mm 2 n/a* n/a* Flexural Elevated Temperature, length direction, minimum N/mm 2 n/a* n/a* n/a* n/a* 1. Thermal Stress at 288 C, minimum A. Unetched s B. Etched s Electric Strength, minimum (Laminate or prepreg as laminated) kv/mm 3 4 n/a* n/a* 12. Flammability class V- V- V- V- 13. Glass Transition Temperature (T g ) DSC C Coefficient of Thermal Expansion (CTE) TMA Fill direction (below T g / above T g ) ppm/k 15/12 Warp direction (below T g / above T g ) ppm/k 12/5 Vertical (below T g / above T g ) ppm/k 4/225 Tests are carried out in accordance with IPC-65 test methods. *not applicable **measured at 1.55 mm laminate USA EUROPE ASIA 7/ Isola USA S.a.r.l. (Headquarters) 31 W. Ray Road, Suite 31 Chandler, AZ 85226, USA Phone: +1/4 8 / Fax: +1/4 8 / info@isola-usa.com Isola GmbH Düren Germany Phone: +49 () 24 21/ 8 8 Fax: +49 () 24 21/ info-dur@isola-group.com MAS Italia s.r.l. Via S. Sebastiano 21 I-5132 Bottegone (PT) Phone: +39 / 5 73 / Fax: +39 / 5 73 / info-bot@isola-group.com Isola Fabrics s.r.l. Via Matteotti, 12 I-247 Brugherio (MI) Phone: +39 / 39 / Fax: +39 / 39 / info@isola-fabrics.com Isola Asia Pacific (Hong Kong) Ltd. Unit , 35/F No. 1 Hung To Road, Kwun Tong, Kowloon, Hong Kong Phone: / Fax: / asia@isola-group.com