MACDERMID ENTHONE ELECTRONICS SOLUTIONS BLACKHOLE/ECLIPSE

Transcription

1 MACDERMID ENTHONE ELECTRONICS SOLUTIONS BLACKHOLE/ECLIPSE DEC, 2016

2 OUTLINE Mechanism of Blackhole / Eclipse Blackhole / Eclipse process - Sequence - Process Equipment enhancement Performance test method Process Capability - General - Laminate types Latest Development - Eclipse LE Reliability data 2

3 MECHANISM OF BLACKHOLE / ECLIPSE PRE ETCH - OPTIONAL Nailhead : The most common type seen on small holes and flex material Nailheading Nailhead should be removed after before Carbon process Etch rate needed is around 0,35μ * Thickness of adsorption exaggerated for illustration 3

4 MECHANISM OF BLACKHOLE / ECLIPSE CONDITIONER + Conditioner wets the holes N N N N N Changes the surface charge of the substrate Electrostatic adsorption onto all surfaces of the panel * Thickness of adsorption exaggerated for illustration 4

5 MECHANISM OF BLACKHOLE / ECLIPSE CARBON TREATMENT HO HO Dispersant makes carbon particle miscible in aqueous solution and imparts a negative charge. Negatively charged particles are electrostatically adsorbed onto conditioned surfaces. * Thickness of adsorption exaggerated for illustration 5

6 MECHANISM OF BLACKHOLE / ECLIPSE MICROCLEAN Carbon particles removed from all copper surfaces only Etch * Thickness of adsorption exaggerated for illustration 6

7 BLACKHOLE / ECLIPSE PROCESS SEQUENCE Repeat for double pass Pre- Etch Cleaner / Conditioner Rinse Carbon treatment Blow Off / Dry Microclean Rinse Antitarnish Rinse Dry Video clip : Blackhole double pass running 7

8 BLACKHOLE / ECLIPSE PROCESS PRE-ETCH H2SO4, H2O2 with G-5S or SPS Control : Etch rate, concentrations Dump : Every week Dwell time : 30~40 sec Temp varied to etch rate Immersion Etch rate : 0,35 μ 3X rinse rinses Auto dosing : optional 8

9 BLACKHOLE / ECLIPSE PROCESS CLEANER For standard process : Blackhole Cleaner, Eclipse Cleaner, Blackhole Cleaner-ESP For low etch process : Eclipse Cleaner LE, Eclipse LE-ESP Dwell time : 30~60 sec Temp : 50~57 Immersion (via flood recommended) Ultra sonic Control : ph, Normality Dump : 250SSF/gallon or ph below 9.6 9

10 BLACKHOLE / ECLIPSE PROCESS CONDITIONER For double pass : Blackhole AF Conditioner For single pass : Blackhole Coditioner SP Dwell time : 30~60 sec Temp : 21~57 Immersion (via flood recommended) Control : ph, Normality Dump : 250SSF/gallon or 3PSM 10

11 BLACKHOLE / ECLIPSE PROCESS CARBON TREATMENT For double pass : Blackhole AF Starter, Blackhole AF Replenisher For single pass : Blackhole SP Starter, Blackhole SP Replenisher Dwell time : 30~60 sec Temp : 32~35 Immersion (via flood recommended) Control : ph, Normality, solid % Dump : 1 year recommended Sponge roller recommended Inlet Outlet Sponge rollers 11

12 BLACKHOLE / ECLIPSE PROCESS BLOW OFF AND DRYER Contact time : 30 sec Temp : 75 +/- 5 C Maintenance / Cleaning : Every month 12

13 BLACKHOLE / ECLIPSE PROCESS MICROCLEAN H2SO4, H2O2 with G-5S SPS Dwell time : 30~60 sec Temp varied to etch rate Etch rate for standard process : 0,8~1,3μ Etch rate for LE process : 0,2~0,65μ Via flood and spray nozzles recommended Control : E/R, concentrations Auto dosing : recommended Dump : copper < 20g/L 13

14 EQUIPMENT ENHANCEMENT IMMERSION FLOOD BAR TYPE COMPARISON Recommended for micro vias and small holes. Fan Spray Nozzle Drilled Hole pipe Slit type bar Slash type bar Via Fluid Head Surface treatment Good Weak Best Uniformity Good Weak Hole treatment Bad Reasonable Worst Good best Pressure Highest High Lowest Low High Flowrate Lowest Low Highest High High 14

15 EQUIPMENT ENHANCEMENT EFFECTIVE CARBON REMOVING IN MICROCLEAN High performance spray nozzle Spray (surface) +Immersion (Hole) +spray (uniform) configuration (Recommended) Via head flood bar % good microvia circuits (continuity) 6 mil 4 mil 3 mil 6 mil 4 mil 3 mil Flood pipe Viaflood Top Bottom 15

16 PERFORMANCE TEST METHOD PROPAGATION RATE Hull cell sized test panels are processed through the Blackhole line These panels are electroplated in a Hull cell at 1 Amp for 10 minutes After each panel is processed the number of holes that have propagated is recorded As Is After Blackhole After copper plating Result 2.5 ASD 1.0ASD Excellent > 6 > 5 Good 5 to to 4.5 Average 4 to to 3.5 Below Average 3 to to 2.5 Poor < 3 < 2 16

17 CAPABILITY GENERAL 10:1 and higher PTH capability Interconnect reliability equal to or exceeding electroless copper 1:1 and higher microvia capability 2:1 and higher controlled depth drill capability Thin copper foil capable - nailheading issues Passes IPC class 3 and Military 55110G specifications 17

18 CAPABILITY LAMINATE TYPES BT Ceramic Filled Cyanate Ester Duroid FR-4 FR-5 Flex Acrylic Adhesive Epoxy Adhesive Adhesiveless Halogen free Hitachi MCL BE-67 Pb Free Isola 410 Polyclad 370 HR Polyimide PTFE Speed board Other exotic materials Ceramic filled 6X SS BT Isola 406 Duroid 18

19 ECLIPSE LE ECLIPSE CLEANER LE / ECLIPSE CLEANER LE-ESP IR copper baseline IR spectra of copper after Eclipse Cleaner LE Eclipse LE Cleaner / Ecipse Cleaner LE-ESP performs 3 functions : Cleans mild oils/dirt from the substrate Wets the holes Selectively coats the copper with a sacrificial coating 19

20 ECLIPSE LE ECLIPSE MICROCLEAN LE H 2 SO 4, H 2 O 2 based etch Control etch rate (0.2~0.6um) Effectively removes carbon from the surface and inner-layers No equipment changes required No pre-dip required prior to etch No special rollers required No changes to micro-clean module configuration 20

21 ECLIPSE LE RELIABILITY Standard process, 10μin (0.25um) etch Eclipse LE, 10μin (0.25um) etch Carbon Residues No carbon Residues ICD (Carbon post) CD (Carbon on corners) ICD (Carbon post) CD (Carbon on corners) Defects % Defects % 16/ / Defects % Defects % 0/ /

22 Clean Inner Layer IST 22 Layer :1 aspect ratio All interconnects clean 1 oz 1/2 oz

23 ECLIPSE LE RELIABILITY Eclipse LE process (10 μin, 0.25um) - 6 times solder 288 C - 17 micron innerlayer foil no negative etchback 23

24 CLEAN CAPTURE PAD OF MICRO-VIA Etch rate 0.3micron SEM Top View Whole image of via hole Carbon on glass fiber Via bottom - clean etched copper

25 LOW ETCH ON MLFPC

26 THROUGH HOLE IST DATA Coupon Pre - condition P% S% Cycles Failuer Mode N/A N/A N/A N/A N/A N/A 1 and 4 Calumet 2 and 5 Eclipse LE plated@ Calumet 3 and 6 Eclipse LE CT Precondition Cycled from ambient to 150ºC No difference between electroless copper (M-85) and Eclipse LE.

27 CARBON BASED TECHNOLOGIES IST RELIABILITY (THROUGH HOLES) IST Coupon number : GP60001A Laminate type : Isola 370HR Coupon thickness : Layer count : 12, 1-oz I/L in every hole Holes sizes : 15 mil & 10 mil All panels were drilled and De-smeared at one account. All the IST coupons were pre-cycled at 240 three times to simulate the assembly process. The IST equipment was set to cycle between 25 C and 150 C (3 minutes heating and 2 minutes cooling) and to run to a 10% change in resistance or 1000 cycles whichever occurred first. 27

28 CARBON BASED TECHNOLOGIES IST RELIABILITY (THROUGH HOLES) Carbon based process performs as well as, or better than, the electroless copper processes. Review and comparison of historical IST data (N>11,000) provided by PWB Interconnect corroborate these findings. MacDermid Enthone has hundreds of accounts running carbon based direct metallization 28

29 CARBON BASED TECHNOLOGIES IST RELIABILITY (MICROVIAS) Material: 10 Layer Polyclad 370 Blind Microvias: 4x4, 5x4, 6x4 Plating Baths: Via Plate, Via Fill, Pulse Test 1: Precondition 6X, 230C Cycle 1000X to 150C No failures Test 2: No Precondition Cycle 500X to 210C Several barrel failures No separation at target pad Delamination of board Test 2

30 CONCLUSION Production Proven: over 220 accounts Over m² processed per day Over m² processed per day for Automotive Reliability equal to or surpasses conventional electroless copper High technology capable Confirmed reliability from independent testing