1 1. Scope This specification applies to the high current type SMD inductors for C3-1005L-Series to be delivered to user. 2. Product Identification C L P - T (1) (2) (3) (4 ) (5) (6) (1) Product name (2) Shapes and dimensions (3) Shielding Type (4) Inductance L 602: 6.0 mh (5) Number of Line 2P:2-Line (6) Taping Type 2P:2-Line SPECIFICATION 3. Shapes and Dimensions [Dimensions in mm] A:16.0±0.5 mm B:14.0±0.5 mm C:8.5 Max.mm D:8.6 Typ. mm E:13.5 Typ. mm
2 3-1 Schematic 4. Electrical Characterisitics 4-1 Electrical Spec. Part Number Inductance L(mH) (L1,L2) Min. L Test Frequency SRF MHz typ. Resistance RDC(Ω) (L1,L2) Max. RATED DC CURRENT (A) Max KHz/0.25V Test insturments: L:HP 4284A PRECISION LCR METER(or equivalent) RDC:CHROMA MODEL MILLIOHMMETER(or equivalent) 2. Rated current: Based on temperature rise ( T: 40 Typ.) 4-2 Material List No. Item 1 Core 2 Wire 3 Solder 4 Adhesive 5 Case 6 PCB Description & Type Alloy powder core Magnet wire Sn99.3%/Cu0.7% Epoxy Resin LCP FR4
3 5.Reliability Test CMF1005L-Series: Operating temperature : -40 to +125 Item Solderability Specifications The product shall be connected to the test circuit board by the fillet(the height is 0.2mm) Storage temperature : -40 to +125 Test conditions Apply cream solder to the printed circuit board. Resistance to Soldering heat(reflow soldering) There shall be no damage or problems. Temperature profile of reflow soldering Terminal strength The terminal electrode and the ferrite must not be damaged. The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. Soldering a chip to a test substrate, and then laterally apply a load 9.8N in the arrow direction. Strength on PC board bending The terminal electrode and the ferrite must not damaged. Solder a chip to test substrate and then apply a load.
4 Item Specifications Test conditions High After the samples shall be soldered onto the test circuit board, temperature resistance Humidity resistance Thermal shock Low temperature resistance Vibration resistance on the specification shall Temperature : +85±2 be met. The terminal electrode and Applied voltage: rated voltage Applied current: rated current Testing time: 500±12 hours Measurement : After placing for 24 hours min. resistance on the specification shall Temperature : +60±2, humidity: 90 to 95%RH be met. The terminal electrode and Applied voltage: rated voltage resistance on the specification shall be met. The terminal electrode and the ferrite must no damaged. Applied current: rated current Testing time: 500±12 hours resistance on the specification shall Temperature : -40±2 Measurement : After placing for 24 hours min. be met. The terminal electrode and Testing time: 500±12 hours Frequency: 10 to 55 Hz resistance on the specification shall Amplitude: 1.52 mm be met. The terminal electrode and Dimensions and times: X, Y and Z directions for 2 hours Measurement : After placing for 24 hours min. After the samples shall be soldered onto the test circuit board, After the samples shall be soldered onto the test circuit board, After the samples shall be soldered onto the test circuit board, each.
5 Item Specifications Test conditions Solderability New solder more than 75% Flux(rosin, isoprophl alcohol) shall be coated over the whole of the sample before hard, the sample shall then be preheated for about 2 minutes in a temperature of 130~150 and after it has been immersed to a depth of 1.5mm below for 3±0.2 seconds fully in molten solder with a temperature of 245±2. More than 75% of the electrode sections shall be covered with new solder smoothly when the sample is taken out of the solder bath.
6 6.Packaging The packaging must be done not to receive any damage during transporting and storing 6-1 Carrier Tape dimensions(mm) 6-2 Reel dimensions(mm) 6-3 Tape dimensions & direction(mm)
7 6-4 Packing Quantity 300 pcs/reel The products are packaged so that no damage will be sustained. 7. Recommended Soldering Conditions (Please use this product by reflow soldering) 7-1 Recommended Footprint unit:mm