Materials Declaration Form

Transcription

1 Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics Response Date * Contact Name * Authorized Representative * Giovanni Giacopello Representative Title Representative Phone * Refer to Supplier Comment section Representative * Supplier Comment Refer to Supplier Comment section Online Technical Support - STMicroelectronics : Refer to Supplier Comment section IPD - SPG MD CHAMPION Refer to Supplier Comment section Uncertainty Statement While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents. Legal Statement Supplier Acceptance * true Legal Declaration * Standard Legal Statement Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier s liability and the Company s remedies for issues that arise regarding information the Supplier provides in this form.

2 Product Mfr Item Number Mfr Item Name Version Mfr Site Date SP1ML-915 A0ZX-SG1H002 A MICROTEL Amount UoM Unit type ST ECOPACK Grade mg Each ECOPACK 2 Manufacturing information J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles after 168 hrs of floor life, may be done bulk Solder Termination Terminal Plating Terminal Base Alloy Comment ting is used or other bulk termainati Nickel/Gold (Ni/Au) Package Designator Size Nbr of instances Shape Comment

3 QueryList : ROHS directive 2011/65/EU _ July 2011 Query 1 - Product(s) meets EU RoHS requirement without any exemptions 2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply) 3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s) 4 - Product(s) does not meet EU RoHS requirements and is not under exemptions Exemption Id. Description 7c-I Response false Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound false true false QueryList : REACH-15th June 2015 Query Response 1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product true

4 Material Composition Declaration Mfr Item Name A0ZX-SG1H Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in homogeneous material (ppm) Concentration in product (ppm) STM32L151RBH6 Other inorganic materials mg supplier silicon die Silicium (Si) mg supplier die metallization Aluminium (Al) mg 31 3 supplier die metallization Copper (Cu) mg supplier die metallization Titanium (Ti) mg 63 6 supplier die metallization Tantalum (Ta) mg supplier die metallization Nickel (Ni) mg 47 4 supplier core+ fiber glass Bismaleimide (B) mg supplier core+ fiber glass Triazine (T) mg supplier core+ fiber glass Fiber glass mg supplier core+ fiber glass metal hydroxide mg supplier core+ fiber glass Zinc hydroxide mg supplier core+ fiber glass Thermosetting resin proprietary mg supplier core+ fiber glass Calcium sulfate mg supplier solder mask Baryum sulfate mg supplier solder mask (2-methoxymethylethoxy)propanol mg supplier solder mask Talc containing no asbestiform fibers mg supplier solder mask Quartz mg supplier solder mask Acrylates derivative mg supplier solder mask aromatic hydrocarbon proprietary mg supplier solder mask amine compound proprietary mg supplier coating Copper (Cu) mg supplier coating Nickel (Ni) mg supplier coating Gold (Au) mg supplier glue or tape Silver (Ag) mg supplier glue or tape Epoxy Cresol Novolak mg supplier glue or tape 1-isopropyl-2,2-dimethyltrimethylene diisobuty mg 63 6 supplier Bonding wire Gold (Au) mg supplier Moulding Compound Biphenyl epoxy resin mg supplier Moulding Compound Phenol resin mg supplier Moulding Compound Quartz mg supplier Moulding Compound Silica, vitreous mg supplier Moulding Compound Carbon Black mg supplier Moulding Compound Magnesium dihydroxide proprietary mg supplier solder Tin (Sn) mg SPIRITQTR Other inorganic materials mg supplier solder Silver (Ag) mg supplier solder Copper (Cu) mg supplier solder Nickel (Ni) mg 16 1 supplier Lead/Lead Compounds Lead mg 16 1 supplier Silicon Die Silicon (Si) mg supplier metallization Aluminium (Al) mg supplier passivation Silicon Nitride (SiN) mg supplier passivation Silicon Oxide(SiO2) mg supplier Alloy Copper (Cu) mg supplier Alloy Iron (Fe) mg supplier Alloy Phosphorous (P) mg supplier Alloy Zinc (Zn) mg supplier Plating Nickel(Ni) mg supplier Plating Palladium mg supplier Plating Gold mg 23 1 supplier Plating Silver mg 23 1 supplier Glue Phenolic Polymer Resin, Epikote mg supplier Glue Ag mg supplier Glue Acrylate resins Proprietary mg supplier Glue P-Tertbutylphenyl glycidyl ether mg supplier Glue 1-cyanoguanidine mg 45 3 supplier Wire Gold (Au) mg supplier Molding compound Epoxy Resin Proprietary mg supplier Molding compound Phenol Resin Proprietary mg BALF-SPI-01D3 Other inorganic materials mg supplier Molding compound Silica(Amorphous) mg

5 supplier Molding compound Other bismuth compounds mg supplier Molding compound Carbon Black mg supplier Molding compound Other organic phosphorous compounds Proprietary mg supplier metallization Aluminium (Al) mg supplier metallization Copper (Cu) mg supplier metallization Gold (Au) mg supplier metallization Tantalum (Ta) mg supplier metallization Titanium (Ti) mg supplier glass coating Borosilicate glass mg supplier polymer die coating Polymer resist - Benzocyclobutene (BCB) mg supplier polymer die coating Polyethylene terephthalate mg supplier polymer die coating Silica, vitreous mg supplier polymer die coating Epoxy resin Proprietary mg supplier polymer die coating Acrylic polymer mg supplier polymer die coating Carbon black mg supplier UBM Copper (Cu) mg supplier UBM Titanium (Ti) mg supplier UBM Chromium (Cr) mg supplier UBM Nickel (Ni) mg supplier UBM Vanadium (V) mg supplier bump Tin (Sn) mg supplier bump Silver (Ag) mg supplier bump Copper (Cu) mg PCB Other Plastics & Rubber mg supplier alloy Copper (Cu) mg supplier substrate Epoxy resin mg supplier substrate Fiber glass mg supplier substrate Baruim sulfate mg supplier substrate Acrylated epoxy resin proprietary mg supplier metallization Nickel (Ni) mg supplier metallization Gold (Au) mg Crystal Other inorganic materials mg supplier metallization Iron (Fe) mg supplier metallization Nickel (Ni) mg supplier metallization Cobalt (Co) mg supplier metallization Manganese (Mn) mg supplier metallization Silicon (Si) mg supplier metallization Gold (Au) mg supplier metallization Tin (Sn) mg supplier Ceramic Aluminum oxide mg supplier Ceramic Manganese Oxide mg supplier Ceramic Silicon dioxide mg supplier Ceramic Molybdenum trioxide mg supplier Ceramic Magnesium oxide mg supplier Ceramic Molybdenum mg Antenna Other inorganic materials mg supplier Ceramics Aluminum oxide mg supplier Ceramics Silicon dioxide mg supplier Connection Silver (Ag) mg Inductor 1 Other inorganic materials mg supplier Outer electrode Silver (Ag) mg supplier glass coating Glass oxide mg supplier glass coating Silicon dioxide mg supplier Ceramic Iron(III) oxide mg supplier Ceramic Zinc oxide mg supplier Ceramic Nickel oxide mg supplier Ceramic Copper oxide mg supplier Ceramic Bismuth oxide mg supplier Inner electrode Silver (Ag) mg supplier Inner electrode Nickel (Ni) mg supplier Inner electrode Tin (Sn) mg Inductor 2 Other inorganic materials mg supplier Ceramics Aluminum oxide mg supplier Ceramics Silicon dioxide mg supplier Ceramics Calcium oxide mg supplier Copper plating Copper (Cu) mg

6 supplier Ceramics Calcium oxide mg supplier Copper plating Copper (Cu) mg supplier Other thermoplastics Polyester imide mg