Halogen-free CCL (D- Type)

Transcription

1 Halogen-free CCL (D- Type) D-Type 동박적층폴리이미드필름은 도레이첨단소재의첨단케미컬기술을기반으로개발한접착제를활용하여동박과폴리이미드필름을적층한할로겐프리연성인쇄회로기판 (FPCB) 용 3 층 CCL(Copper Clad Laminate) 입니다. TAK s copper clad polyimide film D-Type is a three layer CCL that laminates copper foil and polyimide film for FPCB. D- Type CCL is halogen-free and developed with the adhesives of TAK s advanced chemical technology. 특징 Feature 고굴곡성및미세피치대응 고신뢰성 높은납땜내열성 우수한접착강도 난연성 UL94 V-0 우수한전기적신뢰성 For high flexibility & fine pitch FPC High reliability Excellent solder heat resistance Excellent peel strength Flammability UL94 V-0 Excellent electrical reliability 구성 Structure Cu Foil Adhesive Polyimide Film Cu Foil Adhesive Polyimide Film Adhesive Cu Foil < Single Side CCL > < Double Side CCL > 제품규격 Specification Description Spec. PI Film(μm) Copper Foil(μm) Adhesive(μm) Width(mm) Length(m) 10/12.5/25 12/18/ / Halogen-free CCL (D-Type) / 01

2 Halogen-free CCL (D- Type) General Properties Item Test Condition 1/2mil PI 1/2oz HTE Double 9D2L-TM55 Competitor A Competitor B Remark 90 Peel Strength (N/cm) As received E-1/ JIS-C Acf Bonding (N/cm) AC FY-16 (Hitachi) Single side etching Double side etching TAK Method Solder Resistance ( ) 330, 1min, Floating Normal pass pass pass D-24/25 in H2O pass pass pass Limit Temp 1min, Floating (non etching) JIS-C TAK Method Manual Soldering 340 3sec Normal pass pass pass D-24/25 in H2O pass pass pass TAK Method Insulation Resistance (Ω) Initial, 500V JIS-C Migration 85/85/1,000, 50V Dimensional Stability (%) E-1.0/150 after etching MD TD JIS-C MIT L/S=1mm/1mm, R= Flexibility IPC L/S=1mm/1mm, R=2mm, 1,500rpm 37,000 33,000 30,000 - IPC L/S=0.10mm/0.13mm, R=2mm, 1,500rpm Above 10million Above 6million Above 8million - Flammability UL- 94 V-0 V-0 V-0 - Halogen-free CCL (D-Type) / 02

3 Halogen-free CL (C-Type) C-Type 폴리이미드커버레이필름은 도레이첨단소재의할로겐프리연성인쇄회로기판용보호필름입니다. TAK s polyimide coverlay film, C-Type is a protection film for FPCB which is designed as halogen -free. 특징 Feature 미세피치대응 고신뢰성 우수한납땜내열성 우수한저장안정성 높은접착강도 우수한전기적신뢰성 난연성 UL94 V-0 For fine pitch FPC High reliability Excellent solder heat resistance Excellent storage stability Excellent peel strength Excellent electrical reliability Flammability UL94 V-0 구성 Structure Polyimide Film Adhesive Release Paper 제품규격 Specification Description Spec. PI Film(μm) Adhesive(μm) Width(mm) Length(m) 12.5/25 15/18/25/30/50 250/ Halogen-free CL (C-Type) / 01

4 Halogen-free CL (C-Type) General Properties Item Test Condition 1/2mil PI 25μm ADH 9C1L-4S Competitor A Competitor B Remark 90 Peel Strength (N/cm) As received [H/P condition : 160 x 44kgf x 30min] C-24/40/ JIS-C E-3/ Solder Resistance ( ) Solder resistance [290 1min] OK OK OK After moisture absorption C-24/40/ JIS-C Dimensional Stability (%) MD TD JPCA-BM Insulation Resistance (Ω) Initial, 500V Migration with 3layer CCL 85/85/1,000, 50V JIS-C Chemical Resistance (N/cm) D-10min/23 HCl (2N) NaOH (2N) IPC-FC241 B232 Resin Flow (μm) [H/P condition : kgf 30min] TAK Method Flexibility MIT IPC With 3 layer CCL, R=0.38, 1mm/1mm With 3 layer CCL 4,600 4,100 4,700 Above 10million Above 10million 4.6 million - Storage Stability 1/2 life(hr, 45 ) > /2 life(day, 25 ) > Tg ( ) DMA , Flammability UL- 94 V-0 VTM-0 V-0 - Halogen-free CL (C-Type) / 02

5 Halogen-free White Coverlay White Coverlay 는 뛰어난신뢰성과반사효율로기존 White ink 가가지고있는크랙발생문제와도포작업성문제를해결한제품입니다. TAK s white coverlay has not only excellent reliability and reflectance efficiency but also excellent printability and crack problem resolved products from white ink. 특징 Feature 고굴곡성, 크랙방지특성 고반사율 우수한저장안정성 높은접착강도 난연성 UL94 V-0 High flexibility, anti-crack property High reflectance Excellent storage stability Excellent peel strength Flammability UL94 V-0 구성 Structure Protection Film /25 μm (PET)+10 μm (PSA)/Protection of White Layer White Layer 15μm / Reflecting Light from LED Polyimide Film 12.5 or 25μm / Substrate Adhesive 15 to 25μm / Adhesion to CCL Release Paper 130μm / Protection of Adhesive Name of layer Thickness / Function 제품규격 Specification Description Spec. PI Film(μm) Adhesive(μm) Width(mm) Length(m) 12.5/25 15/18/25/30/50 250/ Properties of White Coverlay General Properties Product TAK Test Method Item Test Condition White Coverlay PI/Adhesive 12.5 JIS-C Thickness(μm) Release Film Peel Strength (N/cm) As received [H/P condition : kgf 30min] 14.2 JIS-C Solder Resistance( ) 280 1min floating OK JIS-C Dimensional MD Stability(%) TD JIS-C Resin Flow(μm) [H/P conditon : kgf 30min] 130 TAK Method Curl(mm) TAK Method 2 TAK Method Flammability UL94 : Project Number 09CA63868 V-0 - Halogen-free White Coverlay / 01

6 Halogen-free White Coverlay General Properties 2. Properties of White Layer Property Item & Treatment Unit White Layer Test Method Optical Property Mechanical Property Chemical Property Thermal Property Electronic Property Thickness White layer μm 15 JIS-C Reflectance [AVE./550nm] Color value [L*a*b*] After hot press JIS-Z8722 After soldering test (Color-meter, N 社 SA-2000) days % C-240/40/ Thermal shock test After hot press 92.59/0.04/-1.22 After soldering test 92.37/-0.18/ days /-0.05/-1.36 C-240/40/ /-0.49/-1.15 Thermal shock test 92.40/0.01/-1.68 After hot press cycle JIS-C cycle After soldering test ASTM E313 Whiteness days [W] C-240/40/ Thermal shock test cycle After H/P H Surface hardness After reflow 5B ~ H JIS-K5400 [pencil hardness] 1~3 times After soldering test 5H H (280 ) After H/P OK After reflow Cross-cutting OK OK 1~3 times JIS-D0202 or After soldering test NG OK (280 ) Bending test After H/P OK TAK Method After H/P OK Chemical resistance After reflow OK or OK TAK Method with MEK 1~3 times After soldering test NG OK (280 ) MD ASTM D696 CTE (Coefficient of ppm/ thermal expansion ) Temp. range : TD ~200 Surface resistance Ω JIS-C Insulation resistance (max 5kV 60sec) - Dielectric constant - 1MHz : GHz : 2.43 IPC-TM-650 Halogen-free White Coverlay / 02

7 Lead Lock Tape RF-351ES RF-351ES 는 단면열경화성접착테이프입니다. 고온에대한우수한저항성을지녔으며구리 (Cu) 리드프레임에대한뛰어난접착력이있는리드프레임의리드고정용테이프입니다. 고온혹은높은전기적신뢰성을요구하는패키지에적합한리드고정용테이프입니다. RF-351ES is a single side thermosetting adhesive. It has outstanding thermal resistance and adhesion for copper type lead frame. This applies to lead locking for high reliability type package. 특징 Feature 낮은작업온도 우수한접착특성및전기적신뢰성 Wire Bonding 시공정안정성 우수한 CPO(Copper Peel Off) 안전성 Lower operation temperature Excellent adhesion property & electrical reliability Safety on wire bonding process Good CPO property 구성 Structure Cover Film : PET (38μm) Adhesive : Epoxy (20μm) Base Film : Polyimide (50μm) 제품규격 Specification Cover Film Adhesive Base Film Type Thickness(μm) Thickness(μm) Type Thickness(μm) PET Polyimide 50 Lead Lock Tape RF-351ES / 01

8 Lead Lock Tape RF-351ES General Properties Property Unit Condition/Value Method Electrical Reliability - Open (Nothing) Thermal Treat : 170 / 5hr HAST : 130 / 85% RH / 20V / 200hr Ion Impurity Na + K + ppm g of deionized water + 10g of tape after thermal processing Cl SO Thermal Processing : 175 / 1hr ph Extracted by PCT : 121 / 2atm / 20hr Conductivity μs /cm 33 Out Gas % 0.6 Weight Loss for 5hr at 175 CPO - Pass 310 / 5min Adhesive Strength g Taping Condition : / 10Kg / cm2 / 0.25sec Lead Frame : 40 PIN DIP Measured by Push Pull Gauge(Pushing) Lead frame Bleed Out μm Tape Bleed Out Young s Modulus Dyne/ cm X by DMA Taping after thermal processing was measured Thermal Processing : 175 / 1hr Lead Lock Tape RF-351ES / 02

9 Lead Lock Tape HL-150 HL-150 은 열경화성접착제가도포된단면폴리이미드테이프입니다. 합금 (Alloy) 용리드프레임에적용할수있도록개발되었으며, 내열성과접착력이우수합니다. 낸드플레시메모리패키지에적용가능한리드고정용테이프입니다. HL-150 is a single side polyimide tape coated with thermosetting adhesive. It has outstanding thermal resistance and adhesion for alloy type lead frame. This applies to lead locking for Nand Flash Memory. 특징 Feature 낮은온도에서 Wire Bonding 가능 우수한전기적신뢰성 우수한 CPO(Copper Peel Off) 안전성 리드프레임에높은접착력 Lower wire bonding temperature Excellent electrical reliability Good CPO property Higher adhesion on lead frame 구성 Structure Cover Film : PET(38μm) Adhesive : Epoxy (25μm) Base Film : Polyimide(25μm) 제품규격 Specification Cover Film Adhesive Base Film Type Thickness(μm) Thickness(μm) Type Thickness(μm) PET Polyimide 25 Lead Lock Tape HL-150 / 01

10 Lead Lock Tape HL-150 General Properties Property Unit Condition/Value Method Temp. ( ) Ad (g) Adhesion Strength g/cm ,200 1,700 2,050 Specimen : 10mm X 70mm Taping Tool : Hot Press Taping Condition : 10Kgf / X / 1sec ,250 1,700 Substrate : Copper Foil Measurement : Instron 180 1,800 Temp. ( ) RF (μm) Resin Flow (RF) μm ,260 1,280 Specimen : 10mm X 70mm Taping Tool : Hot Press Taping Condition : 30kgf / X / 10sec Substrate : Lead frame Measurement : Microscope 180 1,780 Ion Impurity 0.41 Na + NH4 + Cl - ppm Cure Condition : 175 / 1hr Measurement : Ion Chromatography SO ph Measurement : ph meter Thermal Decomposition Temp. > / min / Nitrogen Measurement : TGA Out Gas % 1.1 Weight Loss after 5hr at 175 Lead Lock Tape HL-150 / 02

11 QFN Masking Tape TQ-128P TQ-128P QFN 테이프는핫프레스방식으로리드프레임후면에부착되어 QFN 제조공정간몰드플러쉬를방지하는마스킹테이프제품입니다. 기존제품의 Wire-Bond 바운싱및 Warpage 취약점을개선하였으며플라즈마클리닝후테이프제거시점착제잔사가없는특징을자랑합니다. TQ-128P is attached to the backside of QFN lead frame by hot press machine in order to prevent EMC mold flush during EMC mold process while supporting firm die attach, wire bond process and removed easily with heat after the encapsulation, and left no adhesive residue on the lead frame or the EMC surface even after plasma cleaning process. TQ-128P features good wire-bondability and low warpage and applicable for various plasma cleaning methods. 특징 Feature 실리콘점착제미사용 우수한내열성 낮은점착온도로 Warpage 최소화 테이프박리용이및점착제잔사없음 Non-silicone type adhesive Excellent heat resistance Less warpage by low temperature taping Clean detaping with heat 구성 Structure Adhesive : Thermoplastic(3μm) Base Film : Polyimide(25μm) 제품규격 Specification Item Unit TQ-128P Thickness of Polyimide Film μm 25 Thickness of Adhesive Layer μm 3 Total Thickness μm 28 ± 4 (PI + Adhesive) Appearance - Amber colored film Width mm Required width ± 0.2 Length m Requested length Inside Diameter mm As requested Core Color - As requested Material - As requested QFN Masking Tape TQ-128P / 01

12 QFN Masking Tape TQ-128P General Properties Classification Adhesive Type Adhesion at Room Temperature TQ - 128P Thermoplastic None Structure (Adhesive / Film) 3/25 Lamination Condition 170 ~ 230 C, 2 ~ 6 MPa, 8 ~ 12 sec Hot Pressing 5% Weight Loss Temperature ( C ) > 400 Glass Transition Temperature ( C ) 112 Tensile Modulus (MPa) 4, 262 ± 215 Outgas (%) ± Detaping Temperature ( C) 160 ~ 180 Warpage (mm, model L/F, PPF, 8 mil) Peel Strength (N / m, model L / F, PPF, recommended lamination condition) Adhesive Residue (After detaping without chemical deflash) L / F Imprint* (After detaping) 220/170 C, Hot pressing Avg. < 0.1 After the lamination 117 on L / F on EMC L / F pattern Impressed on adhesive Void After the lamination *Good imprint indicates less probability of mold bleed-out or flush Excellent Good Nomal X Bad 공정프로세스 Production Process Lamination TQ-128P Die Attachment 175 max. 2hr Wire Bonding 220 max. 45 min Encapsulation min Tape Removal 160 ~ 180 TQ-128P TQ-128P TQ-128P QFN Masking Tape TQ-128P / 02

13 QFN Masking Tape EX-RE EX-RE 제품은 Die Attach 및 Wire Bonding 공정완료후 QFN 리드프레임에부착하는상온점착마스킹테이프입니다. 우수한 Wetting 성구현으로 Roll 및 Press type 라미네이션설비에공통적으로적용가능한제품입니다. 비실리콘계점착제적용으로실리콘전사위험을방지하였으며, 견고한 L/F 표면부착특성으로 EMC 몰드플러쉬특성을크게개선한제품입니다. QFN tape EX-RE is laminated on the backside of QFN lead frame to prevent mold flush during molding process. EX-RE is widely referred to Post tape which is attached on the lead frame after die attach and wire bonding process. Excellent wettability of EX-RE enables roll and dambar press machine lamination and acrylic rubber based adhesive guarantees no silicon contamination. Firm adhesion to lead frame minimizes mold flush defect. 특징 Feature 상온박리특성및점착제잔사없음 우수한점착제내열성 상온점착특성및다양한설비적용가능 RT detaping No additional deflash process require High thermal resistance Roll and dambar press lamination at room temperature 구성 Structure Cover Film : PET (38μm) Adhesive : Acrylic (6μm) Base Film : Polyimide (25μm) 제품규격 Specification Item Unit EX-RE Thickness of Polyimide Film μm Avg. 25 Thickness of Adhesive Layer μm Avg. 6 Total Thickness μm 31 ± 4 (PI + Adhesive) Appearance - One side of dark orange colored polyimide film and the other side of transparent polyester film Width mm Required width ± 0.1 Length m 50, 100, 150, 200, Lamination Condition Temperature C 25 Detaping Condition Temperature C 25 Lamination Condition - Wind tape with the cover film inside QFN Masking Tape EX-RE / 01

14 QFN Masking Tape EX-RE General Properties Tape Construction (μm) Adhesive Type Lamination Type Release Film Adhesive Base Film Acrylic/Rubber Roll & Dambar Press Lamination 38 (PET) 6 (Acrylic/Rubber) 25 (PI film) Peel Strength(180 peel 300mmpm) at RT(gf/25mm, copper) Acrylic 40~100 Rubber 20 Detaping Conditions RT 몰드플러쉬비교 Data(Mold Flush Comparison Data) Causes of Mold flush ppm and Glue ppm(fvi Result) Ref. tape EX-RE Mold Defression Tape Related FM Bubble Shifted Lead Glue Identified causes of mold flushes 공정프로세스 Production Process D/A and W/B Tape Attachment Encapsulation Tape Removal EX-RE Tape EX-RE Tape QFN Masking Tape EX-RE / 02

15 Package Spacer Tape TP Series TP Series 는 메모리카드및기타패키지제조용 Die attach 테이프로폴리이미드필름에양면접착제가도포된형태입니다. Silicon die 및 PCB 에대한높은접착력과우수한신뢰성을확보한제품으로현재 Micro SD Memory Card 제조에널리적용되고있습니다. TP Series is a double side polyimide tape coated with thermosetting adhesive. It has outstanding adhesion strength and reliability to die and PCB. It is widely applied to micro SD memory card. 특징 Feature 낮은접착온도및우수한전기적신뢰성 낮은 Out gas 우수한작업성확보 Lower bonding temperature & higher eletrical reliability Lower level of out gas Good workability 구성 Structure Cover Film : PET(50μm) Adhesive : Epoxy(12μm) Base Film : Polyimide (25μm or 50μm) Adhesive : Epoxy(12μm) 제품규격 Specification Item Unit Specification Thickness of Polyimide Film μm 25, 50 ± 2.5 Thickness of Adhesive Layer μm 12 ± 1.2(each side) Length Core Total Thickness μm 49, 75 ± 4.9 Appearance - None of harmful defects in practical use as follows 1)Unevenness, damage, alien substance Splice number 0 Width mm Required width ± 0.1 Width 10mm under 80~100 m Width 10mm over 250~285 Inside Diameter mm 77 ± 0.5 Color - Red Material - ABS Winding Method - Wind tape with the cover film inside or outside Package Spacer Tape TP Series / 01

16 Package Spacer Tape TP Series General Properties Property Unit Condition/Value Method Die Shear Strength kg 16.6 (RT) 175 / 1hr Cured Dage , Die Size : Ion Impurity Before Cure After Cure Na K + ppm ND ND Cure Condition : 175 / 1hr Measurement : Ion Chromatography Cl ph ph Meter Conductivity μs / cm Measurement : Ion Chromatography 2.79 (25 ) 3.79 (25 ) Storage Modulus GPa 1.88 (130 ) 2.67 (130 ) 1.75 (175 ) 2.38 (175 ) 153 (25 ) 191 (25 ) Cure Condition : 175 / 1hr by DMA Loss Modulus MPa 51.3 (130 ) 112 (130 ) 50.8 (175 ) 69.9 (175 ) Tg (PI Film + Adhesive) Moisture Absorption % 0.15 (Adhesive) 85 / 85%RH / 48hr 1.62 (PI Film) Package Spacer Tape TP Series / 02

17 FPCB 용 Carrier Film RCF Series RCF Series 는 FPCB 완제품운송중이물유입및스크래치방지, 외부충격으로부터제품을보호하기위한포장용 Carrier Film 입니다. 안정적인점착특성과비실리콘계점착제의사용을통해전사문제를완벽히해결하여고객에게다양한편의를제공하고있습니다. TAK s RCF series are speically designed for carrying complete FPCB, preventing scratch, the influx of foreign materials from outside and to minimize external shocks. It provides stable viscosity which is ideal for FPCB packing process. By using non-silicone type PSA TAK s RCF series can help solving residue & contamination issue. 특징 Feature FPCB 포장공정에적합한점착력 非오염및전사타입 - 非실리콘타입점착제사용 안정적인경시안정성확보 - 6개월보증 우수한전기적특성 Appropriate viscosity - Ideal property for FPCB packing process No contamination and residue from adhesive - Non-silicone type PSA Good storage life - No deterioration after aging - Stable over 6 months Excellent electrical reliability 구성 Structure Cover Film : PET (125μm) Adhesive : PSA (10μm) Release Film : PET(38μm) General Properties Item Unit RCF125A Product type RCF125B Base Film Thickness μm 125±2 125±2 Release Film Thickness μm 38±1 38±1 Total Thickness μm 178±4 178±4 Peel Strength g.inch 130±20 90±20 PSA Peel Off Residue Test Method ASTM D3652 TAK Method - Peel off speed : 50mm/min - Peel off angel : 90 - Peel off substrate : 1mil PI film Visual Residue Free Residue Free Room temperature peel off Elongation % > 70 > 70 Tensile Strength Kgf / cm > 8.5 > 8.5 ASTM D3759 Appearance - Transparent Transparent Visual Test Note : Above properties are typical and should not be used for any specification purpose FPCB 용 Carrier Film RCF Series / 01

18 FPCB 용 Carrier Film RCF Series 공정프로세스 General Process Flow 1 Slitting 5 Pre-Attaching 2 Drilling 6 Hot Pressing 3 Copper Plating 7 Post-Manufacturing 4 Etching 8 Final Inspection 적용 Application PET Seperator Acrylic Adhesive Base Film (PET) PET Seperator Coverlay CCL Acrylic Adhesive Base Film FPCB 용 Carrier Film RCF Series / 02