WIRE BOND CAPACITORS, RESISTORS & INTEGRATED PASSIVE COMPONENTS FOR CHIP & WIRE ASSEMBLY

Transcription

1 WIRE BOND CAPACITORS, RESISTORS & INTEGRATED PASSIVE COMPONENTS FOR CHIP & WIRE ASSEMBLY

2 ABOUT AVX COMPANY INFORMATION AVX is a leading international manufacturer and supplier of a vast portfolio of advanced electronic components, including: capacitors, inductors, filters, resistors, couplers, diodes, and circuit protection devices, as well as a broad range of innovative sensor, control, interconnect and antenna solutions. With 29 research, design, manufacturing, and customer support facilities in 16 countries around the world, AVX offers significant competitive advantages, including delivery and production capabilities optimized to suit each individual customer s just-in-time inventory requirements, and global engineering teams experienced in developing newto-market product solutions especially designed to fulfill customer s unique application requirements. AVX has successfully served the automotive, industrial, medical, military, consumer electronics, communications, and transportation markets for nearly 50 years. In the automotive sector, AVX actively contributes to the development of new safety, engine control, infotainment, and chassis control technologies. In the medical sector, advanced AVX products provide critical support for a wide range of implantable, life-supporting, treatment, imaging, and diagnostic devices, including pacemakers that regulate patients heartbeats, cochlear implants that provide audio input for the hearing-impaired, and diagnostic equipment that helps medical professionals identify and cure patients ailments. In the communications sector, our accomplished research and development (R&D) teams regularly anticipate needs and adapt and innovate products to support the explosive growth of next-generation technologies spanning smart phones and tablets to networks and data-centers. Backed by decades of in-depth R&D, AVX products also provide critical enabling support for a wide variety of green technologies designed to conserve existing energy resources and create dependable, affordable electronic systems capable of effectively harnessing renewable energy sources, such as wind, solar, and hydroelectric power. High-reliability AVX components are at the forefront of countless products that are helping to ensure that both this generation and generations to come will benefit from cleaner, greener technologies designed to preserve and protect the environment, ranging from clean power generation and conversion systems to hybrid and electric vehicles in the personal and commercial vehicle and mass transportation markets, including cars, trucks, trams, and trains. AVX has an abundance of patents, continues to invest heavily in R&D, and submits several new patent applications every year to further expand the company s strong technology base with newly innovated, next-generation product solutions. AVX is also committed to consistently exceeding customer expectations, and continuously satisfies that goal through the successful implementation of the company s corporate mission and vision statements. MISSION STATEMENT AVX will be recognized as the premier strategic partner for passive components, sensors, antennas, control modules and interconnect solutions in the electronic industry by providing products and technology that meet or exceed customer expectations for quality and reliability in a timely, cost-effective, efficient, and professional manner.

3 SINGLE LAYER CAPACITORS & ARRAYS GD, GH, GB SERIES, & ARRAYS Hybrid Circuits MMICs RFICs Optical communications Instrumentation Test Equipment Military Communications Equipment Decoupling wide band noise in high frequency systems DC Blocking close to semiconductor ICs GD Series: Highest dielectric constant of 60,000 GH Series: Dielectric constant from 14 to 30,000 GB Series: Bordered SLCs with dielectrics 14 to 30,000 Miniature Sizes 0.010x0.010 to 0.10x0.10 DIELECTRICS High dielectric constant for high capacitance values in miniature sizes Gold Terminations Wire Bondable MILITARY SPECIFICATIONS SERIES DIELECTRIC DIELECTRIC CONSTANT TEMPERATURE COEFFICIENT MIL REFERENCE PARAMETER METHOD OR PARAGRAPH GD Ultra-Maxi 60,000 +/- 15% GH/GB Maxi+ 30,000 +/- 15% GH/GB Maxi 20,000 +/- 15% GH/GB X7S 2,500-18,000 +/- 22% GH/GB X7R 1,100-4,200 +/- 15% GH/GB Temperature Compensating 200 ±7.5% (non-linear) ±500 ppm/ C ±1500 ppm/ C GH/GB NP ±30 ppm/ C Minimum size: x in. (0.229 x mm) Maximum size: Specified by the customer Nominal Thickness: to in. (0.114mm to 0.178mm) MIL-STD-883 Bond Strength MIL-STD-883 Shear Strength 2019 MIL-PRF Thermal Shock MIL-PRF MIL-PRF MIL-STD-202 Voltage Conditioning Temperature Coefficient Low Voltage Humidity A MIL-STD-202 Life Test 108 SAMPLE KITS SAMPLE KIT PN SERIES PARTS INCLUDED KITSLCK60KSAMPL KITSLCK20KSAMPL KITSLCK30KSAMPL KITSLCZDIESAMPL GD Series Dielectric Constant = 60,000 GH Series Dielectric Constant = 20,000 GH Series Dielectric Constant = 30,000 GH Series X7S Dielectric GD ZAW, GD ZAW, GD ZAW, GD ZAW GH MA6N, GH MA6N, GH MA6N, GH MA6N, GH MA6N GH MA6N, GH MA6N, GH MA6N, GH MA6N, GH MA6N GH015Z101MA6N, GH025Z221MA6N, GH035Z471MA6N, GH045Z102MA6N 1

4 MOS CAPACITORS MS SERIES Hybrid Circuits MMICs RFICs Aerospace Bias Networks Test & Measurement Equipment GaN, SiCr & other transistor packages TOSA & ROSA Optical Sub-assemblies Small Size: to inches square Capacitance: 1.0 to 1000pF High Q Frequency range: DC to 20GHz MIL TEST METHODS MIL REFERENCE PARAMETER METHOD OR PARAGRAPH MIL-STD-883 Bond Strength MIL-STD-883 Shear Strength 2019 MIL-PRF Thermal Shock 107 MIL-STD-202 Life Test 108 MIL-STD-202 Load Humidity (THB) 103 at rated VDC TRANSMISSION LINE MIM CAPACITORS (METAL-INSULATOR-METAL) HFSS Design Unique for every device Gold Wirebondable Copper Conductor Design for improved Circuit Conductivity Designs Optimized for RF/Performance ROHS Compliant DC Blocking at UHF High Frequency Link RF Microwave applications SUBSTRATE MATERIALS Alumina (AI203) GENERAL CHARACTERISTICS Characteristic Design Dependent Capacitor Range Pf Tolerance ±20% Backing Termination Type Gold Metalization Gold Wire Bond AVAILABLE PART NUMBERS Part Number Substrate Length (mils) Width (mils) Thickness (mils) Cap Value (pf)* MV0304CA150MABW Alumina MV0402CA150MAAW Alumina MV0802CA150MAAW Alumina MV0804CA1R0MABW Alumina MV0804CA150MABW Alumina MV3204CA150MABW Alumina MV0404CA150MABW Alumina MV0505CA150MAAW Alumina *Capable Capacitance Value Ranging From: (pf) Most Common Capacitance Values Requested are 1, 5, and 15 (pf) TEST METHODS Specification Limit MIL-STD BOND STRENGTH > 3 gm min. w/0.001 Au Wire MIL-STD SHEAR STRENGTH Size Dependent See Procedure MIL-STD LIFE C 2

5 CAPACITOR ARRAYS, RESISTOR ARRAYS & INTERPOSERS FEATURES Create a system in package with an AVX interposer as a submount Integrate capacitors, inductors, and resistors in a miniature package Fully custom design evaluated upon request SUBSTRATE OPTIONS & FEATURES Substrate Thickness Note P-Si Boron Doped 4-25mil 15 Ω-cm N++ Si Arsenic Doped 4-25mil Ω-cm Boro-silicate Glass 4-25mil Ω-cm Alumina Nitride 10-60mil Lapped or polished Alumina 4-50mil Lapped or polished Fused Silica 4-25mil Ω-cm CONDUCTOR OPTIONS & THICKNESSES Conductor Al Au Au plated Cu Cu Plated Ni(V) Pd Pt TaN TiW Thickness kÅ kÅ μm 2k-25kÅ μm KÅ 500-5KÅ 1K-4KÅ (2500Å Typical) KÅ 300-2KÅ (500Å Typical) PASSIVE ELEMENT FEATURES Passive Element Resistors Capacitors Inductors Material TaN SiCr SiON Cu Sheet Resistace or Specific Capacitance Ω/sqr Ω/sqr 100 pf/sqmm N/A Typical Ranges 1Ω 1MΩ 47 20MΩ 1 500pF nH Breakdown Conditions Minimum Tolerance ±0.1% ±0.1% Performance Note: TCR in ppm/ C TCR TCR ±150 ±150 ±100 ±100 ±50 ±50 ±25 ±25 0.5% trimmed ±4% untrimmed K 6.1 TCC 60 ±5% Q 80 WIRE BOND RESISTORS WBR SERIES Military/Defense Hybrid Designs Multi-Chip Module (MCM) Instrumentation High Reliability Microelectronics RF/Microwave Communications Small Size 0202 Resistance from 1Ω to 10MΩ Extremely Tight Tolerance (0.1% - 5%) 250 mw Power Rating Ultra High Stability High Reliability Top Contact Isolated Bottom Unique Value Marking 3

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