Index. Calendering, 22 Capacitance, 126, 149

Transcription

1 A Absolute thermoelectric power, 110, 112, 117,118, 262,279 Absorption, 92 Absorption coefficient, 176 Absorptivity, 171 AC loss, 129 Acceptance angle, 174 Activated carbon fibers, 12 Activated carbons, 12 Activation energy, 277 Admixtures, 26, 254 Aging, 144 Aging rate, 144 Air void content, 26 AlN, see also aluminum nitride, 61, 154 Aluminum nitride, see also AlN, 58,62 Aluminum-matrix composites, 57, 59 Angle of refraction, 172 Anode, 213 Antiferromagnetic material, 198 Attenuation loss, 176 Auger electron, 183 Austenite, 246 Avalanche breakdown, 133 B Bag molding, 22 Battery, 10, 219 Beryllium-matrix composites, 60 Bimorph,150 Binder, 40, 57, 225 Bioactive, 233 Bioactive glass, 236, 237 Bioactivity, 238 Biocompatible, 233, 236, 238 Biocompatible material, 13 Biodegradable polymer, 11, 234 Biomedical applications, 12, 233, 235, 237, 238 Bipolar plates, 222, 226 Bohr magneton, 191 Borosilicate glass, 61 Butterfly curve, 143 ( Calendering, 22 Capacitance, 126, 149 Capacitor, 131, 154, 223 Carbon black, 224 Carbon fibers, 15, 16, 19, 20,,26,27,28,32,108, 113,249,254,260, 262,269 Carbon filaments, 27 Carbon nanotubes, 3 Carbon yield, 29, 30 Carbon-carbon composites, see also carbonmatrix composites, 16, 28, 32, 33, 34, 38, 39, 60, 238 Carbonization, 29, 31, 32, 38, 61 Carbonization-impregnation cycles, 29 Carbon-matrix composites, 2, 16, 28, 60, 94, 238 Carrier multiplication, 133 Cathode, 213 Cathodic protection, 5 Cement paste, 253, 266 Cemented fixation, 233 Ceramic-matrix composites, 2, 17, 25, 26, 46, 61, 66,84,94,105,108,154,156, 204, 237,248,253,254,255,260,265,267 Ceramics, 1, 7, 9, 56, 248 Char yield, 29, 33 Charge density, 125 Chemical vapor deposition, 31, 43 Chemical vapor infiltration, see also CVI, 28, 61 Chip carrier, 74 Cladding, 174, 175 Closure domains, 200 Coefficient of thermal expansion, 62 Coercive field, 143 Coherence, 182 Coherence length, 182 Coherent, 181 Colossal magneto resistance, 203 Commingling, 23, composite, 149 Composite materials, 2, 15 Composition cell, 215 III -V compound semiconductors, 180 Compression molding, 22, 23 Concentration cell, 217 Concrete, 2, 5, 25, 26, 248, 253, 255, 265 Conduction, 8 Connectivities, 149 Consolidation, 24 Controlled resistivity materials, 84 Convection, 8 285

2 286 Copper-matrix composites, 59 Corrosion resistance, 5, 25 Critical angle, 172 CTE, 60, 61, 153 Curie temperature, 140, 141, 195 Curing, 24 Current collector, 11, 223 CVI, 28, 31, 32 D Damage sensing, 255 Damping capacity, 245, 248, 267 Dark current, 183 Decibel, 176 Depoling, 144 Diamagnetic material, 199 Diamond, 3, 7, 8, 9, 56, 60, 62 Diamond-like carbon, 3 Die attach, 75 Dielectric applications, 125, 152 Dielectric breakdown, 133 Dielectric constant, 61, 62, 73, 125, 127 Dielectric loss, 129 Dielectric loss angle, 129 Dielectric strength, 133 Dielectrics, 6, 7 Die-less forming, 24 Diffusion bonding, 41 Dipole friction, 128, 132 Dipole moment, 128, 134, 142 Direct gap semiconductor, 180 Direct piezoelectric effect, 133, 135 Dissipation factor, 129 Domain boundaries, 142 Dry cell, 10, 220 Drying shrinkage, 5, 26, 46 Easy-plane anisotropy, 201 Elecrical applications, 6 Electric double-layer capacitor, 223 Electric field grading, 156 Electric susceptibility, 128 Electrical insulation, 153 Electrical interconnections, 6 Electrical resistivity, 39, 112 Electrochemical applications, 9 Electrochemical capacitor, 223 Electrochemical reaction, 9 Electrode, 9, 11, 223 Electroluminescence, 178 Electrolyte, 9, 11, 213, 226 Electromagnetic applications, 91 Electromagnetic interference, see also EMI, 79 Electromagnetic interference shielding, see also EMI shielding, 6, 73, 91 Electromagnetic observability, 91 Electromagnetic radiation, 167 Electromagnetic windows, 157 Composite Materials Electromechanical coupling coefficient, 139 Electromechanical coupling factor, 139 Electronic applications, 6 Electronic devices, 6 Electronic materials, 7 Electronic packaging, 7 Electronic pollution, 12 Electrostatic discharge, 83 EMI,79 EMI gaskets, 94 EMI shielding, 83, 84, 94 EMI shielding gaskets, 83 Encapsulation, 75 Energy loss, 132 Environmental applications, 11 Epoxy, 18, 20, 21, 62, 78, 106, 249, 276 Evanescent-wave sensor, 177 Exchange interaction, 193 Extrusion, 22 Ferrimagnetic material, 195 Ferroelectric, 140, 141, 143, 145, 148, 155 Ferroelectric domains, 140, 142 Ferromagnetic, 204, 245 Ferromagnetic domain, 193 Ferromagnetic material, 193 Fiber-optic sensor, 177 Filament windings, 23, 24 Flexible graphite, 3, 66 Fluid permeability, 5 Fluorescence, 171 Freeze-thaw durability, 5, 27 Frequency, 168 Frequency bandwidth, 181 Fuel cell, 10, 221, 222, 226 Fullerenes, 3 Functionally gradient electrode-electrolyte structure, 227 G Gage factor, 254, 255 Galvanic cell, 10, 215 Galvanic couple, 59, 215 Gauss's law, 126 Giant magneto resistance, 202 Giant magnetostriction, 201 Glass, 46, 62, 185 Glass-ceramic, 238 Glass-matrix composites, 154, 205 Graded index fiber, 175 Graphite, 2, 225 Graphitization, 3, 28, 31, 38, 39, 60 H Hard magnet, 198, 199 Heat retention, 66 Heat sinks, 7, 76

3 Heat transfer, 8 Heating element, 77 High-temperature consolidation, 31 Hot isostatic pressure, 28 Hot pressing, 28, 31, 41 Hydrogen -oxygen fuel cell, 222 Hydroxyapatite, 237, 238 Implants, 13, 233 Impregnation, 23, 29, 31 Impregnation carbonization, 28 Indirect gap semiconductor, 180 Infiltration, 41 Inhibitors, 34, 36 Injection molding, 22 Intercalation, 3, 105, 106 Interconnection, 74 Interface engineering, 19 Interlaminar interface, 271 Interlaminar shear strength, 19 Interlayer dielectric, 75 Intermetallic compounds, 5, 64 Internal-sensing sensor, 177 Isothermal method, 31 Joints, 5 Joule heating, 265 Lasers, 178, 179, 185 Laves phases, 201 Le Chatelier's principle, 216 Leachability, 235 Lead storage battery, 10 Leadless chip carriers, 74 Light detector, 182, 184 Light throughput, 177 Light-emitting diode, 178, 179 Liquid metal infiltration, 57 Liquid metal transfer agent technique, 43 Liquid phase impregnation, see also LPI, 28 Lithium-ion cell, 221 Loss factor, 129 Loss tangent, 129, 245, 249 Low observability, 205 LPI,32 Luminescence, 169 M Macropores, 12 Magnetic applications, 6, 191, 203, 204 Magnetic moment, 191, 197 Magnetocrystalline anisotropy constant, 201 Magnetoresistance, 202 Magnetostriction,199 Magnetostrictive constant, 200 Magnetotagging, 206 Martensite, 246 Martensitic transformation, 246 Matched die molding, 22 Matched-die forming, 24 Mechanical properties, 38 Mesophase, 29, 32 Mesopores, 12 Metal-matrix composites, 2, 5, 39, 40, 41, 57, 203, 238 Metals, 1, 56 Microelectronics, 7, 73 Micro-micropores,12 Micropores, 12 Microwave switching, 156 Monochromatic, 181 Mortar, 2, 253, 266 Multifunctional, 4 Multilayer, 205 Multimode optical fiber, 175 Multiple reflections, 92 N Negative electrode, 213 Negative magnetostriction, 200 Network, 154 Nickel ferrite, 197 Nickel-cadmium battery, 220 Non-destructive evaluation, 206 Numerical aperture, 174 o Open-circuit voltage, 217 Optical applications, 6 Optical detector, 182 Optical fiber, 6, 173, 175, 177, 178, 184 Optical fiber sensor, 177 Optical waveguides, 184 Optoelectronic devices, 6 Organometallic, 45 Organometallic compounds, 44 Overall cell potential, 219 Oxidation, 214 Oxidation protection, 33 Oxidation treatments, 19 Oxygen concentration cell, 217, 218 p Pack cementation, 34, 35, 37 Paraelectric, 142, 145 Parallel-plate capacitor, 126, 149 Paramagnetic material, 194 Particle tagging, 206 PEG, see also polyethylene glycol, 64, 65 Peltier effect, 101, 104 Percolation, 80 Percolation threshold,

4 288 Permeability, 193 Permittivity of free space, 126 Perovskite structure, 140 Phase-change materials, 65 Phonons,8 Phosphorescence, 171 Photoconduction, 170, 182 Photoconductivity, 182 Photon energy, 168 Photoresponse, 183 Photovoltage,182 Photovoltaic device, 184 Photovoltaic effect, 182 Piezoceramic,147 Piezoelectric, 133, 134, 135, 140, 155 Piezoelectric aging, 144 Piezoelectric charge coefficient, 135 Piezoelectric constant, 137 Piezoelectric coupling coefficient, 135 Piezoelectric devices, 6 Piezoelectric voltage coefficient, 137 Piezopolymer,147 Pin-inserting-type packages, 74 Pitch, 30, 32 Plasma spraying, 42, 58 PMN, 147, 154 PMN-PT, 147, 154 Pn junction, 178, 184 Polarization, 126, 127, 134, 136, 142, 145, 151 Polarization reversal, 143 Poling, 143 Polyethylene glycol, see also PEG, 64 Polymer concrete, 154 Polymer-matrix composites, 2, 5, 7, 8, 17, 21, 25, 40,62,73,78,79,93,94,103,105,153,154,155, 203,235,236,268,276,281 Polymers, 1, 7, 9, 66, 185, 247 Population inversion, 180 Pores, 12 Positive electrode, 213 Positive magnetostriction, 200 Powder metallurgy, 58 Preform, 22, 40, 57 Prep regs, 24 Pressure gradient method, 31 Primary cell, 221 Printed circuit board, 74 Prostheses, 235 Pseudo elasticity, 246 PT,147 Pultrusion, 22, 236 PVDF, 148, 149, 155, 156 Pyroelectric, 151, 155 Pyroelectric coefficient, 151 pyrolytic carbon, 233 Pyrolytic graphite, 61 PZT, 141, 145, 146, 147, 149 Q Quartz, 135, 140 R Radiation, 8 Reaction sintering, 34, 35 Reduction, 214 Reflection, 91 Reflectivity, 171 Refraction, 171, 172 Refractive index, 171, 173, 185 Relative dielectric constant, 126, 127 Relative permeability, 194 Relaxor ferroelectric, 146, 147 Remanence, 194 Remanent magnetization, 194 Remanent polarization, 143 Repair, 5 Resin transfer molding, 22 Resistance heating, 77 Resorbable materials, 234 Reverse piezoelectric effect, 133, 140 Composite Materials S Sacrificial anode, 5 Saturation magnetization, 194 Saturation polarization, 142 Scaffolds, 233 Screen printing, 79 Sealant, 34, 35 Secondary cell, 221 Seebeck coefficient, 101, 262, 279 Seebeck effect, 101, 104, 261 Seebeck voltage, 101 Self-polarization, 140 Self-sensing, 4 Semiconductor, 170, 180 Semiconductor detector, 183 Semiconductor laser, 180, 181 Semiconductors, 2, 7, 171, 182, 183 Shape-memory alloys, 245 SiC, see also silicon carbide, 61 SiC conversion coating, 34 Silica fume, 26, 66, 113, 248, 254, 263, 266, 267 Silicon carbide, see also SiC, 58, 59 Single-mode optical fiber, 175 Skin depth, 93 Skin effect, 83, 93, 94 Slurry casting, 42 Slurry infiltration, 47 Smart structures, 253, 268 Snell's law, 172 Sodium silicate, 64 Soft magnet, 199 Solar cell, 184 Solder, 7, 63 Solid electrolytes, 157 Solution coating, 43 Solution coating method, 44 Specific heat, 266 Spin scattering, 202 Spin-orbit coupling, 199 Spontaneous emission, 179

5 289 Standard electrode potential, 218 Standard electromotive force series, 218 Standard hydrogen reference half-cell, 218 Static dielectric constant, 129 Stealth, 205 Steel fiber, 108, 112, 254, 262 Stepped index fiber, 174 Stimulated emission, 179 Stir casting, 57 Storage modulus, 245 Strain sensing, 254 Strain/stress sensing, 272 Stress shielding, 233 Stress-graphitization, 31 Structural health monitoring, 4 Substrate, 6, 74 Supercapacitor, 223 Superelasticity, 246 Superexchange interaction, 195 Surface treatment, 20, 33, 38 Surface-mounting-type packages, 74 Thermoelectric energy conversion, 103 Thermoelectric figure of merit, 101, 102 Thermoelectric power, 101 Thermoforming, 22, 24 Thermoplastics, 1, 17, 19, 21, 23, 24, 25, 62 Thermopower, 101, 106, 262 Thermosets, 1, 17, 21, 24,62 Thick-film, 7 Thromboresistant, 233 Time domain reflectometry, 177 Titanium, 237 Total internal reflection, 172 Tow, 17 TPG,61 Transmission-gap sensor, 177 Transverse waves, 168 Turbostratic carbon, 3 U Ultracapacitor, 223 T Tan d, 132, 133, 245 Temperature gradient method, 31 Temperature sensing, 260, 276 Thermal applications, 8, 9, 55 Thermal conductivity, 39, 47, 55, 56, 58, 59, 60, 66, 73,79,266 Thermal contact conductance, 64, 65 Thermal control, 265 Thermal expansion, 39,47,73 Thermal expansion coefficient, 81 Thermal fatigue, 7 Thermal fluids, 63 Thermal greases, 63 Thermal insulation, 66 Thermal interface materials, 63, 64, 65, 74, 76 Thermal pastes, 64 ThermalGraph,61 Thermistor, 260 Thermocouple, 110, Ill, 113, 114, 279 Thermocouple junction, 106, 108, 114 Thermoelectric applications, 101 Thermoelectric devices, 6 Thermoelectric effect, 261 V Vibration damping, 4, 6, 245, 247, 248 Vibration reduction, 267, 281 Viscoelastic material, 6, 267 Viscous glass consolidation, 47 Voltage sensitivity, 149 W Wavelength, 167 Workability, 26 X x-ray, 183 x-ray spectrometry, 183 x-ray spectroscopy, 183 Z z-axis anisotropic electrical conductor film, 75, 81 z-axis conductor, 62