ALPHA EF-8300 product guide

Transcription

1 the product: A higher activity flux that delivers excellent solderability and doesn t compromise on and electrical reliability. ALPHA product guide

2 ALPHA wave solder flux Welcome to the ALPHA Product Guide CONTENTS Page # 1. Introduction/Features 3 2. Soldering Performance Post Reflow Cosmetics 8 4. Reliability/Product Data Application Guidelines Summary Technical Bulletin & MSDS Flux Portfolio 14 2

3 Introduction ALPHA represents the latest offering in ALPHA s industry leading no-clean, alcohol based wave solder flux product line. It is a newly formulated high activity, alcohol based, no-clean wave solder flux that uses the latest advances in flux formulation to deliver the best in class soldering performance without compromising electrical reliability. It is designed to perform with both standard and low-silver SAC alloys. is an M-class flux designed with higher activity to meet the most challenging wave solder applications. performs well under a variety of machine configurations and can be used with either conventional or ultrasonic sprayers. 3

4 Test Vehicle - Designed to differentiate flux performance by forcing failure Technical details 4 layer board with 2 Copper interlayers 2.4 mm (0.093 ) thick Black mask Entek Plus HT OSP pad finish 0.25mm, 0.37mm, 0.25mm, 0.37mm, 0.5mm and 1.0mm 0.5mm and 1.0mm through holes through holes Bottom Side Soldering Performance The SAKT board can be fabricated single sided, double sided, and finished with organic solder preservative (OSP), HASL, immersion tin, immersion silver or ENIG finishes. Top Side Edge Connectors in Edge Connectors in the X and Y direction the X and Y direction (No Solder Thieves) (No Solder Thieves) Bottom Side Passives Bottom Side Passives to Evaluate Dual Wave to Evaluate Dual Wave vs. Single Wave vs. Single Wave Performance Performance.80mm,.65mm and.80mm,.65mm and.50mm pitch bottom side.50mm pitch bottom side QFP s-designed to QFP s-designed to create solder bridges create solder bridges 4

5 Bridging Performance Soldering Performance Superior Resistance to Bridging demonstrates up to 50% less bridging vs EF-8000 on various components Average Number of Bridges EF Straight Header 0.65mm QFP 0.8mm QFP Component Type Processing Conditions Alloy SACX TM 0307 Wave (Single/Dual) Dual Contact Time 5 seconds PWB type/pad Finish FR4, Entek Plus HT Mask NANYA K60 Thermal Profile Glue cure + 1 Lead-free reflow in air Conveyor Speed 1.2 m/minute (4 ft/minute) Pot Temperature 265 C Top-side Preheat 92 C Flux Loading (µg/in 2 ) 1200 µg/in 2 5

6 Skips Performance Soldering Performance Excellent Resistance to Skips shows no skips on various component types Average Number of Skips EF Transistor 0805 chip 0603 chip Component Type Processing Conditions Alloy SACX TM 0307 Wave (Single/Dual) Dual Contact Time 5 seconds PWB type/pad Finish FR4, Entek Plus HT Mask NANYA K60 Thermal Profile Glue cure + 1 Lead-free reflow in air Conveyor Speed 1.2 m/minute (4 ft/minute) Pot Temperature 265 C Top-side Preheat 92 C Flux Loading (µg/in 2 ) 1200 µg/in 2 6

7 Hole Fill Performance Soldering Performance Improved Hole Fill Performance provides improved hole fill versus EF-8000 using the SACX 0307 alloy Average Hole Fill EF Avg 35 mil Hole Fill Hole Size Processing Conditions Alloy SACX TM 0307 Wave (Single/Dual) Dual Contact Time 5 seconds PWB type/pad Finish FR4, Entek Plus HT Mask NANYA K60 Thermal Profile Glue cure + 1 Lead-free reflow in air Conveyor Speed 1.2 m/minute (4 ft/minute) Pot Temperature 265 C Top-side Preheat 92 C Flux Loading (µg/in 2 ) 1200 µg/in 2 7

8 Flux Residue and Joint Cosmetics Post-Reflow Cosmetics Flux Residue Clear, colorless Uniform with no white residue observed on black mask Non-tacky Joint Cosmetics Smooth joints typical of both Lead-free and SnPb processing. 8

9 Summary Table Reliability/Product Data Reliability Test Silver Chromate Paper IPC-TM 650 Test Method Copper Mirror Tests IPC-TM 650 Test Method Copper Corrosion Test IPC TM 650 Test Method Bellcore GR-78-CORE SIR Test IPC SIR (J-STD-004) PASS No detection of Halide <50% removal (M-class) PASS No evidence of corrosion PASS Comb Down, 2.4 x Ώ Comb Up, 2.4 x Ώ PASS Comb Down, 1.1 x Ώ Comb Up, 2.4 x Ώ 9

10 Product Data Reliability/Product Data Physical Properties Parameters/Test Method Typical Values Appearance Clear, Pale Yellow Liquid ph, 5% v/v aqueous solution 3.0 Solids Content, wt/wt, % 6.3% Recommended Thinner ALPHA 425 Specific 25 C (77 C) ± Shelf Life 12 months Acid Number (mg KOH/g) 34.5 ± 2.5 IPC J-STD-004 Designation ROM0 Flash Point (T.C.C.) 17 C Bellcore SIR PASS Comb Down, 2.4 x Ώ Comb Up, 2.4 x Ώ 10

11 Application Guidelines Application Guidelines Conveyor Angle OPERATING PARAMETER Amount of Flux Applied Top-Side Preheat Temperature Bottom side Preheat Temperature Recommended Preheat Profile Maximum Ramp Rate of Topside Temperature (to avoid component damage) Conveyor Speed Contact Time in the Solder (includes Chip Wave and Primary Wave) Solder Pot Temperature: TYPICAL LEVEL for ALPHA with SAC 305 or Low Ag SAC alloys Spray: 800 to 1200µg/in 2 of solids/in 2 for dual wave and 700 to 1000 µg/in 2 of solids/in 2 for single wave soldering C 0 to +40 F (0 to +22 C) vs. Top-Side Straight ramp to desired top-side temperature 2 C/second (3.5 F/second) maximum 5-8 (6 most common recommended by equipment manufacturers) meters/minute for single wave meters/minute for dual wave is capable of running at a slower conveyor speed to accommodate certain types of Pb-free wave soldering process 2-7 seconds (3 5 seconds most common) C These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components, and circuit boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a design experiment, optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board orientation). 11

12 delivers excellent residue cosmetics Clear, colorless, tack free flux residue No white residue Summary delivers improved hole fill and bridging Performance Better hole fill on 35 mil diameter holes vs EF-8000 Up to 50% less bridging than EF-8000 on most common components delivers excellent reliability post reflow Passes IPC and Bellcore SIR Passes Copper Corrosion Halide-free delivers a wide reflow process window SnPb or Pb-free alloys and compatible with Low Ag alloys Spray fluxing Single and Dual wave capable Compatible with leading pad finishes including Entek Plus and Entek HT OSP, and Immersion Silver 12

13 Technical Bulletin and MSDS Technical Bulletin and MSDS For the most current version of the Technical Bulletin and MSDS, please visit 13

14 For more information on ALPHA s industry leading solvent based and VOCfree flux offering, please visit: Flux Product Portfolio Click on ALPHA s Online Flux Selector icon to generate a prioritized list of fluxes for your application based on your process inputs. 14