Specification Potting Compound for Electronic Circuits Potting compound, electr

Transcription

1 Specification Class: Sealing Material Class No.:30 Potting Compound for Electronic Circuits JED 675 Previous Edition Abbreviated Title Potting compound, electr Scope Specific types of potting compound are suited for the different fields of application. If JED-675 is indicated in old drawings, JED shall be applied. 1.1 Electric components Types: JED two-component potting compounds curing at room temperature; very high hardness; JED two-component potting compounds curing at room temperature; high hardness. JED two-component potting compounds curing at room temperature; low hardness. 1.2 Electronic circuits and printed boards without bonding wires Types: JED single-component potting compounds curing at elevated temperatures; medium hardness; JED potting compounds according to type JED-675-2, but with lower processing viscosity, suited for filling narrow gaps Encapsulation and coating electrical and electronic components mounted in heavily loaded conditions, e.g. sensors, SMD-equipped PCBs JED two-component potting compounds, high hardness and an good flexibility at low temperatures. These compounds cure at room temperature. Suited for the contact with fuels, AdBlue, brake fluid, engine and gear oils Protective lacquer (coating material) suitable for sealing and protection of components and connections on the PCB JED single-component potting compound curing at room temperature; high hardness with high viscosity thixotropic flow. Compiler Approved Product Group: 4961 Continuation page 2 to 6 Katarzyna Śpiewak JED.dot Template version 03 Hans Voß Doc. Code Language Rev en - F

2 JED-675 : Page Electronic circuits and printed boards equipped with bonding wires Full potting Full potting is applied on assembled printed boards (ECUs) which are inserted in connector frames and bonded on the top side after assembly (bonding to the connector frame). The full potting provides protection against dew and corrosion to the bottom of the printed board and to its top side including the bonding wires. The potting compounds adhere to plastic materials (PBT and PA6.6), solder resist, components, soldering tin and printed-conductor surfaces (chem. NiAu) as well as to flux residues. After potting, commercially available barcode readers have to read the barcodes applied to the printed board. Therefore the potting compounds have to be transparent. Types: JED two-component potting compounds, low hardness. These compounds cure at room temperature, the curing process can be accelerated in elevated temperatures. They are not suited for the contact with mineral oils; JED two-component potting compounds, increased hardness. These compounds cure at room temperature, the curing process can be accelerated in elevated temperatures. For applications at elevated temperatures Potting of Sensor hybrids Potting is applied on sensor hybrids before or after these are glued into the plastic or metal housing. The potting provides protection of the non-pressure side of the hybrids against dew and corrosion. The potting compounds adhere to ceramic, solder resist, components, soldering tin and printedconductor surfaces (chem. NiAu) as well as to flux residues. JED single-component potting compound with medium hardness, hardening at elevated temperatures. Attention! These potting compound is based on silicone, it may not be used if vapours from the silicone can reach contacts of electrical switches. 2 General requirements The parts to be potted have to be dry. In case of the compounds curing at room temperature, the curing process may be accelerated by selecting elevated temperatures. Corrosive effects on metal are not allowed. The potting compounds are resistant to antifreezes (ethanol, isopropanol, methanol), oils and greases. The requirements for finished parts can be taken from the drawing and from the relevant part specification. All materials, even ingredients in small quantities (e.g. cadmium), which are detrimental to health or to the environment are banned from being used. 3 Thermal range of application Continuous operational temperature range JED-675-0: -40 C up to +110 C JED-675-1: -40 C up to +110 C JED-675-2, -3 a. -6: -40 C up to +120 C JED-675-4: -40 C up to +85 C JED-675-5: -40 C up to +180 C JED-675-7: -40 C up to +120 C JED-675-8: -40 C up to +100 C JED-675-9: -40 C up to +120 C

3 JED-675 : Page 3 Short-time exposure to heat JED to -4, a. -6: 1 h at +130 C JED-675-5: 1 h at +200 C JED : 24 h at +120 C JED-675-9: 1 h at +130 C 4 Properties 4.1 Properties of the liquid compounds Viscosity at 23 C Curing time (thickness of layer 3 mm) at room temperature 12 to 48 JED JED JED to 1200 ± to mpas (intrinsically viscous) 100 to to 5 - minutes 0,1 to 12 acc. to ratio of ingredients - hours Curing time at 90 C minutes Viscosity at 23 C Curing time (thickness of layer 3 mm) at room temperature Curing time at 90 C 30 JED JED JED to 4000 to to 5000 mpas to 15 minutes to 15 hours - minutes 120 at +100 C: 300 at +150 C: 60 at +200 C: 20 JED JED JED Viscosity at 23 C 400 bis to ± mpas minutes Curing time (thickness of layer - - < 4 hours 3 mm) at room temperature Curing time at RT: 24 at +80 C: 1 at +90 C: 0,5 at RT: 2 to 8 final 14 days JED Viscosity at 23 C 600 bis 900 mpas - minutes Curing time (thickness of layer - hours 3 mm) at room temperature Curing time at RT: 2-8 hours 5 to 6 Final: 24 at RT/ 50 rel. hum. hours

4 JED-675 : Page Properties of the potting compounds after curing JED JED JED and -3 Hardness ISO ± 5 80 ± 5 70 ± 10 Shore D Shore A Tensile strength > 10 > 10 >10 Percentage elongation at break > 300 >200 Volume resistivity dry IEC > 2 8 > Ωm Electric strength IEC > 15 > 25 >20 kv/mm Relative permittivity IEC to 6 3,5 to 4,5 5,5 to 6,5 JED JED JED Hardness ISO ± 5 15 ± 5 25 to 45 Shore A Tensile strength > 0,3 > 0,5 Elongation at break > 180 Volume resistivity dry IEC > 10 > 20 > Ωm Electric strength IEC > 10 > 20 > 70 kv/mm Relative permittivity IEC ,5 to 2,5 Water absorption ISO 62 < 0,4 < 0,4 Gew (24 h) Thermal conductivity ISO 8302 > 0,15 > 0,15 W/mK Coefficient of thermal ASTM D < 3 < /K expansion 696 Glass transition IEC < -50 < -50 < -40 C temperature method B Glow-wire test IEC / JED Hardness ISO to 40 Shore D (after 4 days at RT) Tensile strength Elongation at break Volume resistivity dry IEC Ωm Electric strength IEC > 36 kv/mm Relative permittivity IEC ,2 Water absorption After 30 days 1,4 Gew Thermal conductivity ISO 8894 > 0,22 W/mK Coefficient of thermal expansion ASTM D 696 < 25 C,TMA < /K Glass transition temperature IEC method B TMA Glow-wire test IEC /1 < 30 C C s C s

5 JED-675 : Page 5 Mechanical properties after ageing in Air,168 hours at +80 C S2 bars according to JED > 0,3 JED C > 0,3 > 50 Diesel fuel, 24 hours, RT > 0,1 0 to to +10 Petrol, 24 hours, RT > 0,1 0 to to +25 Brake fluid DOT 4, 24 hours, +90 C > 0,05 0 to +250 > 0,1 > 50 0 to +50 Wash liquid, 24 hours, +90 C > 0,25 0 to to +5 JED JED Hardness ISO to ± 10 Shore D Shore A Tensile strength > 1 n.a. Elongation at break > 150 > 300 Volume resistivity dry IEC > 10 > Ωm Electric strength IEC > 20 kv/mm Relative permittivity IEC ,8 Water absorption ISO 62(24 h) < 0,2 < 1,2 Gew Thermal conductivity ISO 8302 > 0,2 > 0,2 W/mK Coefficient of thermal ASTM D /K expansion Glass transition IEC < -68 C temperature method B Glow-wire test IEC /1 C s

6 JED-675 : Page 6 JED Resistance to Media Tests according to ISO with the media and storage temperatures listed below. Storage time 24 hours. Requirement for assessment after storage: No changes that could impair the function of the product. No changes on the surface like cracks, color change or dissolving. Type Product Temperature [ C] Petrol Fuel RT Petrol Diesel 90 Petrol Bio Diesel 90 Adblue GreenChem 90 Brake fluid DOT 4 90 Engine oil Aral 15W50 90 Transmission fluid Shell Spirax 90 Cold cleaner Solutol UWF RT Cleaning agent ( phosphatefree) Henkel P3 RT Phosphate-containing cleaning Neodisher A8 RT agent General purpose cleaner OKS2611 RT Rim cleaner Aral Felgenreiniger intensiv Autosol Felgenreiniger extra stark Sonax Xtreme RT 5 Guarantee 5.1 General The manufacturer is obliged to prove by regular random test that the requirements are observed, and to keep the documents referring to this inspection accessible to the customer. 5.2 Initial sample On each first delivery some initial samples and the initial sample inspection report are to be submitted for the examination of material and dimension. 5.3 Changes The change of the material regardless of the kind of change and its reason is only permissible after previous release by the departments which are responsible for the technical design.