10 + Gbps 0.5mm pitch Stacking Connectors

Transcription

1 1 + Gbps.5mm pitch Stacking onnectors XG1 Series Mechanical Features.5mm Pitch / ouble-row SMT Stacking Height : 15~23mm ( 2 pieces ) 25~44mm ( 3 pieces ) Number of ontacts : / / 14 / 1 / 156 / 8 / pos SMT oplanarity The coplanarity of the SMT solder area lead is maintained at the high accuracy of less than.1mm. "Transmission lade" Variations ifferential1 ohms and ifferential 85 ohms, Power blade Multiple blade combinations are available. Large Self lignment ( Fig.1 ) lignment on plug provides easy insertion operation. 5 5 Fig.1 Fig.2 nti-amage Structure ( Fig.2 ) ngled insertion is acceptable up to 5. Soldering Reliability XG1 utilizes the same contact design for both signal and ground, which conducts the heat equally. Mating Length : 1.2mm Integrity Features Insertion-loss-to-rosstalk-Ratio (IR) The insertion loss-to-crosstalk ratio (IR) with five-aggressor differential FEXT meets the extrapolated IEEE82.3ap specification for 1 + Gbps with plenty of margins. ifferential Impedance The differential impedance is 1 ohms at 6ps rise time ( % to 8%) IR (d) IR IR spec Transmission lade Variations Power lade urrent apacity : 7 mps / mm blade Ex. 3.3V@ V@3 2.4V@3 (Return) 3.3V@3.5 (Return) ifferential lade Impedance: 85 ohms ifferential lade Impedance: 1 ohms GN plate edicated ed Pins ifferential pair

2 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Production Specifications Ratings urrent rating urrent voltage.3 5V Operating temperature range Operating humidity range -55ç to +85ç (Note 1) Relative humidity 9% (No condensation) Storage temperature range Storage humidity range -1ç to +6ç (Note 2) 4% to 7% (Note 2) 1. Insulation resistance 2. Withstanding voltage 3. ontact resistance 4. Vibration 5. Shock Item Specification onditions 6. Humidity 7. Temperature cycle 8. urability (insertion / withdrawal) 9. Resistance to soldering heat 1 M ohms min. No flashover or insulation breakdown. 1 m ohms max. ( Including conductor resistance.) No electrical discontinuity of 1 µs or more. No damage, cracks, or parts dislocation. No electrical discontinuity of 1 µs. min. No damage, cracks, or parts dislocation. ontact resistance: 15 m ohms max. Insulation resistance: 1 M ohms min. No damage, cracks, or parts dislocation. ontact resistance: 15 m ohms max. Insulation resistance: 1 M ohms min. No damage, cracks, or parts dislocation. No deformation of components affecting performance. 1V 15V / one minute 1 m Frequency: 1 to 55 Hz, single amplitude of.75mm, 1 cycle in each of the 3 directions. cceleration of 49 m/s 2, 11 ms duration, sine half-wave waveform, 3 cycles in each of the 3 axis 96 hours at 4ç±2ç and humidity of 9% to 95% Temperature: 55ç / +15ç to +35ç / +85ç / +15ç to +35ç uration: / 5 max. / / 5 max. (Minutes) 5 cycles cycles Reflow: t the recommended temperature profile (Peak temperature: ç max.) etailed solder profile can be requested. Note1: Includes temperature rise caused by current flow. Note2: The term storage refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation. Note3: Information contained in this catalog represents general requirements for this Series. ontact us for the drawings and specifications for a specific part number shown. Materials / Finish Receptacle Part Insulator ontacts Retention peg Interposer Part Insulator ontacts Grand contacts Material Finish Remarks LP olor: eige ontact area: Gold plated Lead area: Gold plated Lead area: Gold plated UL94V- Material Finish Remarks P olor: lack / eige LP olor: eige UL94V- ontact area: Gold plated ontact area: Gold plated Plug Part Insulator ontacts Grand contacts Retention peg Material Finish Remarks P / LP LP UL94V- olor: lack olor: eige ontact area: Gold plated Lead area: Gold plated ontact area: Gold plated Lead area: Gold plated Ordering information Receptacle Plug XG1-1 S - SV - H () XG1-1 P / - H - SV () Interposer XG1-1 P / - H () Series name : XG1 Number of contacts : to (Including Grand contacts) onnector type lade assignment S : Receptacle P: Plug or Interposer lank : ll 1 ohms blade Q : Including 85 ohms blade : Including power blade Number of contact : 12 to 6 Stacking Height (mm) : 15 to 38 πheight wth XG1-S-SV ontact type SV : SMT vertical mounting type lank : Interposer Receptacle hight : lank, 2, 3 Peculiar Specification lank : ontact rea : Gold (.2µm) + Ni (1.5µm) Receptacle : Tape and Reel Packaging Plug : Hard Tray Packaging Interposer : Soft Tray Packaging.76µm gold plating type is also available. 2

3 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Function hart Plug (XG1-P/-H-SV) Stacking Height : 15~23mm ( 2 pieces ) Receptacle (XG1-S-SV) (XG1-S-SV-H) Interposer (XG1-P/-H) Mating side Receptacle (XG1-S-SV) (XG1-S-SV-H) Stacking Height : 25~44mm ( 3 pieces ) Locking side Stacking Height Variation Receptacle Plug Interposer Part Number XG1-S-SV XG1-S-SV-2H XG1-S-SV-3H XG1-P/-15H-SV XG1-P/-H-SV XG1-P/-H XG1-P/-38H Stacking height (mm) Two pieces required 3

4 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Integrity Pin assignment To match 1 ohms differential impedance and to reduce crosstalk, a GSSG pin assignment is recommended for XG1. (G=ground and S=signal) oard Row a Row b oard Row a Row b iff pair edicated ground dditional ground pin Impedance The differential impedance is 1 ohms for XG1 at 6 ps rise time (% to 8%) mm mm Propagation delay The propagation delay is 132 and ps for XG1 of mm and mm height, respectively. 4

5 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Insertion Loss The differential insertion loss crosses 1d at 8 and 1GHz for XG1 of mm and mm height, respectively. mm mm Return loss mm mm Near-end crosstalk (NEXT) The GSSG pin assignments resulted in low differential NEXT. mm mm S (d) - S (d) S S

6 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Far-end crosstalk (FEXT) The GSSG pin assignments resulted in low differential FEXT. mm mm S (d) - S (d) S S Insertion-loss-to-crosstalk ratio (IR) The insertion-loss-to-crosstalk ratio (IR) with multi-aggressor differential FEXT meets the extrapolated IEEE 82.3ap specification to 1 + Gbps with plenty of margins. mm mm 6 5 IR IR spec 6 5 IR IR spec 4 4 IR (d) IR (d)

7 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Receptacle Number of ontact : to 1 Number of ontact : 156 to.15.2 b2 b b1 b2 1.5 P=.5 a2 a P=.5 a2 a Ø1 Ø1.4 Ø1 Ø1.4 Part Number XG1-S-SV XG1-S-SV XG1-S-SV-2H XG1-S-SV-3H XG1-14S-SV XG1-1S-SV XG1-156S-SV XG1-8S-SV XG1-S-SV Please contact us. ll dimensions in mm HRS No. Number of ontacts n L L L L L L L L L

8 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Plug Number of ontact : to 1 Number of ontact : 156 to.15 b1 b b1 b2 1.5 a1 a2 P= a1 P=.5 a Ø1.4 Ø1 Ø1.4 Ø1 Part Number XG1-P/12-15H-SV XG1-P/18-15H-SV XG1-14P/24-15H-SV XG1-1P/-15H-SV XG1-156P/36-15H-SV XG1-8P/48-15H-SV XG1-P/6-15H-SV XG1-P/12-H-SV XG1-P/18-H-SV XG1-14P/24-H-SV XG1-1P/-H-SV XG1-156P/36-H-SV XG1-8P/48-H-SV XG1-P/6-H-SV Under planning. Please contact us. ll dimensions in mm HRS No. Number of ontacts(ground contacts) n L (12) L (18) L (24) L () L (36) L (48) L (6) L (12) L (18) L (24) L () L (36) L (48) L (6)

9 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Interposer Number of ontact : to 1 Number of ontact : 156 to a1 a2 a1 a b1 b2 b1 b2 Part Number XG1-P/12-H XG1-P/18-H XG1-14P/24-H XG1-1P/-H XG1-156P/36-H XG1-8P/48-H XG1-P/6-H XG1-P/12-38H XG1-P/18-38H XG1-14P/24-38H XG1-1P/-38H XG1-156P/36-38H XG1-8P/48-38H XG1-P/6-38H Please contact us. ll dimensions in mm HRS No. Number of ontacts(ground contacts) n L L L L L L L L L L L L L L (12) (18) 14(24) 1() 156(36) 8(48) (6) (12) (18) 14(24) 1() 156(36) 8(48) (6)

10 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Recommended P mounting pattern Receptacle Number of ontact : to 1 Number of ontact : 156 to P= ±.2.1 X E b2b1 X n-.3±.2 1.1±.5.6 X P=.5 Ø1.2± X Ø1.6±.5 b2b Ø1.2±.5 F±.5 G a2 a1 Ø1.6± ±.2.1 X a2 a1 n-.3±.2.6 X 1.1± Plug Number of ontact : to 1 Number of ontact : 156 to.5 Ø1.6±.5 b1 b2 E X n-.3±.2.6 X Ø1.2±.5 P=.5 Ø1.6±.5 b1 b X n-.3± X 1.1± ±.2.1 X a1 a2 F±.5 G 1.1± ±.2.1 X a2 a1 Ø1.2±.5 ontact positions pos. pos. 14pos. 1pos. ontact positions 156pos. ll dimensions in mm 8pos. pos E 6 n 14 1 F G n 65 1

11 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Pin assignment Pin No. Pin No. Pin No. a1 / b1 a2 / b2 a3 / b3 a4 / b4 a5 / b5 a6 / b6 a7 / b7 a8 / b8 a9 / b9 a1 / b1 a11 / b11 a12 / b12 a13 / b13 a14 / b14 a15 / b15 a16 / b16 a17 / b17 a18 / b18 a19 / b19 a / b a21 / b21 a22 / b22 a23 / b23 a24 / b24 a25 / b25 a / b a(n / 2-1)/ b(n/2-1) a(n / 2)/ b(n/2) Recommended Temperature Profile Using Lead-free solderpaste In individual applications the actual temperature may vary, depending on solder paste type, Volume/thickness and board size/thickness. onsult your solder paste and equipment manufacturer for specific recommendations. Recommended Stencil imensions Mask ( to 1pos.) Mask (156 to pos.).1 X P= ±.2 E X n-.3±.2.6 X P= X F 2-.55±.2 n-.3±.2.1 X.6 X ontact positions pos. pos. 14pos. 1pos. ontact positions 156pos. ll dimensions in mm 8pos. pos n 14 1 E 6 F n 65 11

12 XG1 Series 1 + Gbps.5mm pitch Stacking onnectors Recommended Spacer Hight ll dimensions: mm oard-to-board istance Part Number Recommended Spacer Height 15mm mm 25mm mm 35mm 38mm XG1-P/-15H-SV XG1-P/-H-SV XG1-P/-25H XG1-P/-H XG1-P/-35H XG1-P/-38H 15±.127 ± ±.127 ± ± ±.127 leaning recommendations Organic solvent cleaning Solvent Type Room temperature cleaning Heated cleaning IP ( Isopropyl alcohol) YES YES HF ( Hydro chlorofluorocarbon ) YES YES Water based cleaning When using water based cleaning agents (e.g., terpene, alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers of cleaning agents which describes it s affects on metals, platings and plastics. Remove any moisture after cleaning. Residual flux or cleaning agents in the contact areas may affect electrical performance. 6-3,Nakagawa huoh-2-home,tsuzuki-ku,yokohama-shi PHONE: , FX: The contents of this catalog are current as of date of 1/12. ontents are subject to change without notice for the purpose of improvements.