Rapid Cleaning Using Novel Processes With Coa7ngs
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1 Rapid Cleaning Using Novel Processes With Coa7ngs Alex Brewer and John Moore Daetec, LLC 1227 Flynn Rd., Unit 310 Camarillo CA Surface PreparaHon and Cleaning Conference April SPCC Santa Clara California 1
2 Washable Coa7ngs Coa7ngs that Clean CoatsCleans TM emulsify PR Washable Primers lih off/ protect from metal X-linking Washable Coa7ngs/Adhesives Laser processing Temporary bonding Dicing and polishing Planarizing FF Tape Washable Safe 2016 SPCC Santa Clara California 2
3 CoatsCleans TM vs. Immersion Treated Wafers Using Liquids (Solvents) to Clean Solids (Polymers) Solvent Immersion Long Time Ineffec7ve Corrosion Solvent Intensive Hazardous Coats/Cleans TM Using Solids (Polymers) to Clean Solids (Polymers) Treated Wafers Coat & Water Wash Fast Mul7-purpose Metal Safe Water Rinse EHS Approved 2016 SPCC Santa Clara California 3
4 Stripping Neg-Acrylic PR (Bumping) Coats/Cleans PR PR Heat/Emulsify Coating Wafer ID Before PR Present 1 Pos - Liq Merck AZ P um Wafer ID A2er <15min Dissolve/Rinse 5 Neg - DF TOK um 3 Neg - Liq DOW BPR um 6 Neg - DF Asahi Sunfort um Before PR Present A2er <15min Dissolve/Rinse 4 Neg-DF DuPont WB100-series um 2 Neg - Liq JSR THB-151N 20-24um H2O Rinse 2016 SPCC Santa Clara California 4
5 Washable Primer - Eliminates Residue Adhesive Adhesive Temperature (C) Process Cleans on Rubber Coa=ng + Washable Primer Wafer Cleans, temperature monitor during rota=on Stripping DIW Rinsing Current (amps) 1.00E E E E-04 Dry Clean Substrate Hg-Probe Surface Measurement on Co, Following Treatment Solvent + Rinse Coat Solvent 50 Rinsing, Drying 2.00E-04 Not Clean Time (sec) 0.00E Voltage 2016 SPCC Santa Clara California 5
6 Improved Thermal Resistance Thermal Resistance Chemical funchonality Phenyl Polyester [ DaeCoat TM Systems Phenyl silicones Polyphenylsulfones Salt conjugates [ 2016 SPCC Santa Clara California 6
7 Thermal Resistant Washable Coa7ngs Thermal Exposure AUer RT Water Rinse PVA PVP DaeCoat TM PVA PVP DaeCoat TM 200C 250C 300C 2016 SPCC Santa Clara California 7
8 Ex.: Wafer Temporary Bonding Process Demand Objec7ve: Wafer thinning, backside processing Mechanical (e.g. grind): Yes Thermal resistance: <300C Process/chemicals: Yes Uniformity: ~2um Recommenda7on DaeCoat TM 355 Green solvent washable, DaeClean TM 300 Broad chemical resistance Thermal resistance: >300C Carrier: Solid, due to small die, simple release/cleans chemical diffusion recycled 2016 SPCC Santa Clara California 8
9 Thinning, Processing, Release Grinding, backside processing, singula7on Singula7on offers 1-2mm channel between devices to enable simple debond & wash 2016 SPCC Santa Clara California 9
10 Green Solvent Wash Adhesive DaeClean TM 300 Device: Capture/Further Processing DaeClean TM 300 Immersion Adhesive Dissolu7on Carrier Release/Recycle 2016 SPCC Santa Clara California 10
11 Ex.: Device Temporary Bonding Process Demand Objec7ve: LTCC flip-chip bond & encapsulate Mechanical (e.g. grind): No Thermal resistance: ~275C Process/chemicals: limited, RT flux cleaner Uniformity: <10% Recommenda7on DaeCoat TM 535 Hot DIW washable RT chemical resistance Thermal resistance: >300C Carrier: Porous chemical diffusion recycled 2016 SPCC Santa Clara California 11
12 LTCC/HTCC Microelectronics on a ceramic substrate MulH-layer packaging MEMS, military, RF, wireless Thickness <50um to >250um Commonly um Green tape several suppliers Extremely fragile handling challenge 2016 SPCC Santa Clara California 12
13 DIW Wash Adhesive (LTCC) UV tape film Chemical Safe Hot DIW Wash (<80C) Film Frame Akach to device front-side Porous Carrier Debond UV Debond Pick & Place 2016 SPCC Santa Clara California 13
14 Ex.: Wafer Planariza7on Process Demand Objec7ve: Wafer planarizing coahng for backside processing Mechanical (e.g. grind): No Thermal resistance: <300C Process/chemicals: Yes Uniformity: <5% Special: Desire to finish on FF tape Recommenda7on DaeCoat TM 357 Green solvent washable, DaeClean TM 300 Broad chemical resistance Thermal resistance: >300C Carrier: desire FF tape Safe for DaeClean TM SPCC Santa Clara California 14
15 Washable Planariza7on Coa7ng Sputtering Test Sputter deposition of 200nm Ti:W + 300nm Copper on 250µm thick PCA DaeCoat TM 357 using LLS802 multi target tool wafer with 100:1 mix ratio after sputtering wafer with 50:1 mix ratio after sputtering Chamber Capability: 24 x 4-6 wafers per batch 8 x 8 wafers per batch 4 x 300 mm wafers per batch 2016 SPCC Santa Clara California 15
16 Parameter CoaHng Thickness DaeCoat TM 355 DaeCoat TM 357 DaeCoat TM 515 DaeCoat TM 535 DaeCoat TM 615 <5-100 um <5-250 um <5-100 um <5-60 um <5-60 um Cure UV/Thermal UV/Thermal Thermal Thermal Thermal Max temp ~300C ~300C ~300C ~300C ~200C ApplicaHon Resists RT DIW* Resists Acids* Resists Litho Stripper Chemistries* Clean CondiHons Temp Bonding or CoaHng DaeClean TM 300 (Safe Solvent) Temp Planarizing CoaHng DaeClean TM 300 (Safe Solvent) Laser Processing RT DIW Temp Bonding or CoaHng 80C, DIW Temp Bonding or CoaHng DaeClean TM 150 (Detergent) 2016 SPCC Santa Clara California 16
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